CN115512919A - Preparation method of curved surface thin film resistor - Google Patents
Preparation method of curved surface thin film resistor Download PDFInfo
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- CN115512919A CN115512919A CN202210990566.8A CN202210990566A CN115512919A CN 115512919 A CN115512919 A CN 115512919A CN 202210990566 A CN202210990566 A CN 202210990566A CN 115512919 A CN115512919 A CN 115512919A
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- 239000010409 thin film Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000003973 paint Substances 0.000 claims abstract description 51
- 238000005507 spraying Methods 0.000 claims abstract description 43
- 238000004544 sputter deposition Methods 0.000 claims abstract description 38
- 230000004913 activation Effects 0.000 claims abstract description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 33
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 239000002131 composite material Substances 0.000 claims description 19
- 239000010408 film Substances 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 11
- 229910021641 deionized water Inorganic materials 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 11
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000007733 ion plating Methods 0.000 claims description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- 239000012467 final product Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229920006351 engineering plastic Polymers 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 10
- 229920002530 polyetherether ketone Polymers 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a preparation method of a curved surface thin film resistor, which relates to the technical field of curved surface thin film resistors and comprises the following steps: s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object; s2, preparing a curved surface circuit by laser activation; s3, spraying strippable paint on the curved surface circuit; s4, removing strippable paint by laser to form a local protection area; s5, performing pretreatment; s6, sputtering to form a thin film resistor; and S7, removing the strippable paint. Compared with a chip resistor, the invention can avoid the complexity of manual welding of the dense resistor and the height of the protrusion.
Description
Technical Field
The invention relates to the technical field of curved surface thin film resistors, in particular to a preparation method of a curved surface thin film resistor.
Background
The integrated resistor on the traditional curved surface circuit is manually soldered by using a chip resistor prepared in advance to form electrical interconnection. The problem with this is: 1) When the chip resistance on the curved surface is small and dense, the manual tin soldering is unrealistic, and at present, curved surface welding equipment is almost absent; 2) The chip resistor has certain thickness, a protruding surface is obvious, the turnover is easy to bump, and interference can be formed during assembly.
The other curved surface resistor is prepared by manufacturing a circuit and a resistor on a flexible substrate in advance through a micro-printing process, and then bending the flexible substrate and attaching the flexible substrate to a mounting surface. The problem with this is: 1) The resistance value of the resistor can be changed by bending and is easy to damage; 2) The flexible substrate cannot be attached to an undeployed curved surface such as a spherical surface.
In order to solve this problem, it is studied to directly print the resistor paste on any curved surface by an ink-jet printing method. The advantage is that the flexibility is good, and the shortcoming is: 1) The fluid resistance paste is printed on the curved surface and can be continuously spread before being cured incompletely, so that the resistance value is influenced; 2) The printed build-up resistor still has a significant thickness.
Disclosure of Invention
The invention aims to provide a preparation method of a curved surface thin film resistor, which solves the technical problem that the thin film resistor is difficult to integrate on a curved surface circuit in the prior art.
The invention discloses a preparation method of a curved surface thin film resistor, which comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit;
s4, removing strippable paint by laser to form a local protection area;
s5, performing pretreatment;
s6, sputtering to form a thin film resistor;
and S7, removing the strippable paint to obtain the composite material.
Further, in step S1, the medium is engineering plastic.
Further, the medium is polyimide and/or polyether ether ketone.
Further, in the step S3, the strippable paint is chloroprene rubber, the viscosity is 40-50 cps, the thickness of each spray coating is 30-40 μm, the thickness of each spray coating is 4-6, and the total thickness is 120-200 μm.
Further, in step S3, the strippable paint is dried for 1.5-2 hours at 80 ℃ after being sprayed.
Further, in the step 4, a five-axis laser processing mode is adopted for removing the strippable paint by the laser, the laser wavelength is 1030nm, the power is 10-20 w, the overlapping rate of light spots is 0-100%, the frequency is 20-100 kHz, and the scanning speed is 0-800 mm/s.
Further, in step S5, the pretreatment includes a degreasing step and a stain removing step.
Further, the deoiling liquid used in the deoiling step is a NaOH solution with the mass concentration of 2-10%;
further, in step S5, the organic solvent used in the stain removing step is one or a combination of ethanol, acetone and butanone.
