GB993983A - Improvements in or relating to conductor assemblies for electrical apparatus - Google Patents
Improvements in or relating to conductor assemblies for electrical apparatusInfo
- Publication number
- GB993983A GB993983A GB4085861A GB4085861A GB993983A GB 993983 A GB993983 A GB 993983A GB 4085861 A GB4085861 A GB 4085861A GB 4085861 A GB4085861 A GB 4085861A GB 993983 A GB993983 A GB 993983A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductor
- tags
- assembly
- arms
- assemblies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Abstract
993,983. Making electrical conductor assemblies. STANDARD TELEPHONES & CABLES Ltd. Nov. 9, 1962 [Nov. 15, 1961], No. 40858/61. Heading B3A. [Also in Division H1] In an assembly of electrical conductors, a plurality of conductors are embedded in a rectangular block of insulating material, the conductors running parallel to the length of the block, each conductor being formed integral with at least two tags which extend laterally from the conductor and project from the block. As shown, Fig. 1, a brass strip 10 is stamped into a stock strip 11 comprising a central spine 13, arms 14, and borders 15, which is punched manually or automatically by triple punch 17 into a desired conductor form 16, which is tinned. A strip of insulation is secured to the central area of conductor form 16; a plurality of conductor forms are stacked so that no two arms in different layers lie on the same transverse line; the central part of the assembly is encapsulated in an insulating material 75, Fig. 13; the borders 15 are removed and the side arms are cropped to provide connecting tags 76 of desired lengths. To avoid capacitive coupling between the spines of stacked layers, the spins 35 may be mutually off-set as shown in Fig. 6 (b); a thinner assembly is obtained by shaping the conductor forms as shown in Fig. 8(b), so that all the spines lie in the same plane and the tags at each side lie in common but different planes. When the number of layers is great, the arms may be bent normal to the plane of the spine, as in Fig. 5, so that the tags still emerge from the narrower sides of the assembly. The embodiment shown in Fig. 9 (b) is made from a stock strip 11, Fig. 1, having the borders 15 and selected arms 14 removed; the remaining arms 59 are bent normal to the spine 58 and passed through apertures 61 in an insulating plate 60; then the arms are again bent to lie along the plate. A plurality of conductor forms may be mounted on the same plate with their spines laterally spaced, and the assembly is strengthened by further insulation, preferably by encapsulation. In a modification, Fig. 10(b), similar conductor forms are provided with a central strip of insulation 63 and cranked as shown, then assembled side by side and encapsulated. Embodiments in which the tags emerge in staggered rows may be encased in a two-part casing 71, Fig. 12, the tags being led through slots in the mating faces of the case and held in the same plane; the assembly may then be potted with insulating material 74. Fig. 17 shows a 2-stage transistor amplifier assembly in which the components 81 are disposed between two conductor assemblies 78, 80, the terminals of the components being connected to the tags of the conductor assemblies, which may be rolled, apertured or grooved to facilitate soldering. To reduce bending of wire terminals, the width of the encapsulated part of the conductor assemblies may be reduced as shown in Fig. 19. A plurality of circuit assemblies of the sort shown in Fig. 17 may be interconnected by having their terminal tags I ... IV plugged into holes in an insulating board carrying printed connective circuitry, or by a further conductor assembly alongside and overlapping adjacent circuit assemblies. Figs. 7, 11 (not shown) depict alternative forms of stock strip from which conductor forms may be made.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE624867D BE624867A (en) | 1961-11-15 | ||
GB4085861A GB993983A (en) | 1961-11-15 | 1961-11-15 | Improvements in or relating to conductor assemblies for electrical apparatus |
DE19621515870 DE1515870A1 (en) | 1961-11-15 | 1962-11-15 | Electrical conductor arrangement and method for their manufacture |
FR915428A FR82862E (en) | 1961-05-08 | 1962-11-15 | Construction of electrical circuits |
FR945333A FR84510E (en) | 1961-05-08 | 1963-08-22 | Construction of electrical circuits |
FR959915A FR85079E (en) | 1961-05-08 | 1964-01-10 | Construction of electrical circuits |
FR9527A FR87816E (en) | 1961-05-08 | 1965-03-17 | Construction of electrical circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB4085861A GB993983A (en) | 1961-11-15 | 1961-11-15 | Improvements in or relating to conductor assemblies for electrical apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
GB993983A true GB993983A (en) | 1965-06-02 |
Family
ID=10416962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4085861A Expired GB993983A (en) | 1961-05-08 | 1961-11-15 | Improvements in or relating to conductor assemblies for electrical apparatus |
Country Status (3)
Country | Link |
---|---|
BE (1) | BE624867A (en) |
DE (1) | DE1515870A1 (en) |
GB (1) | GB993983A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1690028B1 (en) * | 1967-08-11 | 1972-12-07 | Siemens Ag | ANGLE PLUG FOR HEIGHT-SAVING CONNECTION OF COMPONENTS TO CIRCUIT BOARDS |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2942173A1 (en) * | 1979-10-18 | 1981-04-30 | Robert Bosch Gmbh, 7000 Stuttgart | CONNECTOR ARRANGEMENT |
DE3810963C2 (en) * | 1988-03-31 | 1995-11-23 | Schunk Motorensysteme | Grid made of electrically conductive sheet material and method for producing a grid |
DE4102349C2 (en) * | 1991-01-26 | 2000-11-23 | Teves Gmbh Alfred | Control device for circuit monitoring |
DE4405919A1 (en) * | 1994-02-24 | 1995-08-31 | Teves Gmbh Alfred | Electric component |
DE102014224041A1 (en) * | 2014-11-25 | 2016-06-09 | Zf Friedrichshafen Ag | Contacting device, method for producing a contacting device and electric motor system |
-
0
- BE BE624867D patent/BE624867A/xx unknown
-
1961
- 1961-11-15 GB GB4085861A patent/GB993983A/en not_active Expired
-
1962
- 1962-11-15 DE DE19621515870 patent/DE1515870A1/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1690028B1 (en) * | 1967-08-11 | 1972-12-07 | Siemens Ag | ANGLE PLUG FOR HEIGHT-SAVING CONNECTION OF COMPONENTS TO CIRCUIT BOARDS |
Also Published As
Publication number | Publication date |
---|---|
DE1515870A1 (en) | 1969-06-12 |
BE624867A (en) |
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