GB8916857D0 - Adhesive sheet - Google Patents

Adhesive sheet

Info

Publication number
GB8916857D0
GB8916857D0 GB898916857A GB8916857A GB8916857D0 GB 8916857 D0 GB8916857 D0 GB 8916857D0 GB 898916857 A GB898916857 A GB 898916857A GB 8916857 A GB8916857 A GB 8916857A GB 8916857 D0 GB8916857 D0 GB 8916857D0
Authority
GB
United Kingdom
Prior art keywords
adhesive sheet
adhesive
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB898916857A
Other versions
GB2221470A (en
GB2221470B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60295189A external-priority patent/JPS62153376A/en
Priority claimed from JP60295188A external-priority patent/JPS62153375A/en
Priority claimed from JP60295190A external-priority patent/JPS62153377A/en
Priority claimed from JP61045785A external-priority patent/JPS62205179A/en
Priority claimed from JP61045786A external-priority patent/JPS62205180A/en
Priority claimed from JP61161680A external-priority patent/JPS6317980A/en
Priority claimed from GB8630956A external-priority patent/GB2184741B/en
Application filed by FSK Corp filed Critical FSK Corp
Publication of GB8916857D0 publication Critical patent/GB8916857D0/en
Publication of GB2221470A publication Critical patent/GB2221470A/en
Publication of GB2221470B publication Critical patent/GB2221470B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
GB8916857A 1985-12-27 1989-07-24 Adhesive sheet suitable for semiconductor wafer processing Expired - Lifetime GB2221470B (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP60295189A JPS62153376A (en) 1985-12-27 1985-12-27 Pressure-sensitive adhesive sheet
JP60295190A JPS62153377A (en) 1985-12-27 1985-12-27 Pressure-sensitive adhesive sheet
JP60295188A JPS62153375A (en) 1985-12-27 1985-12-27 Pressure-sensitive adhesive sheet
JP61045786A JPS62205180A (en) 1986-03-03 1986-03-03 Adhesive sheet
JP61045785A JPS62205179A (en) 1986-03-03 1986-03-03 Adhesive sheet for applying wafer
JP61161680A JPS6317980A (en) 1986-07-09 1986-07-09 Adhesive sheet for applying wafer
GB8630956A GB2184741B (en) 1985-12-27 1986-12-29 Adhesive sheet suitable for use in the preparation of semiconductor chips

Publications (3)

Publication Number Publication Date
GB8916857D0 true GB8916857D0 (en) 1989-09-06
GB2221470A GB2221470A (en) 1990-02-07
GB2221470B GB2221470B (en) 1990-09-05

Family

ID=27562766

Family Applications (3)

Application Number Title Priority Date Filing Date
GB8916857A Expired - Lifetime GB2221470B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for semiconductor wafer processing
GB8916855A Expired - Lifetime GB2221468B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916856A Expired - Lifetime GB2221469B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB8916855A Expired - Lifetime GB2221468B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916856A Expired - Lifetime GB2221469B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips

Country Status (2)

Country Link
GB (3) GB2221470B (en)
SG (3) SG114592G (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410202B2 (en) * 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 Adhesive sheet for attaching wafer and method for manufacturing semiconductor device using the same
JP3521099B2 (en) * 1994-11-29 2004-04-19 リンテック株式会社 Adhesive sheet for preventing adhesion of adhesive to dicing ring frame and wafer processing sheet provided with the adhesive sheet
GB9523764D0 (en) * 1995-11-21 1996-01-24 Ici Plc Polymeric film
JPH09291258A (en) * 1996-04-26 1997-11-11 Lintec Corp Tacky agent composition and tacky sheet using the same
JPH10337823A (en) * 1997-04-11 1998-12-22 Lintec Corp Base material and pressure sensitive adhesive tape using the material
DE19921230B4 (en) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Method for handling thinned chips for insertion in chip cards
JP4230080B2 (en) * 2000-02-18 2009-02-25 リンテック株式会社 Wafer sticking adhesive sheet
FR2830976B1 (en) 2001-10-17 2004-01-09 Ge Med Sys Global Tech Co Llc LOW ATTENUATION ANTI-DIFFUSING GRIDS AND METHOD OF MANUFACTURING SUCH GRIDS
JP2006522475A (en) 2003-04-02 2006-09-28 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Flexible electronic device and method of manufacturing a flexible device
JP5687897B2 (en) * 2010-12-28 2015-03-25 日東電工株式会社 Radiation curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
CN106229286B (en) * 2016-08-30 2020-04-14 浙江中纳晶微电子科技有限公司 Processing method for temporary bonding of thin workpiece

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0616524B2 (en) * 1984-03-12 1994-03-02 日東電工株式会社 Adhesive thin plate for fixing semiconductor wafers
DE3665191D1 (en) * 1985-02-14 1989-09-28 Bando Chemical Ind A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same
ATE85138T1 (en) * 1985-02-19 1993-02-15 Ucb Sa COMPOSITION AND PROCESS FOR MAKING A SAMPLE OF ADHESIVE.

Also Published As

Publication number Publication date
GB2221468A (en) 1990-02-07
GB2221469A (en) 1990-02-07
GB2221469B (en) 1990-09-05
GB2221470A (en) 1990-02-07
SG114392G (en) 1992-12-24
GB8916855D0 (en) 1989-09-06
SG114692G (en) 1992-12-24
GB2221468B (en) 1990-09-05
GB8916856D0 (en) 1989-09-06
SG114592G (en) 1992-12-24
GB2221470B (en) 1990-09-05

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years