GB690691A - Improvements relating to electrical resistors and printed circuits - Google Patents

Improvements relating to electrical resistors and printed circuits

Info

Publication number
GB690691A
GB690691A GB2778249A GB2778249A GB690691A GB 690691 A GB690691 A GB 690691A GB 2778249 A GB2778249 A GB 2778249A GB 2778249 A GB2778249 A GB 2778249A GB 690691 A GB690691 A GB 690691A
Authority
GB
United Kingdom
Prior art keywords
foil
layer
insulating support
oct
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2778249A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE503299D priority Critical patent/BE503299A/xx
Application filed by Individual filed Critical Individual
Priority to GB2778249A priority patent/GB690691A/en
Priority to US191629A priority patent/US2662957A/en
Priority to FR1040760D priority patent/FR1040760A/en
Priority to DET4263A priority patent/DE972845C/en
Priority to CH297158D priority patent/CH297158A/en
Publication of GB690691A publication Critical patent/GB690691A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0391—Using different types of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically

Abstract

690,691. Compound sheet materials. STRONG, H. V., and EISLER, P. Oct. 25, 1950. [Oct. 29, 1949] No. 27782/49. Drawings to Specification. Class 140. [Also in Group XXXVI] A multi-layer sheet material, for use in the production of printed electric circuits and resistors, comprises an insulating support, at least one layer of electrical resistance material adhering to the support, and a layer of highly conductive material adhering to the resistance material and in intimate electrical contact tlierewith. The material may be made by coating a sheet of copper foil with a mixture of colloidal graphite, water and bichromated fish glue. The coating is dried and heated to 350‹C. to burn the carbon into the foil. The coated side of the foil is then cemented to an insulating support such as impregnated paper. The highly conductive layer may alternatively consist of tinned copper foil, aluminium foil, zinc foil or silver foil, a convenient thickness being 0.002 inches. The resistance layer may also be of metal, lead, a niekel-chromium alloy and various other alloys being suitable, or various semiconductive materials, such as silicon, germanium or lead sulphide may be used. The insulating support is preferably flexible, and may consist of impregnated paper or fabric or a plastic film or varnish. The Provisional Specification refers to Specifications 639,658, 690,328 and 690,696, [all in Group XXXVI]
GB2778249A 1949-10-29 1949-10-29 Improvements relating to electrical resistors and printed circuits Expired GB690691A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
BE503299D BE503299A (en) 1949-10-29
GB2778249A GB690691A (en) 1949-10-29 1949-10-29 Improvements relating to electrical resistors and printed circuits
US191629A US2662957A (en) 1949-10-29 1950-10-23 Electrical resistor or semiconductor
FR1040760D FR1040760A (en) 1949-10-29 1951-04-27 Multi-layer material for electrical circuits and circuit components
DET4263A DE972845C (en) 1949-10-29 1951-05-05 Multi-layer film for the production of printed circuits or printed circuit elements
CH297158D CH297158A (en) 1949-10-29 1951-05-17 An electrical circuit element comprising at least one sheet of a multi-layered sheet material and a method of manufacturing this element.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2778249A GB690691A (en) 1949-10-29 1949-10-29 Improvements relating to electrical resistors and printed circuits

Publications (1)

Publication Number Publication Date
GB690691A true GB690691A (en) 1953-04-29

Family

ID=10265216

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2778249A Expired GB690691A (en) 1949-10-29 1949-10-29 Improvements relating to electrical resistors and printed circuits

Country Status (4)

Country Link
BE (1) BE503299A (en)
CH (1) CH297158A (en)
FR (1) FR1040760A (en)
GB (1) GB690691A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE952107C (en) * 1953-06-14 1956-11-08 Neosid Pemetzrieder G M B H Tray for the assembly of circuit elements in electrical devices in communications engineering
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
US5240582A (en) * 1992-04-01 1993-08-31 Gould Inc. Drum cathode for use in the production of metal foils and a method of producing the same
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US6489035B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US6489034B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
US6622374B1 (en) 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
CN114477786A (en) * 2022-02-23 2022-05-13 江苏铁锚玻璃股份有限公司 Transparent conductive glass and surface resistance increasing method thereof
CN115512919A (en) * 2022-08-18 2022-12-23 中国电子科技集团公司第二十九研究所 Preparation method of curved surface thin film resistor

