GB994031A - Improvements in or relating to electrical circuits - Google Patents
Improvements in or relating to electrical circuitsInfo
- Publication number
- GB994031A GB994031A GB3353262A GB3353262A GB994031A GB 994031 A GB994031 A GB 994031A GB 3353262 A GB3353262 A GB 3353262A GB 3353262 A GB3353262 A GB 3353262A GB 994031 A GB994031 A GB 994031A
- Authority
- GB
- United Kingdom
- Prior art keywords
- forms
- drilled
- holes
- tags
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Structure Of Printed Boards (AREA)
Abstract
994,031. Making electrical conductor assemblies. STANDARD TELEPHONES & CABLES Ltd. Aug. 30, 1963 [Aug. 31, 1962], No. 33532/62. Addition to 993,983. Heading B3A. [Also in Division H1.] In an electrical conductor assembly, one or more layers of metal wire or strip, formed to a predetermined standard pattern, is/are embedded in insulating material to form an insulating member having one or more layers of conductive tags projecting from one or both of its longer edges; and holes are drilled, manually or by a programme controlled drilling machine, into the insulating material and through at least one metal layer to separate each such layer into electrically separate parts to provide a desired pattern. In Fig. 2, two conductor forms 7, 8, which may be grids formed by welding, or punched plain strips, are encapsulated in an insulating strip, holes being drilled where shown to provide a desired pattern of interconnections. Interconnection between separate conductive layers is provided in the embodiment shown in Figs. 3, 4, in which the tag portions on two conductive forms are connected and a border, which may be drilled as required, joins the tags on each side. Circular forms may be used; Fig. 8 shows an annulus of brass or copper in which holes 31, 32 have been punched. The inner and outer regions 34, 33 are removed and a plurality of mutually insulated forms are encapsulated in a grooved and castellated ring of insulating material, or, by moulding or casting, in a plastics material. Fig. 12 shows one of two such conductor assemblies, between which are connected modular units which may be of the type described in Specification 931,570, and may be of keystone configuration, as at 46. Semi-circular and other arcuate forms may also be employed; the semi-circular layout of a transistorized bi-stable circuit is depicted in Fig. 7 (not shown). Where blind holes are drilled to sever one of a plurality of conductive layers, the hole may be filled with insulation. Tags not used electrically may be retained for use as mechanical anchors. Complete assemblies of conductors and modules may be totally encapsulated.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3353262A GB994031A (en) | 1962-08-31 | 1962-08-31 | Improvements in or relating to electrical circuits |
FR945333A FR84510E (en) | 1961-05-08 | 1963-08-22 | Construction of electrical circuits |
DE19631465709 DE1465709A1 (en) | 1962-08-31 | 1963-08-23 | Printed circuit board and process for its manufacture |
FR959915A FR85079E (en) | 1961-05-08 | 1964-01-10 | Construction of electrical circuits |
FR9527A FR87816E (en) | 1961-05-08 | 1965-03-17 | Construction of electrical circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB3353262A GB994031A (en) | 1962-08-31 | 1962-08-31 | Improvements in or relating to electrical circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB994031A true GB994031A (en) | 1965-06-02 |
Family
ID=10354176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3353262A Expired GB994031A (en) | 1961-05-08 | 1962-08-31 | Improvements in or relating to electrical circuits |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1465709A1 (en) |
GB (1) | GB994031A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3225304A (en) * | 1963-08-22 | 1965-12-21 | William J Richards | Constant output amplifier including light responsive feedback means |
EP1653787A1 (en) * | 2004-11-02 | 2006-05-03 | Koyo Seiko Co., Ltd. | Wiring board and manufacturing method therefor |
-
1962
- 1962-08-31 GB GB3353262A patent/GB994031A/en not_active Expired
-
1963
- 1963-08-23 DE DE19631465709 patent/DE1465709A1/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3225304A (en) * | 1963-08-22 | 1965-12-21 | William J Richards | Constant output amplifier including light responsive feedback means |
EP1653787A1 (en) * | 2004-11-02 | 2006-05-03 | Koyo Seiko Co., Ltd. | Wiring board and manufacturing method therefor |
US7516542B2 (en) | 2004-11-02 | 2009-04-14 | Jtekt Corporation | Wiring board and manufacturing method therefor |
Also Published As
Publication number | Publication date |
---|---|
DE1465709A1 (en) | 1969-05-22 |
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