NL96840C - - Google Patents

Info

Publication number
NL96840C
NL96840C NL96840DA NL96840C NL 96840 C NL96840 C NL 96840C NL 96840D A NL96840D A NL 96840DA NL 96840 C NL96840 C NL 96840C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Application granted granted Critical
Publication of NL96840C publication Critical patent/NL96840C/xx

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
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    • H01L2924/01055—Cesium [Cs]
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    • H01L2924/01068—Erbium [Er]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
NL96840D 1953-05-11 NL96840C (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US354026A US2705768A (en) 1953-05-11 1953-05-11 Semiconductor signal translating devices and method of fabrication

Publications (1)

Publication Number Publication Date
NL96840C true NL96840C (en:Method) 1900-01-01

Family

ID=23391585

Family Applications (2)

Application Number Title Priority Date Filing Date
NL96840D NL96840C (en:Method) 1953-05-11
NLAANVRAGE8001925,A NL186747B (nl) 1953-05-11 Inrichting voor het vervaardigen van samengestelde isolatieprofielen, in het bijzonder voor venster- en deurkozijnen, of gevels.

Family Applications After (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE8001925,A NL186747B (nl) 1953-05-11 Inrichting voor het vervaardigen van samengestelde isolatieprofielen, in het bijzonder voor venster- en deurkozijnen, of gevels.

Country Status (6)

Country Link
US (1) US2705768A (en:Method)
BE (1) BE528676A (en:Method)
DE (1) DE960372C (en:Method)
FR (1) FR1097084A (en:Method)
GB (1) GB775366A (en:Method)
NL (2) NL186747B (en:Method)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB753136A (en) * 1953-08-28 1956-07-18 Standard Telephones Cables Ltd Improvements in or relating to light cells or rectifiers
US2860291A (en) * 1953-09-03 1958-11-11 Texas Instruments Inc Junction type transistor structure
US2850687A (en) * 1953-10-13 1958-09-02 Rca Corp Semiconductor devices
USRE25875E (en) * 1954-11-22 1965-10-12 Crystal diode
US2894184A (en) * 1955-06-29 1959-07-07 Hughes Aircraft Co Electrical characteristics of diodes
GB797304A (en) * 1955-12-19 1958-07-02 Gen Electric Co Ltd Improvements in or relating to the manufacture of semiconductor devices
US2805370A (en) * 1956-04-26 1957-09-03 Bell Telephone Labor Inc Alloyed connections to semiconductors
NL107648C (en:Method) * 1956-05-15
US2820135A (en) * 1956-09-05 1958-01-14 Pacific Semiconductors Inc Method for producing electrical contact to semiconductor devices
US2916604A (en) * 1957-09-20 1959-12-08 Philco Corp Fabrication of electrical units
US3091683A (en) * 1958-05-14 1963-05-28 Philips Corp Method of passing wire, cable sheath and the like through a wall
US2894112A (en) * 1958-08-27 1959-07-07 Western Electric Co Apparatus for attaching leads to orystals
US3005897A (en) * 1959-05-07 1961-10-24 Hoffman Electrouics Corp Heater control circuit for alloying apparatus
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
NL249359A (en:Method) * 1960-03-12
US3189801A (en) * 1960-11-04 1965-06-15 Microwave Ass Point contact semiconductor devices
US3159775A (en) * 1960-11-30 1964-12-01 Sylvania Electric Prod Semiconductor device and method of manufacture
US3165615A (en) * 1961-04-07 1965-01-12 Texas Instruments Inc Apparatus for forming clean iron-lead telluride high temperature pressure contacts
US3134699A (en) * 1961-07-25 1964-05-26 Nippon Electric Co Method of manufacturing semiconductor devices
BE624958A (en:Method) * 1961-11-20
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
NL134170C (en:Method) * 1963-12-17 1900-01-01
US3515840A (en) * 1965-10-20 1970-06-02 Gti Corp Diode sealer
US3432730A (en) * 1966-09-06 1969-03-11 Webb James E Semiconductor p-n junction stress and strain sensor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USB134657I5 (en:Method) * 1949-12-23
US2666150A (en) * 1950-05-04 1954-01-12 Ibm Crystal tetrode
US2654059A (en) * 1951-05-26 1953-09-29 Bell Telephone Labor Inc Semiconductor signal translating device

Also Published As

Publication number Publication date
GB775366A (en) 1957-05-22
DE960372C (de) 1957-03-21
FR1097084A (fr) 1955-06-29
BE528676A (en:Method) 1900-01-01
US2705768A (en) 1955-04-05
NL186747B (nl)

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