HK1000971A1 - Photo-curable and thermosetting coating composition and method for formation of solder resist pattern - Google Patents
Photo-curable and thermosetting coating composition and method for formation of solder resist patternInfo
- Publication number
- HK1000971A1 HK1000971A1 HK97102596A HK97102596A HK1000971A1 HK 1000971 A1 HK1000971 A1 HK 1000971A1 HK 97102596 A HK97102596 A HK 97102596A HK 97102596 A HK97102596 A HK 97102596A HK 1000971 A1 HK1000971 A1 HK 1000971A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- curable
- photo
- formation
- coating composition
- resist pattern
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16998592A JPH05343837A (ja) | 1992-06-05 | 1992-06-05 | ソルダーレジストインキ組成物及びソルダーレジストパターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1000971A1 true HK1000971A1 (en) | 1998-05-15 |
Family
ID=15896463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK97102596A HK1000971A1 (en) | 1992-06-05 | 1997-12-23 | Photo-curable and thermosetting coating composition and method for formation of solder resist pattern |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0573053B1 (ja) |
JP (1) | JPH05343837A (ja) |
DE (1) | DE69300657T2 (ja) |
HK (1) | HK1000971A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5847022A (en) * | 1995-03-27 | 1998-12-08 | Dainippon Ink And Chemicals, Inc. | Radiation curable resin composition and method therefor |
US6713587B2 (en) | 2001-03-08 | 2004-03-30 | Ppg Industries Ohio, Inc. | Electrodepositable dielectric coating compositions and methods related thereto |
US7000313B2 (en) | 2001-03-08 | 2006-02-21 | Ppg Industries Ohio, Inc. | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
US6951707B2 (en) | 2001-03-08 | 2005-10-04 | Ppg Industries Ohio, Inc. | Process for creating vias for circuit assemblies |
JP3944027B2 (ja) * | 2001-11-16 | 2007-07-11 | 三井金属鉱業株式会社 | フレキシブルプリント配線板の製造方法及びその製造方法で得られたフレキシブルプリント配線板 |
US6824959B2 (en) | 2002-06-27 | 2004-11-30 | Ppg Industries Ohio, Inc. | Process for creating holes in polymeric substrates |
JP2005531160A (ja) | 2002-06-27 | 2005-10-13 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 窪んだかまたは広がったブレイクアウェイタブを有する単層または多層のプリント回路基板およびその製造方法 |
JP2017003911A (ja) * | 2015-06-15 | 2017-01-05 | 株式会社ムラカミ | 感光性樹脂組成物、感光性フィルム、スクリーン印刷用版材および感光性レジストフィルム |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0717737B2 (ja) * | 1987-11-30 | 1995-03-01 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法 |
GB2213487B (en) * | 1987-12-08 | 1992-01-08 | Kansai Paint Co Ltd | Method of forming a cured coating film |
EP0469537B1 (en) * | 1990-08-02 | 1998-12-30 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition |
-
1992
- 1992-06-05 JP JP16998592A patent/JPH05343837A/ja not_active Withdrawn
-
1993
- 1993-06-04 DE DE1993600657 patent/DE69300657T2/de not_active Expired - Fee Related
- 1993-06-04 EP EP19930108973 patent/EP0573053B1/en not_active Expired - Lifetime
-
1997
- 1997-12-23 HK HK97102596A patent/HK1000971A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0573053A1 (en) | 1993-12-08 |
EP0573053B1 (en) | 1995-10-18 |
JPH05343837A (ja) | 1993-12-24 |
DE69300657T2 (de) | 1996-03-21 |
DE69300657D1 (de) | 1995-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090604 |