GB1269085A - Improved method and apparatus for dip-soldering electrical connections - Google Patents

Improved method and apparatus for dip-soldering electrical connections

Info

Publication number
GB1269085A
GB1269085A GB4142269A GB4142269A GB1269085A GB 1269085 A GB1269085 A GB 1269085A GB 4142269 A GB4142269 A GB 4142269A GB 4142269 A GB4142269 A GB 4142269A GB 1269085 A GB1269085 A GB 1269085A
Authority
GB
United Kingdom
Prior art keywords
bath
soldering
solder
dip
vessel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4142269A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ERSA ERNST SACHS KG
Original Assignee
ERSA ERNST SACHS KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ERSA ERNST SACHS KG filed Critical ERSA ERNST SACHS KG
Publication of GB1269085A publication Critical patent/GB1269085A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1,269,085. Soldering. ERSA ERNST SACHS K.G. 19 Aug., 1969 [6 Nov., 1968], No. 41422/69. Heading B3R. In dip-soldering electrical connections in a static solder bath, an enclosure member is introduced into the bath from above to enclose an area of the bath surface while substantially excluding from the enclosed area the surface layer of oxides and other impurities existing on the bath before introduction of the enclosure member and the connections are dipped into the enclosed area of the bath. In the frame 1 of a soldering apparatus there is arranged a vessel 2, heated by electrical elements 4 or by gas and containing solder 3, and above the vessel 2 the dipping member 5 is pivoted on a spindle 9 between the arms 6 of a bifurcated member 7. The member 5 has two sides 21, 22 which come close together at the bottom to form a slit opening 25 and two ends which complete a funnel like structure. The sides may be hinged at 28 and urged together by springs. A holding device 18 is provided in the member 5 for a printed circuit board. The member 5 is urged upwardly into the tilted position shown in Fig. 2 by a leaf spring 10 and a handle is provided on the upper frame 12 of the member 5. The member 7 is carried on a pair of vertical columns 31 being urged by a spring 35 into an upper position and a chain fastened to the member 7 is engaged on a sprocket 41 rotated by manual turning of a lever 46. In operation with the apparatus in the position shown in Fig. 2 and with a printed circuit board in the holder 18, the lever 46 is turned by an operator to lower the member 5 into the bath, oxides being displaced by the member 5 and clean solder flowing through the slot 25. When a protection 17 on the member 5 engages the edge of the vessel 2, the member 5 is pivoted about spindle 9 to dip the circuit board into the clean solder. After soldering, the handle on frame 12 is raised to pivot the board out of the 'solder and the lever 46 is similtaneously moved to raise the member 5. Instead of manual operation mechanical, pneumatic, hydraulic or electric means may be employed and a timing device may control the dipping period. The apparatus may be fully automatic.
GB4142269A 1968-11-06 1969-08-19 Improved method and apparatus for dip-soldering electrical connections Expired GB1269085A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681807989 DE1807989C3 (en) 1968-11-06 1968-11-06 Device for soldering electrical connections, in particular printed circuits

Publications (1)

Publication Number Publication Date
GB1269085A true GB1269085A (en) 1972-03-29

Family

ID=5712854

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4142269A Expired GB1269085A (en) 1968-11-06 1969-08-19 Improved method and apparatus for dip-soldering electrical connections

Country Status (4)

Country Link
CH (1) CH490921A (en)
DE (1) DE1807989C3 (en)
FR (1) FR2022675A1 (en)
GB (1) GB1269085A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469716A (en) * 1980-09-09 1984-09-04 Sinter Limited Process for the application of solder on printed circuit boards and process for their placement in and removal from this device
EP1378309A2 (en) * 1998-02-27 2004-01-07 Matsushita Electric Industrial Co., Ltd. Soldering apparatus, and agent and method for seperating solder and solder oxides
CN113458526A (en) * 2021-06-04 2021-10-01 朱丑英 PLC automated control relevant relay pin wicking processing apparatus
CN115255543A (en) * 2022-09-29 2022-11-01 江苏淮海新能源股份有限公司 Dip soldering machine is used in production of machine controller control panel
CN118437999A (en) * 2024-07-08 2024-08-06 成都中科四点零科技有限公司 Welding equipment for circuit board production

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1275690B (en) * 1960-10-01 1968-08-22 Telefunken Patent Housing for semiconductor components
US5236117A (en) * 1992-06-22 1993-08-17 Staktek Corporation Impact solder method and apparatus
CN103121140B (en) * 2013-03-04 2015-05-27 宁波恒升电气有限公司 Soldering tin melting furnace

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469716A (en) * 1980-09-09 1984-09-04 Sinter Limited Process for the application of solder on printed circuit boards and process for their placement in and removal from this device
EP1378309A2 (en) * 1998-02-27 2004-01-07 Matsushita Electric Industrial Co., Ltd. Soldering apparatus, and agent and method for seperating solder and solder oxides
EP1378309A3 (en) * 1998-02-27 2005-06-08 Matsushita Electric Industrial Co., Ltd. Soldering apparatus, and agent and method for seperating solder and solder oxides
CN113458526A (en) * 2021-06-04 2021-10-01 朱丑英 PLC automated control relevant relay pin wicking processing apparatus
CN115255543A (en) * 2022-09-29 2022-11-01 江苏淮海新能源股份有限公司 Dip soldering machine is used in production of machine controller control panel
CN118437999A (en) * 2024-07-08 2024-08-06 成都中科四点零科技有限公司 Welding equipment for circuit board production

Also Published As

Publication number Publication date
DE1807989B2 (en) 1972-07-27
DE1807989C3 (en) 1979-12-13
DE1807989A1 (en) 1970-05-27
FR2022675A1 (en) 1970-08-07
CH490921A (en) 1970-05-31

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