GR3002729T3 - Imide type prepolymer compositions and processes for preparing same - Google Patents
Imide type prepolymer compositions and processes for preparing sameInfo
- Publication number
- GR3002729T3 GR3002729T3 GR91401344T GR910401344T GR3002729T3 GR 3002729 T3 GR3002729 T3 GR 3002729T3 GR 91401344 T GR91401344 T GR 91401344T GR 910401344 T GR910401344 T GR 910401344T GR 3002729 T3 GR3002729 T3 GR 3002729T3
- Authority
- GR
- Greece
- Prior art keywords
- processes
- preparing same
- imide type
- prepolymer compositions
- type prepolymer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62310598A JP2667415B2 (ja) | 1987-12-08 | 1987-12-08 | イミドプレポリマーの製造方法 |
JP62310597A JPH01152125A (ja) | 1987-12-08 | 1987-12-08 | イミド系プレポリマー組成物およびその製造方法 |
JP62310599A JPH01152127A (ja) | 1987-12-08 | 1987-12-08 | イミド系プレポリマー組成物およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
GR3002729T3 true GR3002729T3 (en) | 1993-01-25 |
Family
ID=27339114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GR91401344T GR3002729T3 (en) | 1987-12-08 | 1991-09-16 | Imide type prepolymer compositions and processes for preparing same |
Country Status (7)
Country | Link |
---|---|
US (1) | US4987214A (el) |
EP (1) | EP0320238B1 (el) |
KR (1) | KR920002705B1 (el) |
CA (1) | CA1338935C (el) |
DE (1) | DE3863535D1 (el) |
ES (1) | ES2023495B3 (el) |
GR (1) | GR3002729T3 (el) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
JP4190847B2 (ja) * | 2001-11-06 | 2008-12-03 | 三井化学株式会社 | 安定化されたアミド類 |
JP5165829B2 (ja) * | 2004-02-26 | 2013-03-21 | 日東電工株式会社 | ロール状ウエハ加工用粘着シート |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1597952A (el) * | 1968-12-19 | 1970-06-29 | ||
US3878172A (en) * | 1968-12-19 | 1975-04-15 | Rhone Poulenc Sa | Process for preparing heat resistant resin from unsaturated bis-imide and diamine |
NL7114237A (el) * | 1970-10-23 | 1972-04-25 | ||
US4454283A (en) * | 1981-03-30 | 1984-06-12 | Hitco | Bis-maleimide resin with inhibitor |
FR2589869B1 (fr) * | 1985-11-13 | 1988-01-08 | Rhone Poulenc Spec Chim | Polymeres a groupements imides et procede de preparation |
-
1988
- 1988-12-07 DE DE8888311591T patent/DE3863535D1/de not_active Expired - Fee Related
- 1988-12-07 ES ES88311591T patent/ES2023495B3/es not_active Expired - Lifetime
- 1988-12-07 EP EP88311591A patent/EP0320238B1/en not_active Expired - Lifetime
- 1988-12-07 CA CA000585217A patent/CA1338935C/en not_active Expired - Fee Related
- 1988-12-07 KR KR1019880016258A patent/KR920002705B1/ko not_active IP Right Cessation
-
1990
- 1990-03-20 US US07/495,581 patent/US4987214A/en not_active Expired - Lifetime
-
1991
- 1991-09-16 GR GR91401344T patent/GR3002729T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
US4987214A (en) | 1991-01-22 |
KR920002705B1 (ko) | 1992-03-31 |
KR890010037A (ko) | 1989-08-05 |
ES2023495B3 (es) | 1992-01-16 |
DE3863535D1 (de) | 1991-08-08 |
CA1338935C (en) | 1997-02-25 |
EP0320238B1 (en) | 1991-07-03 |
EP0320238A1 (en) | 1989-06-14 |
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