CH490921A - Method and device for soldering electrical connections, in particular for printed circuits by dip soldering - Google Patents

Method and device for soldering electrical connections, in particular for printed circuits by dip soldering

Info

Publication number
CH490921A
CH490921A CH1163569A CH1163569A CH490921A CH 490921 A CH490921 A CH 490921A CH 1163569 A CH1163569 A CH 1163569A CH 1163569 A CH1163569 A CH 1163569A CH 490921 A CH490921 A CH 490921A
Authority
CH
Switzerland
Prior art keywords
soldering
electrical connections
printed circuits
dip
dip soldering
Prior art date
Application number
CH1163569A
Other languages
German (de)
Inventor
Koehler Franz
Original Assignee
Sachs Ersa Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sachs Ersa Kg filed Critical Sachs Ersa Kg
Publication of CH490921A publication Critical patent/CH490921A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH1163569A 1968-11-06 1969-07-31 Method and device for soldering electrical connections, in particular for printed circuits by dip soldering CH490921A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681807989 DE1807989C3 (en) 1968-11-06 1968-11-06 Device for soldering electrical connections, in particular printed circuits

Publications (1)

Publication Number Publication Date
CH490921A true CH490921A (en) 1970-05-31

Family

ID=5712854

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1163569A CH490921A (en) 1968-11-06 1969-07-31 Method and device for soldering electrical connections, in particular for printed circuits by dip soldering

Country Status (4)

Country Link
CH (1) CH490921A (en)
DE (1) DE1807989C3 (en)
FR (1) FR2022675A1 (en)
GB (1) GB1269085A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103121140A (en) * 2013-03-04 2013-05-29 宁波恒升电气有限公司 Soldering tin melting furnace

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1275690B (en) * 1960-10-01 1968-08-22 Telefunken Patent Housing for semiconductor components
CH656769A5 (en) * 1980-09-09 1986-07-15 Sinter Ltd DEVICE FOR APPLYING SOLDER TO PCB.
US5236117A (en) * 1992-06-22 1993-08-17 Staktek Corporation Impact solder method and apparatus
EP1378309B1 (en) * 1998-02-27 2008-07-09 Matsushita Electric Industrial Co., Ltd. Method for separating solder and solder oxides
CN113458526A (en) * 2021-06-04 2021-10-01 朱丑英 PLC automated control relevant relay pin wicking processing apparatus
CN115255543A (en) * 2022-09-29 2022-11-01 江苏淮海新能源股份有限公司 Dip soldering machine is used in production of machine controller control panel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103121140A (en) * 2013-03-04 2013-05-29 宁波恒升电气有限公司 Soldering tin melting furnace
CN103121140B (en) * 2013-03-04 2015-05-27 宁波恒升电气有限公司 Soldering tin melting furnace

Also Published As

Publication number Publication date
DE1807989B2 (en) 1972-07-27
DE1807989C3 (en) 1979-12-13
GB1269085A (en) 1972-03-29
FR2022675A1 (en) 1970-08-07
DE1807989A1 (en) 1970-05-27

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Legal Events

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