GB921367A - Semiconductor device and method of manufacture - Google Patents
Semiconductor device and method of manufactureInfo
- Publication number
- GB921367A GB921367A GB1159160A GB1159160A GB921367A GB 921367 A GB921367 A GB 921367A GB 1159160 A GB1159160 A GB 1159160A GB 1159160 A GB1159160 A GB 1159160A GB 921367 A GB921367 A GB 921367A
- Authority
- GB
- United Kingdom
- Prior art keywords
- junction
- sloping surface
- semi
- rectifier
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000004793 Polystyrene Substances 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000356 contaminant Substances 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 abstract 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 abstract 1
- 239000011368 organic material Substances 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229920005573 silicon-containing polymer Polymers 0.000 abstract 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 239000010937 tungsten Substances 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
921,367. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. April 1, 1960 [April 6, 1959], No. 11591/60. Class 37. A semi-conductor device having a PN or PIN junction has a sloping surface across the junction. Fig. 1 shows a semi-conductor device, which may be an alloyed or diffused junction type PN rectifier. The rectifier 8 has a sloping surface across the face 5 although only the region of the junction may be sloped. This bevelled edge may be produced by ultrasonic techniques or by saw cutting. The bevelled edge is etched to remove surface contaminants, is heated in a vacuum chamber to remove gaseous impurities and is finally coated with a non-porous layer 11 on the sloping surface. The Figure shows the process being carried out. Filament 12 of tungsten is coated with the material to be deposited on the sloping surface when the filament is heated. The coating material is a glass and may be of material taken from quartz, magnesium fluoride, silica and zirconium silicoted. Organic materials such as polystyrene and silicone polymers can be used. An arrangement is described (Fig. 3, not shown) in which a PIN diffused junction silicon rectifier the slope of the face of which to the horizontal is between one and five degrees. The Specification also refers to bevelling the junction area of transistors and to using germanium instea odf silicon.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80427859A | 1959-04-06 | 1959-04-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB921367A true GB921367A (en) | 1963-03-20 |
Family
ID=25188592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1159160A Expired GB921367A (en) | 1959-04-06 | 1960-04-01 | Semiconductor device and method of manufacture |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1137140B (en) |
GB (1) | GB921367A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3287182A (en) * | 1963-09-25 | 1966-11-22 | Licentia Gmbh | Semiconductor arrangement |
DE1292756B (en) * | 1964-04-25 | 1969-04-17 | Siemens Ag | Method for increasing the maximum reverse voltage of a planar pn transition area of a semiconductor component, which is at an angle deviating from 90 degrees |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4412242A (en) * | 1980-11-17 | 1983-10-25 | International Rectifier Corporation | Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE969464C (en) * | 1953-05-01 | 1958-06-04 | Philips Nv | Transistor with a semiconducting body, e.g. from germanium |
GB774388A (en) * | 1954-01-28 | 1957-05-08 | Marconi Wireless Telegraph Co | Improvements in or relating to semi-conducting amplifiers |
NL207969A (en) * | 1955-06-28 | |||
BE558436A (en) * | 1956-06-18 | |||
NL106110C (en) * | 1956-08-24 | |||
NL230243A (en) * | 1957-08-07 |
-
1960
- 1960-04-01 GB GB1159160A patent/GB921367A/en not_active Expired
- 1960-04-01 DE DEJ17916A patent/DE1137140B/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3287182A (en) * | 1963-09-25 | 1966-11-22 | Licentia Gmbh | Semiconductor arrangement |
DE1292756B (en) * | 1964-04-25 | 1969-04-17 | Siemens Ag | Method for increasing the maximum reverse voltage of a planar pn transition area of a semiconductor component, which is at an angle deviating from 90 degrees |
Also Published As
Publication number | Publication date |
---|---|
DE1137140B (en) | 1962-09-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1170016A (en) | Improvements in or relating to the manufacture of semiconductor components | |
GB1400313A (en) | Method of producing semiconductor device | |
GB921367A (en) | Semiconductor device and method of manufacture | |
GB968106A (en) | Improvements in or relating to semiconductor devices | |
TW430903B (en) | Silicon wafer, and method of manufacturing the same | |
GB1066911A (en) | Semiconductor devices | |
JPS577923A (en) | Manufacture of receiving table for processing single silicon crystal wafer | |
JPS56148863A (en) | Manufacture of semiconductor device | |
JPS6420663A (en) | Manufacture of semiconductor device | |
JPS5776860A (en) | Semiconductor device and its manufacture | |
GB1075555A (en) | Process for the formation of a layer of a semiconductor material on a crystalline base | |
GB1265037A (en) | ||
JPS5475273A (en) | Manufacture of semiconductor device | |
GB1260567A (en) | Improvements in or relating to semiconductor devices | |
JPS5544701A (en) | Manufacturing transistor | |
GB973104A (en) | Improvements relating to the manufacture of semi-conductor devices | |
JPS5745256A (en) | Manufacture of semiconductor device | |
JPS5727055A (en) | Semiconductor device | |
JPS57128063A (en) | Semiconductor device and manufacture thereof | |
GB1327710A (en) | Method of manufacturing semiconductor components | |
GB1536763A (en) | Manufacture of semiconductor body | |
JPS5637663A (en) | Capacitor | |
JPS55153348A (en) | Manufacture of semiconductor device | |
JPS5796567A (en) | Manufacture of semiconductor device | |
GB1257942A (en) |