GB938365A - Method of making printed circuits - Google Patents

Method of making printed circuits

Info

Publication number
GB938365A
GB938365A GB2549759A GB2549759A GB938365A GB 938365 A GB938365 A GB 938365A GB 2549759 A GB2549759 A GB 2549759A GB 2549759 A GB2549759 A GB 2549759A GB 938365 A GB938365 A GB 938365A
Authority
GB
United Kingdom
Prior art keywords
metal
specifications
phenol
titanium
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2549759A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB938365A publication Critical patent/GB938365A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemically Coating (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
GB2549759A 1959-01-08 1959-07-24 Method of making printed circuits Expired GB938365A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78570359A 1959-01-08 1959-01-08

Publications (1)

Publication Number Publication Date
GB938365A true GB938365A (en) 1963-10-02

Family

ID=25136361

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2549759A Expired GB938365A (en) 1959-01-08 1959-07-24 Method of making printed circuits

Country Status (8)

Country Link
AT (1) AT238283B (de)
BE (1) BE586392A (de)
CH (1) CH381293A (de)
DE (1) DE1176731B (de)
DK (1) DK98445C (de)
ES (1) ES254803A1 (de)
FR (1) FR1237098A (de)
GB (1) GB938365A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
WO2014009927A2 (en) * 2012-07-12 2014-01-16 Intrinsiq Materials Ltd Composition for forming a seed layer
WO2020075152A3 (en) * 2018-10-11 2020-07-30 Shell Oil Company A composition and uses thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1665374B1 (de) * 1966-06-28 1971-09-09 Photocircuits Corp Basismaterial aus isolierstoff zum herstellen gedruckter leiterplatten
DE2131205C3 (de) * 1971-06-23 1981-07-30 International Electronic Research Corp., Burbank, Calif. Verfahren zur Herstellung einer gedruckten Schaltung mit einem Metallkern
FR2397469A1 (fr) * 1977-02-22 1979-02-09 Panoduz Anstalt Procede pour deposer une couche de metal conducteur sur un support isolant
GB2038101B (en) * 1978-12-19 1983-02-09 Standard Telephones Cables Ltd Printed circuits
WO1988002592A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impulstechnik Gmbh Electrically conductive structure with applied metallization
DE3733002A1 (de) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Additiv metallisierte elektrisch leitfaehige struktur
TW218430B (de) * 1992-01-30 1994-01-01 Motorola Inc
DE10241137B4 (de) * 2002-09-03 2008-05-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Metallisierung von Kunststoffen

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
WO2014009927A2 (en) * 2012-07-12 2014-01-16 Intrinsiq Materials Ltd Composition for forming a seed layer
WO2014009927A3 (en) * 2012-07-12 2014-03-20 Intrinsiq Materials Ltd Composition for forming a seed layer
EP2872670A2 (de) * 2012-07-12 2015-05-20 Intrinsiq Materials Limited UK Zusammensetzung zur bildung einer samenschicht
WO2020075152A3 (en) * 2018-10-11 2020-07-30 Shell Oil Company A composition and uses thereof

Also Published As

Publication number Publication date
DK98445C (da) 1964-04-13
ES254803A1 (es) 1960-05-01
BE586392A (fr) 1960-07-08
AT238283B (de) 1965-02-10
FR1237098A (fr) 1960-07-22
CH381293A (de) 1964-08-31
DE1176731B (de) 1964-08-27

Similar Documents

Publication Publication Date Title
US3625758A (en) Base material and method for the manufacture of printed circuits
US3226256A (en) Method of making printed circuits
US4622069A (en) Catalyst composition for forming electroless plating on ceramics
US3690921A (en) Method for strongly adhering a metal film on ceramic substrates
EP0092971B1 (de) Verfahren zum selektiven Abscheiden einer Nickel-Bor Schicht über einem metallurgischen Muster auf einem dielektrischen Substrat und auf diese Weise hergestellte Produkte
GB938365A (en) Method of making printed circuits
GB1095117A (en) Method of making printed circuit board
GB1376076A (en) Manufacture of electrical components
ES8200930A1 (es) Un procedimiento para obtener una capa adherente no electro-litica de metal sobre un sustrato vitreo o ceramico
US3296012A (en) Electroless copper plating on ceramic material
US3546011A (en) Process for the production of electricity conducting surfaces on a nonconducting support
US4150995A (en) Vitreous enamel composition containing palladium powder
US3399268A (en) Chemical metallization and products produced thereby
US4172733A (en) Vitreous enamel compositions
US4510179A (en) Electrode on heat-resisting and isolating substrate and the manufacturing process for it
US3135046A (en) Method of forming metallic films on glass
US2940018A (en) Printed electric circuits
JPH08144061A (ja) 絶縁体のメタライズ方法
US3928663A (en) Modified hectorite for electroless plating
US4559279A (en) Electrode on heat-resisting and isolating substrate
US4196029A (en) Process for depositing a conducting metal layer on an insulating support
GB1487227A (en) Method of manufacturing photosensitive material
JPS5992598A (ja) 電子部品搭載用セラミック基体
JPS5841933B2 (ja) 鉄鋼用連続鋳造鋳型
GB1160730A (en) Improvements in or relating to the Production of Printed Circuits