BE563189A - - Google Patents

Info

Publication number
BE563189A
BE563189A BE563189DA BE563189A BE 563189 A BE563189 A BE 563189A BE 563189D A BE563189D A BE 563189DA BE 563189 A BE563189 A BE 563189A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE563189A publication Critical patent/BE563189A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/10Arrangements for heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/13Containers comprising a conductive base serving as an interconnection
    • H10W76/132Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
BE563189D 1956-06-08 BE563189A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US590204A US3002271A (en) 1956-06-08 1956-06-08 Method of providing connection to semiconductive structures

Publications (1)

Publication Number Publication Date
BE563189A true BE563189A (https=)

Family

ID=24361273

Family Applications (1)

Application Number Title Priority Date Filing Date
BE563189D BE563189A (https=) 1956-06-08

Country Status (3)

Country Link
US (1) US3002271A (https=)
BE (1) BE563189A (https=)
GB (1) GB861581A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1207503B (de) * 1959-07-24 1965-12-23 Elektronik M B H Gehaeuse fuer Halbleiteranordnungen mit einem Metallsockel

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3109234A (en) * 1957-07-22 1963-11-05 Rca Corp Method of mounting a semiconductor device
DE1166378B (de) * 1957-09-20 1964-03-26 Philco Corp Eine Ges Nach Den Verfahren zur Befestigung einer Anschlussleitung an einer Sperrschichtelektrode einer Halbleiteranordnung und Vorrichtung zur Ausfuehrung des Verfahrens
US3109225A (en) * 1958-08-29 1963-11-05 Rca Corp Method of mounting a semiconductor device
US3164885A (en) * 1960-11-15 1965-01-12 Semiconductors Ltd Semiconductors
US3204023A (en) * 1963-03-01 1965-08-31 Texas Instruments Inc Semiconductor device header with semiconductor support
US3234320A (en) * 1963-06-11 1966-02-08 United Carr Inc Integrated circuit package
US3442432A (en) * 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate
US3569798A (en) * 1969-05-13 1971-03-09 Rca Corp Double heat sink semiconductor device
US4787551A (en) * 1987-05-04 1988-11-29 Stanford University Method of welding thermocouples to silicon wafers for temperature monitoring in rapid thermal processing
JP5338981B1 (ja) * 2011-10-13 2013-11-13 トヨタ自動車株式会社 半導体モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2137617A (en) * 1936-03-04 1938-11-22 Mallory & Co Inc P R Electrical contact and method of making the same
US2409668A (en) * 1942-07-18 1946-10-22 Westinghouse Electric Corp Heat transfer means and method of assembly
US2464821A (en) * 1942-08-03 1949-03-22 Indium Corp America Method of preparing a surface for soldering by coating with indium
BE524233A (https=) * 1952-11-14
BE527420A (https=) * 1953-03-20
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
US2877396A (en) * 1954-01-25 1959-03-10 Rca Corp Semi-conductor devices
BE537167A (https=) * 1954-04-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1207503B (de) * 1959-07-24 1965-12-23 Elektronik M B H Gehaeuse fuer Halbleiteranordnungen mit einem Metallsockel

Also Published As

Publication number Publication date
US3002271A (en) 1961-10-03
GB861581A (en) 1961-02-22

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