GB993983A - Improvements in or relating to conductor assemblies for electrical apparatus - Google Patents

Improvements in or relating to conductor assemblies for electrical apparatus

Info

Publication number
GB993983A
GB993983A GB4085861A GB4085861A GB993983A GB 993983 A GB993983 A GB 993983A GB 4085861 A GB4085861 A GB 4085861A GB 4085861 A GB4085861 A GB 4085861A GB 993983 A GB993983 A GB 993983A
Authority
GB
United Kingdom
Prior art keywords
conductor
tags
assembly
arms
assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4085861A
Inventor
Hector Thomas Prior
John Albert Leno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE624867D priority Critical patent/BE624867A/xx
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB4085861A priority patent/GB993983A/en
Priority to DE19621515870 priority patent/DE1515870A1/en
Priority to FR915428A priority patent/FR82862E/en
Priority to FR945333A priority patent/FR84510E/en
Priority to FR959915A priority patent/FR85079E/en
Priority to FR9527A priority patent/FR87816E/en
Publication of GB993983A publication Critical patent/GB993983A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49537Plurality of lead frames mounted in one device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • H01L23/49555Cross section geometry characterised by bent parts the bent parts being the outer leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

993,983. Making electrical conductor assemblies. STANDARD TELEPHONES & CABLES Ltd. Nov. 9, 1962 [Nov. 15, 1961], No. 40858/61. Heading B3A. [Also in Division H1] In an assembly of electrical conductors, a plurality of conductors are embedded in a rectangular block of insulating material, the conductors running parallel to the length of the block, each conductor being formed integral with at least two tags which extend laterally from the conductor and project from the block. As shown, Fig. 1, a brass strip 10 is stamped into a stock strip 11 comprising a central spine 13, arms 14, and borders 15, which is punched manually or automatically by triple punch 17 into a desired conductor form 16, which is tinned. A strip of insulation is secured to the central area of conductor form 16; a plurality of conductor forms are stacked so that no two arms in different layers lie on the same transverse line; the central part of the assembly is encapsulated in an insulating material 75, Fig. 13; the borders 15 are removed and the side arms are cropped to provide connecting tags 76 of desired lengths. To avoid capacitive coupling between the spines of stacked layers, the spins 35 may be mutually off-set as shown in Fig. 6 (b); a thinner assembly is obtained by shaping the conductor forms as shown in Fig. 8(b), so that all the spines lie in the same plane and the tags at each side lie in common but different planes. When the number of layers is great, the arms may be bent normal to the plane of the spine, as in Fig. 5, so that the tags still emerge from the narrower sides of the assembly. The embodiment shown in Fig. 9 (b) is made from a stock strip 11, Fig. 1, having the borders 15 and selected arms 14 removed; the remaining arms 59 are bent normal to the spine 58 and passed through apertures 61 in an insulating plate 60; then the arms are again bent to lie along the plate. A plurality of conductor forms may be mounted on the same plate with their spines laterally spaced, and the assembly is strengthened by further insulation, preferably by encapsulation. In a modification, Fig. 10(b), similar conductor forms are provided with a central strip of insulation 63 and cranked as shown, then assembled side by side and encapsulated. Embodiments in which the tags emerge in staggered rows may be encased in a two-part casing 71, Fig. 12, the tags being led through slots in the mating faces of the case and held in the same plane; the assembly may then be potted with insulating material 74. Fig. 17 shows a 2-stage transistor amplifier assembly in which the components 81 are disposed between two conductor assemblies 78, 80, the terminals of the components being connected to the tags of the conductor assemblies, which may be rolled, apertured or grooved to facilitate soldering. To reduce bending of wire terminals, the width of the encapsulated part of the conductor assemblies may be reduced as shown in Fig. 19. A plurality of circuit assemblies of the sort shown in Fig. 17 may be interconnected by having their terminal tags I ... IV plugged into holes in an insulating board carrying printed connective circuitry, or by a further conductor assembly alongside and overlapping adjacent circuit assemblies. Figs. 7, 11 (not shown) depict alternative forms of stock strip from which conductor forms may be made.
GB4085861A 1961-05-08 1961-11-15 Improvements in or relating to conductor assemblies for electrical apparatus Expired GB993983A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
BE624867D BE624867A (en) 1961-11-15
GB4085861A GB993983A (en) 1961-11-15 1961-11-15 Improvements in or relating to conductor assemblies for electrical apparatus
DE19621515870 DE1515870A1 (en) 1961-11-15 1962-11-15 Electrical conductor arrangement and method for their manufacture
FR915428A FR82862E (en) 1961-05-08 1962-11-15 Construction of electrical circuits
FR945333A FR84510E (en) 1961-05-08 1963-08-22 Construction of electrical circuits
FR959915A FR85079E (en) 1961-05-08 1964-01-10 Construction of electrical circuits
FR9527A FR87816E (en) 1961-05-08 1965-03-17 Construction of electrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4085861A GB993983A (en) 1961-11-15 1961-11-15 Improvements in or relating to conductor assemblies for electrical apparatus

Publications (1)

Publication Number Publication Date
GB993983A true GB993983A (en) 1965-06-02

Family

ID=10416962

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4085861A Expired GB993983A (en) 1961-05-08 1961-11-15 Improvements in or relating to conductor assemblies for electrical apparatus

Country Status (3)

Country Link
BE (1) BE624867A (en)
DE (1) DE1515870A1 (en)
GB (1) GB993983A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1690028B1 (en) * 1967-08-11 1972-12-07 Siemens Ag ANGLE PLUG FOR HEIGHT-SAVING CONNECTION OF COMPONENTS TO CIRCUIT BOARDS

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942173A1 (en) * 1979-10-18 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart CONNECTOR ARRANGEMENT
DE3810963C2 (en) * 1988-03-31 1995-11-23 Schunk Motorensysteme Grid made of electrically conductive sheet material and method for producing a grid
DE4102349C2 (en) * 1991-01-26 2000-11-23 Teves Gmbh Alfred Control device for circuit monitoring
DE4405919A1 (en) * 1994-02-24 1995-08-31 Teves Gmbh Alfred Electric component
DE102014224041A1 (en) * 2014-11-25 2016-06-09 Zf Friedrichshafen Ag Contacting device, method for producing a contacting device and electric motor system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1690028B1 (en) * 1967-08-11 1972-12-07 Siemens Ag ANGLE PLUG FOR HEIGHT-SAVING CONNECTION OF COMPONENTS TO CIRCUIT BOARDS

Also Published As

Publication number Publication date
DE1515870A1 (en) 1969-06-12
BE624867A (en)

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