GB856855A - Improvements in semi-conductor assemblies with cooling arrangements - Google Patents

Improvements in semi-conductor assemblies with cooling arrangements

Info

Publication number
GB856855A
GB856855A GB20470/59A GB2047059A GB856855A GB 856855 A GB856855 A GB 856855A GB 20470/59 A GB20470/59 A GB 20470/59A GB 2047059 A GB2047059 A GB 2047059A GB 856855 A GB856855 A GB 856855A
Authority
GB
United Kingdom
Prior art keywords
semi
support member
recess
conductor
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB20470/59A
Inventor
Thomas Philip Robinson
Jerzy Adam Budek
Waldo Thorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB20470/59A priority Critical patent/GB856855A/en
Publication of GB856855A publication Critical patent/GB856855A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

856,855. Semi-conductor rectifiers. STANDARD TELEPHONES & CABLES Ltd. June 15, 1959, No. 20470/59. Class 37 A semi-conductor assembly comprises one or more semi-conductor devices, each device being mounted in a recess in a hollow support member, the recess(es) being formed in a part of the support member having a surface within the support member such that a cooling fluid passing therethrough comes into contact with the said surface in all three dimensions. As shown, Figs. 4, 7, an aluminium support member comprises a channel 3 which adjoins three sides of a block portion 2 of the member 1, the block portion 2 being provided with threaded recesses 4 into which are screwed silicon diodes 8, which may be of the kind described in Specification 835,865. A terminating member 5, also of aluminium, which is welded or otherwise fixed to each end of the member 1, comprises an apertured terminal lug 13 and a recess 6 through which cooling fluid passes on its way to or from channel 3.
GB20470/59A 1959-06-15 1959-06-15 Improvements in semi-conductor assemblies with cooling arrangements Expired GB856855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB20470/59A GB856855A (en) 1959-06-15 1959-06-15 Improvements in semi-conductor assemblies with cooling arrangements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB20470/59A GB856855A (en) 1959-06-15 1959-06-15 Improvements in semi-conductor assemblies with cooling arrangements

Publications (1)

Publication Number Publication Date
GB856855A true GB856855A (en) 1960-12-21

Family

ID=10146458

Family Applications (1)

Application Number Title Priority Date Filing Date
GB20470/59A Expired GB856855A (en) 1959-06-15 1959-06-15 Improvements in semi-conductor assemblies with cooling arrangements

Country Status (1)

Country Link
GB (1) GB856855A (en)

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