GB8916855D0 - Adhesive sheet - Google Patents
Adhesive sheetInfo
- Publication number
- GB8916855D0 GB8916855D0 GB898916855A GB8916855A GB8916855D0 GB 8916855 D0 GB8916855 D0 GB 8916855D0 GB 898916855 A GB898916855 A GB 898916855A GB 8916855 A GB8916855 A GB 8916855A GB 8916855 D0 GB8916855 D0 GB 8916855D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- adhesive sheet
- adhesive
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60295188A JPS62153375A (en) | 1985-12-27 | 1985-12-27 | Pressure-sensitive adhesive sheet |
JP60295189A JPS62153376A (en) | 1985-12-27 | 1985-12-27 | Pressure-sensitive adhesive sheet |
JP60295190A JPS62153377A (en) | 1985-12-27 | 1985-12-27 | Pressure-sensitive adhesive sheet |
JP61045785A JPS62205179A (en) | 1986-03-03 | 1986-03-03 | Adhesive sheet for applying wafer |
JP61045786A JPS62205180A (en) | 1986-03-03 | 1986-03-03 | Adhesive sheet |
JP61161680A JPS6317980A (en) | 1986-07-09 | 1986-07-09 | Adhesive sheet for applying wafer |
GB8630956A GB2184741B (en) | 1985-12-27 | 1986-12-29 | Adhesive sheet suitable for use in the preparation of semiconductor chips |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8916855D0 true GB8916855D0 (en) | 1989-09-06 |
GB2221468A GB2221468A (en) | 1990-02-07 |
GB2221468B GB2221468B (en) | 1990-09-05 |
Family
ID=27562766
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8916855A Expired - Lifetime GB2221468B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
GB8916857A Expired - Lifetime GB2221470B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for semiconductor wafer processing |
GB8916856A Expired - Lifetime GB2221469B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8916857A Expired - Lifetime GB2221470B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for semiconductor wafer processing |
GB8916856A Expired - Lifetime GB2221469B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
Country Status (2)
Country | Link |
---|---|
GB (3) | GB2221468B (en) |
SG (3) | SG114592G (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3410202B2 (en) * | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | Adhesive sheet for attaching wafer and method for manufacturing semiconductor device using the same |
JP3521099B2 (en) * | 1994-11-29 | 2004-04-19 | リンテック株式会社 | Adhesive sheet for preventing adhesion of adhesive to dicing ring frame and wafer processing sheet provided with the adhesive sheet |
GB9523764D0 (en) * | 1995-11-21 | 1996-01-24 | Ici Plc | Polymeric film |
JPH09291258A (en) * | 1996-04-26 | 1997-11-11 | Lintec Corp | Tacky agent composition and tacky sheet using the same |
JPH10337823A (en) * | 1997-04-11 | 1998-12-22 | Lintec Corp | Base material and pressure sensitive adhesive tape using the material |
DE19921230B4 (en) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Method for handling thinned chips for insertion in chip cards |
JP4230080B2 (en) * | 2000-02-18 | 2009-02-25 | リンテック株式会社 | Wafer sticking adhesive sheet |
FR2830976B1 (en) | 2001-10-17 | 2004-01-09 | Ge Med Sys Global Tech Co Llc | LOW ATTENUATION ANTI-DIFFUSING GRIDS AND METHOD OF MANUFACTURING SUCH GRIDS |
JP2006522475A (en) * | 2003-04-02 | 2006-09-28 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Flexible electronic device and method of manufacturing a flexible device |
JP5687897B2 (en) * | 2010-12-28 | 2015-03-25 | 日東電工株式会社 | Radiation curable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
CN106229286B (en) * | 2016-08-30 | 2020-04-14 | 浙江中纳晶微电子科技有限公司 | Processing method for temporary bonding of thin workpiece |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0616524B2 (en) * | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | Adhesive thin plate for fixing semiconductor wafers |
DE3665191D1 (en) * | 1985-02-14 | 1989-09-28 | Bando Chemical Ind | A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same |
ATE85138T1 (en) * | 1985-02-19 | 1993-02-15 | Ucb Sa | COMPOSITION AND PROCESS FOR MAKING A SAMPLE OF ADHESIVE. |
-
1989
- 1989-07-24 GB GB8916855A patent/GB2221468B/en not_active Expired - Lifetime
- 1989-07-24 GB GB8916857A patent/GB2221470B/en not_active Expired - Lifetime
- 1989-07-24 GB GB8916856A patent/GB2221469B/en not_active Expired - Lifetime
-
1992
- 1992-11-02 SG SG1145/92A patent/SG114592G/en unknown
- 1992-11-02 SG SG1143/92A patent/SG114392G/en unknown
- 1992-11-02 SG SG1146/92A patent/SG114692G/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG114392G (en) | 1992-12-24 |
GB2221469A (en) | 1990-02-07 |
GB2221468A (en) | 1990-02-07 |
GB2221468B (en) | 1990-09-05 |
GB2221470B (en) | 1990-09-05 |
GB8916856D0 (en) | 1989-09-06 |
SG114692G (en) | 1992-12-24 |
GB8916857D0 (en) | 1989-09-06 |
GB2221469B (en) | 1990-09-05 |
SG114592G (en) | 1992-12-24 |
GB2221470A (en) | 1990-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |