GB775366A - Semiconductor signal translating devices and methods of making them - Google Patents

Semiconductor signal translating devices and methods of making them

Info

Publication number
GB775366A
GB775366A GB13286/54A GB1328654A GB775366A GB 775366 A GB775366 A GB 775366A GB 13286/54 A GB13286/54 A GB 13286/54A GB 1328654 A GB1328654 A GB 1328654A GB 775366 A GB775366 A GB 775366A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
matrix
bond
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB13286/54A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB775366A publication Critical patent/GB775366A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
GB13286/54A 1953-05-11 1954-05-06 Semiconductor signal translating devices and methods of making them Expired GB775366A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US354026A US2705768A (en) 1953-05-11 1953-05-11 Semiconductor signal translating devices and method of fabrication

Publications (1)

Publication Number Publication Date
GB775366A true GB775366A (en) 1957-05-22

Family

ID=23391585

Family Applications (1)

Application Number Title Priority Date Filing Date
GB13286/54A Expired GB775366A (en) 1953-05-11 1954-05-06 Semiconductor signal translating devices and methods of making them

Country Status (6)

Country Link
US (1) US2705768A (en:Method)
BE (1) BE528676A (en:Method)
DE (1) DE960372C (en:Method)
FR (1) FR1097084A (en:Method)
GB (1) GB775366A (en:Method)
NL (2) NL186747B (en:Method)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB753136A (en) * 1953-08-28 1956-07-18 Standard Telephones Cables Ltd Improvements in or relating to light cells or rectifiers
US2860291A (en) * 1953-09-03 1958-11-11 Texas Instruments Inc Junction type transistor structure
US2850687A (en) * 1953-10-13 1958-09-02 Rca Corp Semiconductor devices
USRE25875E (en) * 1954-11-22 1965-10-12 Crystal diode
US2894184A (en) * 1955-06-29 1959-07-07 Hughes Aircraft Co Electrical characteristics of diodes
GB797304A (en) * 1955-12-19 1958-07-02 Gen Electric Co Ltd Improvements in or relating to the manufacture of semiconductor devices
US2805370A (en) * 1956-04-26 1957-09-03 Bell Telephone Labor Inc Alloyed connections to semiconductors
NL107648C (en:Method) * 1956-05-15
US2820135A (en) * 1956-09-05 1958-01-14 Pacific Semiconductors Inc Method for producing electrical contact to semiconductor devices
US2916604A (en) * 1957-09-20 1959-12-08 Philco Corp Fabrication of electrical units
US3091683A (en) * 1958-05-14 1963-05-28 Philips Corp Method of passing wire, cable sheath and the like through a wall
US2894112A (en) * 1958-08-27 1959-07-07 Western Electric Co Apparatus for attaching leads to orystals
US3005897A (en) * 1959-05-07 1961-10-24 Hoffman Electrouics Corp Heater control circuit for alloying apparatus
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
NL249359A (en:Method) * 1960-03-12
US3189801A (en) * 1960-11-04 1965-06-15 Microwave Ass Point contact semiconductor devices
US3159775A (en) * 1960-11-30 1964-12-01 Sylvania Electric Prod Semiconductor device and method of manufacture
US3165615A (en) * 1961-04-07 1965-01-12 Texas Instruments Inc Apparatus for forming clean iron-lead telluride high temperature pressure contacts
US3134699A (en) * 1961-07-25 1964-05-26 Nippon Electric Co Method of manufacturing semiconductor devices
BE624958A (en:Method) * 1961-11-20
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
NL134170C (en:Method) * 1963-12-17 1900-01-01
US3515840A (en) * 1965-10-20 1970-06-02 Gti Corp Diode sealer
US3432730A (en) * 1966-09-06 1969-03-11 Webb James E Semiconductor p-n junction stress and strain sensor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USB134657I5 (en:Method) * 1949-12-23
US2666150A (en) * 1950-05-04 1954-01-12 Ibm Crystal tetrode
US2654059A (en) * 1951-05-26 1953-09-29 Bell Telephone Labor Inc Semiconductor signal translating device

Also Published As

Publication number Publication date
DE960372C (de) 1957-03-21
FR1097084A (fr) 1955-06-29
BE528676A (en:Method) 1900-01-01
US2705768A (en) 1955-04-05
NL96840C (en:Method) 1900-01-01
NL186747B (nl)

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