GB794219A - Improvements in or relating to dip soldering - Google Patents

Improvements in or relating to dip soldering

Info

Publication number
GB794219A
GB794219A GB37415/55A GB3741555A GB794219A GB 794219 A GB794219 A GB 794219A GB 37415/55 A GB37415/55 A GB 37415/55A GB 3741555 A GB3741555 A GB 3741555A GB 794219 A GB794219 A GB 794219A
Authority
GB
United Kingdom
Prior art keywords
solder
panel
frame
article
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37415/55A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB794219A publication Critical patent/GB794219A/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

794,219. Soldering. STANDARD TELEPHONES & CABLES, Ltd. Dec. 30, 1955 [Dec. 31, 1954], No. 37415/55. Class 83 (4). An apparatus for dip soldering comprises a solder bath, a heater for maintaining the solder molten, means to lower an article into contact with the solder and to raise the article from the solder, means to move the article horizontally in contact with the solder and means to jerk the article when clear of the solder to remove excess solder. A base 1 carries two columns 3 on which a frame comprising sleeves 8 and horizontal members 9 is movable vertically by a rack and pinion device operated by a handle 12. A carriage 13 movable along the members 9 by a rack-and-pinion operated by a wheel 15 pivotally supports at 17 a holder 18 comprising a fixed aluminium support 23 and a movable aluminium support 22. In operation with a printed circuit panel 29 to which the leads of components are to be soldered, held in the supports 22, 23, the frame 8, 9 is lowered to bring the panel into contact with the solder in the bath 25. The panel is moved horizontally to and fro for 5-12 seconds by rotating the handle 15. On raising the frame 8, 9 to lift the panel from the solder a member 31 on the support 23 engages a pivoted member 27 on a column 3 and the holder 18 rotates on the pivot 17 and tilts the panel to allow solder to flow off the panel. Further upward movement of the frame 8, 9 allows the member 31 to clear the member 27 and a spring 21 jerks the frame into the horizontal position against a stop 20. The solder is heated by a coil, temperature controlled by a cut-out 28.
GB37415/55A 1954-12-31 1955-12-30 Improvements in or relating to dip soldering Expired GB794219A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE794219X 1954-12-31

Publications (1)

Publication Number Publication Date
GB794219A true GB794219A (en) 1958-04-30

Family

ID=6710474

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37415/55A Expired GB794219A (en) 1954-12-31 1955-12-30 Improvements in or relating to dip soldering

Country Status (1)

Country Link
GB (1) GB794219A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056015A (en) * 1960-09-30 1962-09-25 Bendix Corp Dip-soldering method and apparatus
CN103878463A (en) * 2014-03-27 2014-06-25 合肥凌达压缩机有限公司 Tin soldering tool

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056015A (en) * 1960-09-30 1962-09-25 Bendix Corp Dip-soldering method and apparatus
CN103878463A (en) * 2014-03-27 2014-06-25 合肥凌达压缩机有限公司 Tin soldering tool
CN103878463B (en) * 2014-03-27 2017-02-15 合肥凌达压缩机有限公司 Tin soldering tool

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