GB963256A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB963256A GB963256A GB26916/60A GB2691660A GB963256A GB 963256 A GB963256 A GB 963256A GB 26916/60 A GB26916/60 A GB 26916/60A GB 2691660 A GB2691660 A GB 2691660A GB 963256 A GB963256 A GB 963256A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- indium
- semi
- diode
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
- H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/107—Melt
Landscapes
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US833031A US2972092A (en) | 1959-08-11 | 1959-08-11 | Semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB963256A true GB963256A (en) | 1964-07-08 |
Family
ID=25263235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB26916/60A Expired GB963256A (en) | 1959-08-11 | 1960-08-03 | Semiconductor devices |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US2972092A (enExample) |
| DE (1) | DE1151323B (enExample) |
| FR (1) | FR1262976A (enExample) |
| GB (1) | GB963256A (enExample) |
| NL (2) | NL131156C (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL231410A (enExample) * | 1958-09-16 | |||
| US3197839A (en) * | 1959-12-11 | 1965-08-03 | Gen Electric | Method of fabricating semiconductor devices |
| US3196325A (en) * | 1960-02-16 | 1965-07-20 | Microwave Ass | Electrode connection to mesa type semiconductor device |
| US3160534A (en) * | 1960-10-03 | 1964-12-08 | Gen Telephone & Elect | Method of making tunnel diodes |
| NL125803C (enExample) * | 1961-01-16 | |||
| US3065391A (en) * | 1961-01-23 | 1962-11-20 | Gen Electric | Semiconductor devices |
| DE1180067C2 (de) * | 1961-03-17 | 1970-03-12 | Elektronik M B H | Verfahren zum gleichzeitigen Kontaktieren mehrerer Halbleiteranordnungen |
| US3249829A (en) * | 1962-05-18 | 1966-05-03 | Transitron Electronic Corp | Encapsulated diode assembly |
| US3296040A (en) * | 1962-08-17 | 1967-01-03 | Fairchild Camera Instr Co | Epitaxially growing layers of semiconductor through openings in oxide mask |
| US3357090A (en) * | 1963-05-23 | 1967-12-12 | Transitron Electronic Corp | Vibratory welding tip and method of welding |
| GB1053069A (enExample) * | 1963-06-28 | |||
| GB1070288A (en) * | 1963-07-08 | 1967-06-01 | Rca Corp | Semiconductor devices |
| DE1250004B (enExample) * | 1963-08-19 | |||
| US3289053A (en) * | 1963-12-26 | 1966-11-29 | Ibm | Thin film transistor |
| US3331995A (en) * | 1964-02-25 | 1967-07-18 | Hughes Aircraft Co | Housed semiconductor device with thermally matched elements |
| US3331125A (en) * | 1964-05-28 | 1967-07-18 | Rca Corp | Semiconductor device fabrication |
| DE1564530B1 (de) * | 1965-06-09 | 1971-05-06 | Rca Corp | Verfahren zur herstellung von gleichrichtersaeulen |
| US3424954A (en) * | 1966-09-21 | 1969-01-28 | Bell Telephone Labor Inc | Silicon oxide tunnel diode structure and method of making same |
| US3350293A (en) * | 1966-11-14 | 1967-10-31 | Components Inc | Passivating silicon semiconductor devices with sputtered tungsten oxide at low temperatures |
| US3534234A (en) * | 1966-12-15 | 1970-10-13 | Texas Instruments Inc | Modified planar process for making semiconductor devices having ultrafine mesa type geometry |
| US3496428A (en) * | 1968-04-11 | 1970-02-17 | Itt | Diffusion barrier for semiconductor contacts |
| US3670218A (en) * | 1971-08-02 | 1972-06-13 | North American Rockwell | Monolithic heteroepitaxial microwave tunnel die |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL153395B (nl) * | 1949-02-10 | Contraves Ag | Verbetering van een bistabiele trekkerschakeling. | |
| US2680220A (en) * | 1950-06-09 | 1954-06-01 | Int Standard Electric Corp | Crystal diode and triode |
| FR1075030A (fr) * | 1953-02-25 | 1954-10-12 | Csf | Perfectionnements aux redresseurs à semi-conducteurs |
| US2781480A (en) * | 1953-07-31 | 1957-02-12 | Rca Corp | Semiconductor rectifiers |
| DE1078194B (de) * | 1957-09-27 | 1960-03-24 | Siemens Ag | Elektrisches Bauelement mit dicht nebeneinanderliegenden Kontaktanschluessen |
| US2890395A (en) * | 1957-10-31 | 1959-06-09 | Jay W Lathrop | Semiconductor construction |
| US2911539A (en) * | 1957-12-18 | 1959-11-03 | Bell Telephone Labor Inc | Photocell array |
| DE1805708U (de) * | 1959-05-21 | 1960-02-11 | Telefunken Gmbh | Halbleiteranordnung. |
-
0
- NL NL254726D patent/NL254726A/xx unknown
- NL NL131156D patent/NL131156C/xx active
-
1959
- 1959-08-11 US US833031A patent/US2972092A/en not_active Expired - Lifetime
-
1960
- 1960-07-20 DE DER28370A patent/DE1151323B/de active Pending
- 1960-07-21 FR FR833559A patent/FR1262976A/fr not_active Expired
- 1960-08-03 GB GB26916/60A patent/GB963256A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL131156C (enExample) | |
| FR1262976A (fr) | 1961-06-05 |
| DE1151323B (de) | 1963-07-11 |
| NL254726A (enExample) | |
| US2972092A (en) | 1961-02-14 |
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