GB8512092D0 - High speed package - Google Patents

High speed package

Info

Publication number
GB8512092D0
GB8512092D0 GB8512092A GB8512092A GB8512092D0 GB 8512092 D0 GB8512092 D0 GB 8512092D0 GB 8512092 A GB8512092 A GB 8512092A GB 8512092 A GB8512092 A GB 8512092A GB 8512092 D0 GB8512092 D0 GB 8512092D0
Authority
GB
United Kingdom
Prior art keywords
high speed
speed package
package
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8512092A
Other versions
GB2160707A (en
GB2160707B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gigabit Logic Inc
Original Assignee
Gigabit Logic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigabit Logic Inc filed Critical Gigabit Logic Inc
Publication of GB8512092D0 publication Critical patent/GB8512092D0/en
Publication of GB2160707A publication Critical patent/GB2160707A/en
Application granted granted Critical
Publication of GB2160707B publication Critical patent/GB2160707B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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    • H01L2224/481—Disposition
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Microwave Amplifiers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
GB8512092A 1984-05-14 1985-05-13 Ga as integrated circuit package Expired GB2160707B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60972884A 1984-05-14 1984-05-14

Publications (3)

Publication Number Publication Date
GB8512092D0 true GB8512092D0 (en) 1985-06-19
GB2160707A GB2160707A (en) 1985-12-24
GB2160707B GB2160707B (en) 1988-10-19

Family

ID=24442081

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8512092A Expired GB2160707B (en) 1984-05-14 1985-05-13 Ga as integrated circuit package

Country Status (4)

Country Link
JP (1) JPS6116539A (en)
DE (1) DE3516954A1 (en)
FR (1) FR2564244B1 (en)
GB (1) GB2160707B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754317A (en) * 1986-04-28 1988-06-28 Monolithic Memories, Inc. Integrated circuit die-to-lead frame interconnection assembly and method
US4774635A (en) * 1986-05-27 1988-09-27 American Telephone And Telegraph Company At&T Bell Laboratories Semiconductor package with high density I/O lead connection
FR2623662B1 (en) * 1987-11-20 1990-03-09 Labo Electronique Physique CONNECTION DEVICE FOR ULTRA-FAST DIGITAL INTEGRATED CIRCUITS
JPH0226243U (en) * 1988-08-08 1990-02-21
US5089878A (en) * 1989-06-09 1992-02-18 Lee Jaesup N Low impedance packaging
US5063177A (en) * 1990-10-04 1991-11-05 Comsat Method of packaging microwave semiconductor components and integrated circuits
US20030089998A1 (en) * 2001-11-09 2003-05-15 Chan Vincent K. Direct interconnect multi-chip module, method for making the same and electronic package comprising same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007993A1 (en) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Conductor plate for mounting and electrically connecting semiconductor chips
JPS5687395A (en) * 1979-12-18 1981-07-15 Fujitsu Ltd Semiconductor device
CA1115852A (en) * 1980-01-09 1982-01-05 Jacques R. St. Louis Mounting and packaging of silicon devices on ceramic substrates, and assemblies containing silicon devices
JPS6041861B2 (en) * 1980-03-25 1985-09-19 三菱電機株式会社 semiconductor equipment
JPS57154861A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Package
US4437141A (en) * 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
GB2117564B (en) * 1982-03-26 1985-11-06 Int Computers Ltd Mounting one integrated circuit upon another
JPS58210650A (en) * 1982-06-01 1983-12-07 Fujitsu Ltd Semiconductor device
GB2136203B (en) * 1983-03-02 1986-10-15 Standard Telephones Cables Ltd Through-wafer integrated circuit connections

Also Published As

Publication number Publication date
GB2160707A (en) 1985-12-24
FR2564244A1 (en) 1985-11-15
DE3516954A1 (en) 1985-11-14
FR2564244B1 (en) 1988-12-02
JPS6116539A (en) 1986-01-24
GB2160707B (en) 1988-10-19

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