GB910709A - - Google Patents

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Publication number
GB910709A
GB910709A GB910709DA GB910709A GB 910709 A GB910709 A GB 910709A GB 910709D A GB910709D A GB 910709DA GB 910709 A GB910709 A GB 910709A
Authority
GB
United Kingdom
Prior art keywords
moles
coating
alkali metal
salt
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Publication date
Publication of GB910709A publication Critical patent/GB910709A/en
Expired legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Abstract

910,709. Coating with metals. PHOTOCIRCUITS CORPORATION. Jan. 18, 1961 [May 3, 1960], No. 2033/61. Class 82 (2). A bath for the electroless deposition of copper on steel, ceramics or plastics comprises 0.002- 0.15 moles of a water soluble copper salt (e.g. CuSO 4 ), from 0.5-2.5 times this amount of a complexing agent (e.g. Rochelle salt or the sodium salts of E.D.T.A.), 0.06-3.4 moles of formaldehyde, 0.00002-0.06 mols. of an alkali metal cyanide and sufficient alkali metal hydroxide to give a pH of 10.5-14. When the solution is used for coating an insulating base the pretreatment comprises thorough cleaning sensitizing with SnCl 2 and seeding with PdCl 2 . Printed circuits may be made by this process.
GB910709D Expired GB910709A (en)

Publications (1)

Publication Number Publication Date
GB910709A true GB910709A (en) 1900-01-01

Family

ID=1753384

Family Applications (1)

Application Number Title Priority Date Filing Date
GB910709D Expired GB910709A (en)

Country Status (1)

Country Link
GB (1) GB910709A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1298826B (en) * 1963-02-05 1969-07-03 Siemens Ag Acid bath solution containing palladium (ó�) ions for the germination of surfaces of metallic or non-metallic bodies preactivated with tin (ó�) chloride
DE1521441B1 (en) * 1965-07-19 1970-04-30 Photocircuits Corp Process for producing metallically conductive surfaces in recesses in bodies, in particular electrical components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1298826B (en) * 1963-02-05 1969-07-03 Siemens Ag Acid bath solution containing palladium (ó�) ions for the germination of surfaces of metallic or non-metallic bodies preactivated with tin (ó�) chloride
DE1521441B1 (en) * 1965-07-19 1970-04-30 Photocircuits Corp Process for producing metallically conductive surfaces in recesses in bodies, in particular electrical components

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