GB963846A - Manufacture of semi-conductor devices - Google Patents
Manufacture of semi-conductor devicesInfo
- Publication number
- GB963846A GB963846A GB432961A GB432961A GB963846A GB 963846 A GB963846 A GB 963846A GB 432961 A GB432961 A GB 432961A GB 432961 A GB432961 A GB 432961A GB 963846 A GB963846 A GB 963846A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- jet
- conductor devices
- junction
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 238000005406 washing Methods 0.000 abstract 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000008096 xylene Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
963,846. Semi-conductor devices. WESTING- HOUSE BRAKE & SIGNAL CO. Ltd. Jan. 9, 1962 [Feb. 6, 1961], No. 4329/61. Heading H1K. The surface of the junction in a germanium or silicon semi-conductor device is etched by rotating the device (at 200 revs./min.) and directing a jet of etchant, e.g. 3 parts HNO 3 and one part HF, at the surface, immediately after which the surface is washed by flooding it with deionized water. The etching may last for one minute, and the washing process which begins one second before etching finishes may continue for a further minute. A jet of acetone is directed at the junction one second before completion of washing and this is followed after 15 seconds by a jet of xylene. The device may then be coated with a silicone resin.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB432961A GB963846A (en) | 1961-02-06 | 1961-02-06 | Manufacture of semi-conductor devices |
FR886937A FR1313611A (en) | 1961-02-06 | 1962-02-05 | Method of manufacturing an asymmetric conductivity device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB432961A GB963846A (en) | 1961-02-06 | 1961-02-06 | Manufacture of semi-conductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB963846A true GB963846A (en) | 1964-07-15 |
Family
ID=9775114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB432961A Expired GB963846A (en) | 1961-02-06 | 1961-02-06 | Manufacture of semi-conductor devices |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB963846A (en) |
-
1961
- 1961-02-06 GB GB432961A patent/GB963846A/en not_active Expired
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