GB890830A - A glass sealed type semiconductor device - Google Patents

A glass sealed type semiconductor device

Info

Publication number
GB890830A
GB890830A GB31170/60A GB3117060A GB890830A GB 890830 A GB890830 A GB 890830A GB 31170/60 A GB31170/60 A GB 31170/60A GB 3117060 A GB3117060 A GB 3117060A GB 890830 A GB890830 A GB 890830A
Authority
GB
United Kingdom
Prior art keywords
electrode
semi
conductor
glass sealed
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB31170/60A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of GB890830A publication Critical patent/GB890830A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
GB31170/60A 1959-09-11 1960-09-09 A glass sealed type semiconductor device Expired GB890830A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP890830X 1959-09-11

Publications (1)

Publication Number Publication Date
GB890830A true GB890830A (en) 1962-03-07

Family

ID=13960952

Family Applications (1)

Application Number Title Priority Date Filing Date
GB31170/60A Expired GB890830A (en) 1959-09-11 1960-09-09 A glass sealed type semiconductor device

Country Status (2)

Country Link
GB (1) GB890830A (US07816562-20101019-C00012.png)
NL (2) NL102298C (US07816562-20101019-C00012.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225303B (de) * 1964-04-11 1966-09-22 Itt Ind Ges Mit Beschraenkter Transistor mit Sockelanordnung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225303B (de) * 1964-04-11 1966-09-22 Itt Ind Ges Mit Beschraenkter Transistor mit Sockelanordnung

Also Published As

Publication number Publication date
NL102298C (US07816562-20101019-C00012.png) 1962-03-15
NL253505A (US07816562-20101019-C00012.png)

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