GB902383A - Improvements in and relating to the fabrication of semiconductor units - Google Patents

Improvements in and relating to the fabrication of semiconductor units

Info

Publication number
GB902383A
GB902383A GB30045/58A GB3004558A GB902383A GB 902383 A GB902383 A GB 902383A GB 30045/58 A GB30045/58 A GB 30045/58A GB 3004558 A GB3004558 A GB 3004558A GB 902383 A GB902383 A GB 902383A
Authority
GB
United Kingdom
Prior art keywords
electrode
semi
holding
indium
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30045/58A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lanteris Space LLC
Original Assignee
Philco Ford Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US685232A external-priority patent/US2916604A/en
Application filed by Philco Ford Corp filed Critical Philco Ford Corp
Publication of GB902383A publication Critical patent/GB902383A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Fuses (AREA)
GB30045/58A 1957-09-20 1958-09-19 Improvements in and relating to the fabrication of semiconductor units Expired GB902383A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US685232A US2916604A (en) 1957-09-20 1957-09-20 Fabrication of electrical units
US801847A US3082522A (en) 1957-09-20 1959-03-25 Fabrication of electrical units

Publications (1)

Publication Number Publication Date
GB902383A true GB902383A (en) 1962-08-01

Family

ID=27103538

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30045/58A Expired GB902383A (en) 1957-09-20 1958-09-19 Improvements in and relating to the fabrication of semiconductor units

Country Status (6)

Country Link
US (1) US3082522A (https=)
BE (1) BE571348A (https=)
DE (1) DE1166378B (https=)
FR (1) FR1210229A (https=)
GB (1) GB902383A (https=)
NL (2) NL231513A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1199408B (de) * 1961-06-28 1965-08-26 Siemens Ag Verfahren zum Herstellen von Halbleiterbau-elementen und nach diesem Verfahren hergestelltes Halbleiterbauelement
NL280850A (https=) * 1961-07-12 1900-01-01
US3235943A (en) * 1962-01-04 1966-02-22 Corning Glass Works Method of making a flux free bonded article
US3310866A (en) * 1964-08-28 1967-03-28 Texas Instruments Inc Mountings for power transistors
DE2122104C3 (de) * 1971-05-05 1979-08-23 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum Anlöten eines metallischen Anschlußleiters an einen Halbleiterkörper

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE6753C (de) * Dr. G. VON ECKENBRECHER in Düsseldorf, Jägerhofstr. 23 Selbstregulirendes horizontales Windrad
US1695791A (en) * 1927-08-06 1928-12-18 Yunck John Adam Leading-in wires for evacuated containers and process of making same
US2166998A (en) * 1938-08-02 1939-07-25 Westinghouse Electric & Mfg Co Method of brazing turbine blades
US2671958A (en) * 1950-03-20 1954-03-16 Garrett Corp Process of joining metal parts consisting of aluminum and its alloys
GB774800A (en) * 1954-05-03 1957-05-15 Gen Electric Co Ltd Improvements in or relating to the manufacture of semi-conductor devices
US2897587A (en) * 1955-05-23 1959-08-04 Philco Corp Method of fabricating semiconductor devices
US2842841A (en) * 1955-06-13 1958-07-15 Philco Corp Method of soldering leads to semiconductor devices
US2947079A (en) * 1955-11-03 1960-08-02 Philco Corp Method of solder bonding
NL216979A (https=) * 1956-05-18
BE563189A (https=) * 1956-06-08
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication

Also Published As

Publication number Publication date
FR1210229A (fr) 1960-03-07
BE571348A (https=) 1900-01-01
US3082522A (en) 1963-03-26
NL109858C (https=) 1900-01-01
NL231513A (https=) 1900-01-01
DE1166378B (de) 1964-03-26

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