ATE30251T1 - CHEMICAL NICKEL PLATING. - Google Patents

CHEMICAL NICKEL PLATING.

Info

Publication number
ATE30251T1
ATE30251T1 AT82303913T AT82303913T ATE30251T1 AT E30251 T1 ATE30251 T1 AT E30251T1 AT 82303913 T AT82303913 T AT 82303913T AT 82303913 T AT82303913 T AT 82303913T AT E30251 T1 ATE30251 T1 AT E30251T1
Authority
AT
Austria
Prior art keywords
bath
free
sulfur
nickel plating
phosphorus
Prior art date
Application number
AT82303913T
Other languages
German (de)
Inventor
Glenn O Mallory
Konrad Parker
Original Assignee
Richardson Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23100919&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE30251(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Application granted granted Critical
Publication of ATE30251T1 publication Critical patent/ATE30251T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Nickel-phosphorus deposits are electrolessly coated onto substrates at a commercially acceptable rate of deposition in a manner that enhances corrosion resistance and reduces the internal tensile stress of the electroless deposit on the substrate. This is done by plating from a bath that is sulfur-free (or free of sulfur except at its highest oxidation state) and that includes an unsaturated carboxylic acid of the formula R(COOH)n wherein R is an unsaturated alkyl group of at least 2 carbon atoms and n is at least 1, or a derivative thereof. Such compounds include aconitic, citraconic, fumaric, itaconic and maleic acids. The reducing agent of the bath may also be its phosphorus source e.g. an alkali metal hypophosphite.
AT82303913T 1981-07-27 1982-07-23 CHEMICAL NICKEL PLATING. ATE30251T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28697181A 1981-07-27 1981-07-27
EP82303913A EP0071436B2 (en) 1981-07-27 1982-07-23 Electroless nickel plating

Publications (1)

Publication Number Publication Date
ATE30251T1 true ATE30251T1 (en) 1987-10-15

Family

ID=23100919

Family Applications (1)

Application Number Title Priority Date Filing Date
AT82303913T ATE30251T1 (en) 1981-07-27 1982-07-23 CHEMICAL NICKEL PLATING.

Country Status (5)

Country Link
EP (1) EP0071436B2 (en)
JP (1) JPS5845368A (en)
AT (1) ATE30251T1 (en)
CA (1) CA1185404A (en)
DE (1) DE3277461D1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503131A (en) * 1982-01-18 1985-03-05 Richardson Chemical Company Electrical contact materials
US4659605A (en) * 1984-05-16 1987-04-21 Richardson Chemical Company Electroless deposition magnetic recording media process and products produced thereby
KR960003723B1 (en) * 1986-05-19 1996-03-21 하라마 카세이 고오교오 가부시끼가이샤 Method for forming a metal film on the surface of a substrate metal
JPH03107204U (en) * 1990-02-22 1991-11-05
US6230930B1 (en) * 1997-10-14 2001-05-15 Cross-Given Manufacturing Company Apparatus and method for vending products
JP2007256509A (en) * 2006-03-22 2007-10-04 Tokai Rubber Ind Ltd Manufacturing method for elastic roll
JP5158320B2 (en) * 2007-03-30 2013-03-06 上村工業株式会社 Electroless nickel plating method, link chain and manufacturing method thereof
US8492899B2 (en) 2010-10-14 2013-07-23 International Business Machines Corporation Method to electrodeposit nickel on silicon for forming controllable nickel silicide
BR112015001113B1 (en) * 2012-07-17 2021-05-18 Coventya, Inc method of forming a black autocatalytic nickel coating of a substrate
US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2935425A (en) * 1954-12-29 1960-05-03 Gen Am Transport Chemical nickel plating processes and baths therefor
US3782978A (en) * 1971-07-06 1974-01-01 Shipley Co Electroless nickel plating

Also Published As

Publication number Publication date
JPS5845368A (en) 1983-03-16
EP0071436B1 (en) 1987-10-14
EP0071436A1 (en) 1983-02-09
DE3277461D1 (en) 1987-11-19
EP0071436B2 (en) 1993-10-13
CA1185404A (en) 1985-04-16

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Legal Events

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