GB987771A - Improvements in or relating to semiconductor rectifier devices - Google Patents
Improvements in or relating to semiconductor rectifier devicesInfo
- Publication number
- GB987771A GB987771A GB1823062A GB1823062A GB987771A GB 987771 A GB987771 A GB 987771A GB 1823062 A GB1823062 A GB 1823062A GB 1823062 A GB1823062 A GB 1823062A GB 987771 A GB987771 A GB 987771A
- Authority
- GB
- United Kingdom
- Prior art keywords
- rectifiers
- stack
- rectifier
- planar portion
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
987,771. Semi-conductor rectifiers. GENERAL ELECTRIC CO. Ltd. May 7, 1963 [May 11, 1962], No. 18230/62. Heading H1K. A semi-conductor rectifier is mounted in an aperture in, and is in good thermal contact with, a first planar portion of a metal cooling fin structure, and has one of its terminals connected to the structure, the structure further including two members which extend from the first planar portion and are shaped to provide, within the lengths of the rectifier, two further planar portions parallel to the first planar portion which serve as cooling fins. In the embodiment (Fig. 3) silicon controlled rectifiers 25 are each disposed in an aperture common to two aluminium plates 26. The pairs of plates together with further single plates 28 and 33 are mounted on a common bolt 34 passing through the rectifier stack. The intermediate fins 33 and 28 serve to interconnect the rectifiers in the stack and the channel-shaped plate of each pair 26 serves to space the rectifiers apart, whilst still maintaining a reasonable density of cooling fins along the length of the stack.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1823062A GB987771A (en) | 1962-05-11 | 1962-05-11 | Improvements in or relating to semiconductor rectifier devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1823062A GB987771A (en) | 1962-05-11 | 1962-05-11 | Improvements in or relating to semiconductor rectifier devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB987771A true GB987771A (en) | 1965-03-31 |
Family
ID=10108887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1823062A Expired GB987771A (en) | 1962-05-11 | 1962-05-11 | Improvements in or relating to semiconductor rectifier devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB987771A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2043411A5 (en) * | 1969-04-17 | 1971-02-12 | Lucas Industries Ltd |
-
1962
- 1962-05-11 GB GB1823062A patent/GB987771A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2043411A5 (en) * | 1969-04-17 | 1971-02-12 | Lucas Industries Ltd |
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