GB964665A - Method of continuously regenerating etching solutions containing copper - Google Patents

Method of continuously regenerating etching solutions containing copper

Info

Publication number
GB964665A
GB964665A GB2727063A GB2727063A GB964665A GB 964665 A GB964665 A GB 964665A GB 2727063 A GB2727063 A GB 2727063A GB 2727063 A GB2727063 A GB 2727063A GB 964665 A GB964665 A GB 964665A
Authority
GB
United Kingdom
Prior art keywords
etching
hydrochloric acid
ammonium chloride
solutions containing
containing copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2727063A
Other languages
English (en)
Inventor
Werner Thurmel
Eftimios Konstantouros
Rudolf Voh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE637888D priority Critical patent/BE637888A/xx
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Priority to GB2727063A priority patent/GB964665A/en
Priority to FR944996A priority patent/FR1367203A/fr
Publication of GB964665A publication Critical patent/GB964665A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
GB2727063A 1963-07-10 1963-07-10 Method of continuously regenerating etching solutions containing copper Expired GB964665A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
BE637888D BE637888A (enrdf_load_stackoverflow) 1963-07-10
GB2727063A GB964665A (en) 1963-07-10 1963-07-10 Method of continuously regenerating etching solutions containing copper
FR944996A FR1367203A (fr) 1963-07-10 1963-08-19 Procédé de régénération pour solutions caustiques contenant du cuivre, utilisées en particulier dans la fabrication de circuits imprimés et dispositif pour sa mise en oeuvre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2727063A GB964665A (en) 1963-07-10 1963-07-10 Method of continuously regenerating etching solutions containing copper

Publications (1)

Publication Number Publication Date
GB964665A true GB964665A (en) 1964-07-22

Family

ID=10256855

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2727063A Expired GB964665A (en) 1963-07-10 1963-07-10 Method of continuously regenerating etching solutions containing copper

Country Status (2)

Country Link
BE (1) BE637888A (enrdf_load_stackoverflow)
GB (1) GB964665A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100443635C (zh) * 2006-08-18 2008-12-17 丁四宜 电子线路板覆膜铜的蚀刻方法
CN100443636C (zh) * 2006-08-18 2008-12-17 丁四宜 氯化铵蚀刻液的充氧装置
CN115287659A (zh) * 2022-08-04 2022-11-04 深圳天华机器设备有限公司 一种蚀刻药水再生装置及再生工艺

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100443635C (zh) * 2006-08-18 2008-12-17 丁四宜 电子线路板覆膜铜的蚀刻方法
CN100443636C (zh) * 2006-08-18 2008-12-17 丁四宜 氯化铵蚀刻液的充氧装置
CN115287659A (zh) * 2022-08-04 2022-11-04 深圳天华机器设备有限公司 一种蚀刻药水再生装置及再生工艺
CN115287659B (zh) * 2022-08-04 2024-03-29 深圳天华机器设备股份有限公司 一种蚀刻药水再生装置及再生工艺

Also Published As

Publication number Publication date
BE637888A (enrdf_load_stackoverflow)

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