GB877020A - Improvements relating to arrangements for dissipating heat generated in semi-conductor devices - Google Patents

Improvements relating to arrangements for dissipating heat generated in semi-conductor devices

Info

Publication number
GB877020A
GB877020A GB2042659A GB2042659A GB877020A GB 877020 A GB877020 A GB 877020A GB 2042659 A GB2042659 A GB 2042659A GB 2042659 A GB2042659 A GB 2042659A GB 877020 A GB877020 A GB 877020A
Authority
GB
United Kingdom
Prior art keywords
chassis
casing
arrangements
semi
heat generated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2042659A
Inventor
Keith Lamont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB2042659A priority Critical patent/GB877020A/en
Publication of GB877020A publication Critical patent/GB877020A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

877,020. Transistors. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. June 2, 1960 [June 15, 1959], No. 20426/59. Class 37. A transistor in a metal casing which is connected to an electrode is mounted on a chassis with a relatively thick ceramic washer, which may be silver-plated, lying between and in good thermal contact with the casing and the chassis. The Figure shows the transistor casing 1 with collector connecting tag 9, emitter and base leads 7 and 8 and the ceramic washer which is between # and 2 inches thick, lying between the casing and chassis 3. The washer may contain cooling vents and the chassis surface ground to ensure good contact.
GB2042659A 1959-06-15 1959-06-15 Improvements relating to arrangements for dissipating heat generated in semi-conductor devices Expired GB877020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2042659A GB877020A (en) 1959-06-15 1959-06-15 Improvements relating to arrangements for dissipating heat generated in semi-conductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2042659A GB877020A (en) 1959-06-15 1959-06-15 Improvements relating to arrangements for dissipating heat generated in semi-conductor devices

Publications (1)

Publication Number Publication Date
GB877020A true GB877020A (en) 1961-09-13

Family

ID=10145765

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2042659A Expired GB877020A (en) 1959-06-15 1959-06-15 Improvements relating to arrangements for dissipating heat generated in semi-conductor devices

Country Status (1)

Country Link
GB (1) GB877020A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410928A (en) * 1980-05-07 1983-10-18 Clarion Co., Ltd. Connector fixing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410928A (en) * 1980-05-07 1983-10-18 Clarion Co., Ltd. Connector fixing device

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