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE977677C (en) * 1952-09-19 1968-04-04 Siemens Ag Front-contact electrical single-film capacitor
USRE35064E (en) * 1988-08-01 1995-10-17 Circuit Components, Incorporated Multilayer printed wiring board
US4908258A (en) * 1988-08-01 1990-03-13 Rogers Corporation High dielectric constant flexible sheet material
JP2764745B2 (en) * 1989-07-21 1998-06-11 オムロン株式会社 Hybrid circuit board and method of manufacturing the same
CN112105143A (en) * 2020-10-15 2020-12-18 河南博美通电子科技有限公司 Flexible circuit board structure with aluminum foil replacing high-polymer flexible film and preparation process

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE952107C (en) * 1953-06-14 1956-11-08 Neosid Pemetzrieder G M B H Tray for the assembly of circuit elements in electrical devices in communications engineering
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
US5240582A (en) * 1992-04-01 1993-08-31 Gould Inc. Drum cathode for use in the production of metal foils and a method of producing the same
US5372297A (en) * 1992-04-01 1994-12-13 Gould Electronics Inc. Drum cathode for use in the production of metal foils and a method of producing the same
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
US6489035B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Applying resistive layer onto copper
US6489034B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
US6622374B1 (en) 2000-09-22 2003-09-23 Gould Electronics Inc. Resistor component with multiple layers of resistive material
US6771160B2 (en) 2000-09-22 2004-08-03 Nikko Materials Usa, Inc. Resistor component with multiple layers of resistive material
CN114477786A (en) * 2022-02-23 2022-05-13 江苏铁锚玻璃股份有限公司 Transparent conductive glass and surface resistance increasing method thereof
CN114477786B (en) * 2022-02-23 2023-05-23 江苏铁锚玻璃股份有限公司 Transparent conductive glass and surface resistance increasing method thereof
CN115512919A (en) * 2022-08-18 2022-12-23 中国电子科技集团公司第二十九研究所 Preparation method of curved surface thin film resistor

Also Published As

Publication number Publication date
CH297158A (en) 1954-03-15
BE503299A (en)
FR1040760A (en) 1953-10-19

Similar Documents

Publication Publication Date Title
GB690691A (en) Improvements relating to electrical resistors and printed circuits
US2808352A (en) Electrically conductive adhesive tape
GB639178A (en) Manufacture of electric circuits and circuit components
EP0016230A4 (en) Substrate for flexible printed circuits and method of fabricating the same, and film.
JPS604557B2 (en) Barium titanate-based positive characteristic porcelain heating element with numerous through holes
JPS5584381A (en) Manufacture of pressure-sensitive adhesive type paper adhesive tape
US3355545A (en) Electrically conductive pressure sensitive adhesive tapes
JPS5586790A (en) Conductive recording material
JPS6258514A (en) Highly conducting compound resin film
GB1187503A (en) Improvements in or relating to Stencil Blanks Comprising Stencil Sheets Perforable by Electric Sparks
GB433790A (en) Electric resistance and method of producing same
JPS54141140A (en) Electro thermal heat sensitive recording system
FR2417233A1 (en) Flexible electric heating strip for laboratory use - has parallel supply electrodes along opposite edges of strip
JPS539839A (en) Preparation of ehat resistant pressure-sensitive tape
JPS5616574A (en) Self-adhesive sheet
SU486034A1 (en) Glue
JPS5284499A (en) Manufacturing for insulator
JPS57157792A (en) Surface coating layer
GB2008490A (en) Printed circuit substrate with resistance coat
GB992485A (en) A laminated strip material for recording and storing electronic charge images
JPS528831A (en) Support for recording sheet
GB488820A (en) Improvements relating to anti-icing devices for aircraft
GB747646A (en) Improvements in or relating to electrical de-icing equipment
JPS5422589A (en) Ultra-high voltage power cable
JPS54140537A (en) Electrostatic recording paper