GB994031A - Improvements in or relating to electrical circuits - Google Patents

Improvements in or relating to electrical circuits

Info

Publication number
GB994031A
GB994031A GB3353262A GB3353262A GB994031A GB 994031 A GB994031 A GB 994031A GB 3353262 A GB3353262 A GB 3353262A GB 3353262 A GB3353262 A GB 3353262A GB 994031 A GB994031 A GB 994031A
Authority
GB
United Kingdom
Prior art keywords
forms
drilled
holes
tags
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3353262A
Inventor
Hector Thomas Prior
John Albert Leno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB3353262A priority Critical patent/GB994031A/en
Priority to FR945333A priority patent/FR84510E/en
Priority to DE19631465709 priority patent/DE1465709A1/en
Priority to FR959915A priority patent/FR85079E/en
Priority to FR9527A priority patent/FR87816E/en
Publication of GB994031A publication Critical patent/GB994031A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005Punching of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

994,031. Making electrical conductor assemblies. STANDARD TELEPHONES & CABLES Ltd. Aug. 30, 1963 [Aug. 31, 1962], No. 33532/62. Addition to 993,983. Heading B3A. [Also in Division H1.] In an electrical conductor assembly, one or more layers of metal wire or strip, formed to a predetermined standard pattern, is/are embedded in insulating material to form an insulating member having one or more layers of conductive tags projecting from one or both of its longer edges; and holes are drilled, manually or by a programme controlled drilling machine, into the insulating material and through at least one metal layer to separate each such layer into electrically separate parts to provide a desired pattern. In Fig. 2, two conductor forms 7, 8, which may be grids formed by welding, or punched plain strips, are encapsulated in an insulating strip, holes being drilled where shown to provide a desired pattern of interconnections. Interconnection between separate conductive layers is provided in the embodiment shown in Figs. 3, 4, in which the tag portions on two conductive forms are connected and a border, which may be drilled as required, joins the tags on each side. Circular forms may be used; Fig. 8 shows an annulus of brass or copper in which holes 31, 32 have been punched. The inner and outer regions 34, 33 are removed and a plurality of mutually insulated forms are encapsulated in a grooved and castellated ring of insulating material, or, by moulding or casting, in a plastics material. Fig. 12 shows one of two such conductor assemblies, between which are connected modular units which may be of the type described in Specification 931,570, and may be of keystone configuration, as at 46. Semi-circular and other arcuate forms may also be employed; the semi-circular layout of a transistorized bi-stable circuit is depicted in Fig. 7 (not shown). Where blind holes are drilled to sever one of a plurality of conductive layers, the hole may be filled with insulation. Tags not used electrically may be retained for use as mechanical anchors. Complete assemblies of conductors and modules may be totally encapsulated.
GB3353262A 1961-05-08 1962-08-31 Improvements in or relating to electrical circuits Expired GB994031A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB3353262A GB994031A (en) 1962-08-31 1962-08-31 Improvements in or relating to electrical circuits
FR945333A FR84510E (en) 1961-05-08 1963-08-22 Construction of electrical circuits
DE19631465709 DE1465709A1 (en) 1962-08-31 1963-08-23 Printed circuit board and process for its manufacture
FR959915A FR85079E (en) 1961-05-08 1964-01-10 Construction of electrical circuits
FR9527A FR87816E (en) 1961-05-08 1965-03-17 Construction of electrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3353262A GB994031A (en) 1962-08-31 1962-08-31 Improvements in or relating to electrical circuits

Publications (1)

Publication Number Publication Date
GB994031A true GB994031A (en) 1965-06-02

Family

ID=10354176

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3353262A Expired GB994031A (en) 1961-05-08 1962-08-31 Improvements in or relating to electrical circuits

Country Status (2)

Country Link
DE (1) DE1465709A1 (en)
GB (1) GB994031A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3225304A (en) * 1963-08-22 1965-12-21 William J Richards Constant output amplifier including light responsive feedback means
EP1653787A1 (en) * 2004-11-02 2006-05-03 Koyo Seiko Co., Ltd. Wiring board and manufacturing method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3225304A (en) * 1963-08-22 1965-12-21 William J Richards Constant output amplifier including light responsive feedback means
EP1653787A1 (en) * 2004-11-02 2006-05-03 Koyo Seiko Co., Ltd. Wiring board and manufacturing method therefor
US7516542B2 (en) 2004-11-02 2009-04-14 Jtekt Corporation Wiring board and manufacturing method therefor

Also Published As

Publication number Publication date
DE1465709A1 (en) 1969-05-22

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