GB690691A - Improvements relating to electrical resistors and printed circuits - Google Patents
Improvements relating to electrical resistors and printed circuitsInfo
- Publication number
- GB690691A GB690691A GB2778249A GB2778249A GB690691A GB 690691 A GB690691 A GB 690691A GB 2778249 A GB2778249 A GB 2778249A GB 2778249 A GB2778249 A GB 2778249A GB 690691 A GB690691 A GB 690691A
- Authority
- GB
- United Kingdom
- Prior art keywords
- foil
- layer
- insulating support
- oct
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Paper (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
Abstract
690,691. Compound sheet materials. STRONG, H. V., and EISLER, P. Oct. 25, 1950. [Oct. 29, 1949] No. 27782/49. Drawings to Specification. Class 140. [Also in Group XXXVI] A multi-layer sheet material, for use in the production of printed electric circuits and resistors, comprises an insulating support, at least one layer of electrical resistance material adhering to the support, and a layer of highly conductive material adhering to the resistance material and in intimate electrical contact tlierewith. The material may be made by coating a sheet of copper foil with a mixture of colloidal graphite, water and bichromated fish glue. The coating is dried and heated to 350‹C. to burn the carbon into the foil. The coated side of the foil is then cemented to an insulating support such as impregnated paper. The highly conductive layer may alternatively consist of tinned copper foil, aluminium foil, zinc foil or silver foil, a convenient thickness being 0.002 inches. The resistance layer may also be of metal, lead, a niekel-chromium alloy and various other alloys being suitable, or various semiconductive materials, such as silicon, germanium or lead sulphide may be used. The insulating support is preferably flexible, and may consist of impregnated paper or fabric or a plastic film or varnish. The Provisional Specification refers to Specifications 639,658, 690,328 and 690,696, [all in Group XXXVI]
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE503299D BE503299A (en) | 1949-10-29 | ||
GB2778249A GB690691A (en) | 1949-10-29 | 1949-10-29 | Improvements relating to electrical resistors and printed circuits |
US191629A US2662957A (en) | 1949-10-29 | 1950-10-23 | Electrical resistor or semiconductor |
FR1040760D FR1040760A (en) | 1949-10-29 | 1951-04-27 | Multi-layer material for electrical circuits and circuit components |
DET4263A DE972845C (en) | 1949-10-29 | 1951-05-05 | Multi-layer film for the production of printed circuits or printed circuit elements |
CH297158D CH297158A (en) | 1949-10-29 | 1951-05-17 | An electrical circuit element comprising at least one sheet of a multi-layered sheet material and a method of manufacturing this element. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2778249A GB690691A (en) | 1949-10-29 | 1949-10-29 | Improvements relating to electrical resistors and printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB690691A true GB690691A (en) | 1953-04-29 |
Family
ID=10265216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2778249A Expired GB690691A (en) | 1949-10-29 | 1949-10-29 | Improvements relating to electrical resistors and printed circuits |
Country Status (4)
Country | Link |
---|---|
BE (1) | BE503299A (en) |
CH (1) | CH297158A (en) |
FR (1) | FR1040760A (en) |
GB (1) | GB690691A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE952107C (en) * | 1953-06-14 | 1956-11-08 | Neosid Pemetzrieder G M B H | Tray for the assembly of circuit elements in electrical devices in communications engineering |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
US5240582A (en) * | 1992-04-01 | 1993-08-31 | Gould Inc. | Drum cathode for use in the production of metal foils and a method of producing the same |
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
US6489034B1 (en) | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Method of forming chromium coated copper for printed circuit boards |
US6489035B1 (en) | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Applying resistive layer onto copper |
US6622374B1 (en) | 2000-09-22 | 2003-09-23 | Gould Electronics Inc. | Resistor component with multiple layers of resistive material |
CN114477786A (en) * | 2022-02-23 | 2022-05-13 | 江苏铁锚玻璃股份有限公司 | Transparent conductive glass and surface resistance increasing method thereof |
CN115512919A (en) * | 2022-08-18 | 2022-12-23 | 中国电子科技集团公司第二十九研究所 | Preparation method of curved surface thin film resistor |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE977677C (en) * | 1952-09-19 | 1968-04-04 | Siemens Ag | Front-contact electrical single-film capacitor |
USRE35064E (en) * | 1988-08-01 | 1995-10-17 | Circuit Components, Incorporated | Multilayer printed wiring board |
US4908258A (en) * | 1988-08-01 | 1990-03-13 | Rogers Corporation | High dielectric constant flexible sheet material |
JP2764745B2 (en) * | 1989-07-21 | 1998-06-11 | オムロン株式会社 | Hybrid circuit board and method of manufacturing the same |
CN112105143A (en) * | 2020-10-15 | 2020-12-18 | 河南博美通电子科技有限公司 | Flexible circuit board structure with aluminum foil replacing high-polymer flexible film and preparation process |
-
0
- BE BE503299D patent/BE503299A/xx unknown
-
1949
- 1949-10-29 GB GB2778249A patent/GB690691A/en not_active Expired
-
1951
- 1951-04-27 FR FR1040760D patent/FR1040760A/en not_active Expired
- 1951-05-17 CH CH297158D patent/CH297158A/en unknown
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE952107C (en) * | 1953-06-14 | 1956-11-08 | Neosid Pemetzrieder G M B H | Tray for the assembly of circuit elements in electrical devices in communications engineering |
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
US5017271A (en) * | 1990-08-24 | 1991-05-21 | Gould Inc. | Method for printed circuit board pattern making using selectively etchable metal layers |
US5240582A (en) * | 1992-04-01 | 1993-08-31 | Gould Inc. | Drum cathode for use in the production of metal foils and a method of producing the same |
US5372297A (en) * | 1992-04-01 | 1994-12-13 | Gould Electronics Inc. | Drum cathode for use in the production of metal foils and a method of producing the same |
US6117300A (en) * | 1996-05-01 | 2000-09-12 | Honeywell International Inc. | Method for forming conductive traces and printed circuits made thereby |
US6489034B1 (en) | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Method of forming chromium coated copper for printed circuit boards |
US6489035B1 (en) | 2000-02-08 | 2002-12-03 | Gould Electronics Inc. | Applying resistive layer onto copper |
US6622374B1 (en) | 2000-09-22 | 2003-09-23 | Gould Electronics Inc. | Resistor component with multiple layers of resistive material |
US6771160B2 (en) | 2000-09-22 | 2004-08-03 | Nikko Materials Usa, Inc. | Resistor component with multiple layers of resistive material |
CN114477786A (en) * | 2022-02-23 | 2022-05-13 | 江苏铁锚玻璃股份有限公司 | Transparent conductive glass and surface resistance increasing method thereof |
CN114477786B (en) * | 2022-02-23 | 2023-05-23 | 江苏铁锚玻璃股份有限公司 | Transparent conductive glass and surface resistance increasing method thereof |
CN115512919A (en) * | 2022-08-18 | 2022-12-23 | 中国电子科技集团公司第二十九研究所 | Preparation method of curved surface thin film resistor |
Also Published As
Publication number | Publication date |
---|---|
CH297158A (en) | 1954-03-15 |
FR1040760A (en) | 1953-10-19 |
BE503299A (en) |
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