Furthermore, ultrasonic waves are added in the steps of oil removal and stain removal for 5-10 min.
And further, after the steps of oil removal and stain removal are finished, deionized water is adopted for washing for 5-10 min.
Further, in step S6, the sputtering step is to put the medium into a composite ion plating machine with a vacuum degree of 2 × 10 -3 ～9×10 -3 Pa, sputtering power of 150W-300W, sputtering pressure of 0.1-0.8 Pa, target base distance of 10-50 cm, and sputtering time of 160-500 min to obtain film resistor of 0.5-0.8 micron thickness.
Compared with the prior art, the invention has the beneficial effects that:
1. compared with a chip resistor, the invention can avoid the complexity of manual welding of the dense resistor and the height of the protrusion;
2. compared with the resistor on the flexible substrate, the invention can prepare the film resistor on any visible circuit curved surface;
3. compared with the ink-jet printing resistor, the invention can prepare the film resistor with accurate resistance.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention are described clearly and completely below, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments.
Example 1
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 mu m, the total thickness of each spraying is 180 mu m, and the curved surface circuit is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 15w, the overlapping rate of light spots is 60%, the frequency is 30kHz, and the scanning speed is 320mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion coating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 180W, the sputtering air pressure is 0.5Pa, the target substrate distance is 20cm, and the sputtering time is 200min, so that the thin film resistor with the thickness of 0.6 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
Example 2
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 12w, the overlapping rate of light spots is 60%, the frequency is 30kHz, and the scanning speed is 320mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion coating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 180W, the sputtering air pressure is 0.5Pa, the target substrate distance is 20cm, and the sputtering time is 200min, so that the thin film resistor with the thickness of 0.6 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
Example 3
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 21w, the overlapping rate of light spots is 60%, the frequency is 30kHz, and the scanning speed is 320mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 180W, the sputtering pressure is 0.5Pa, the target base distance is 20cm, and the sputtering time is 200min, so that a thin film resistor with the thickness of 0.6 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
Comparative example 1
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 mu m, the total thickness of each spraying is 180 mu m, and the curved surface circuit is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 10w, the overlapping rate of light spots is 50%, the frequency is 30kHz, and the scanning speed is 400mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 200W, the sputtering pressure is 0.5Pa, the target base distance is 25cm, and the sputtering time is 180min, so that a thin film resistor with the thickness of 0.5 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
Comparative example 2
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 30w, the overlapping rate of light spots is 50%, the frequency is 30kHz, and the scanning speed is 400mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 200W, the sputtering pressure is 0.5Pa, the target base distance is 25cm, and the sputtering time is 180min, so that a thin film resistor with the thickness of 0.5 mu m is obtained;
and S7, removing the strippable paint to obtain the final product.
Comparative example 3
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 15w, the overlapping rate of light spots is 50%, the frequency is 30kHz, and the scanning speed is 400mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic waves are added for 10min during oil removal and stain removal, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 200W, the sputtering air pressure is 0.5Pa, the target base distance is 25cm, and the sputtering time is 180min, so that the thin film resistor with the thickness of 0.5 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
Comparative example 4
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 15w, the overlapping rate of light spots is 60%, the frequency is 30kHz, and the scanning speed is 320mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 200W, the sputtering pressure is 0.5Pa, the target base distance is 25cm, and the sputtering time is 300min, so that a thin film resistor with the thickness of 0.8 mu m is obtained;
and S7, removing the strippable paint to obtain the final product.
Comparative example 5
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 15w, the overlapping rate of light spots is 60%, the frequency is 30kHz, and the scanning speed is 320mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic wave is added during oil removal and stain removal for 10min, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 200W, the sputtering pressure is 0.5Pa, the target base distance is 25cm, and the sputtering time is 180min, so that a thin film resistor with the thickness of 0.5 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
Comparative example 6
A preparation method of a curved surface thin film resistor comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object, wherein the medium is polyether-ether-ketone;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit, wherein the strippable paint is chloroprene rubber with the viscosity of 50cps, the thickness of each spraying is 40 microns, the total thickness of each spraying is 180 microns, and the coating is dried for 2 hours at 80 ℃ after the spraying is finished;
s4, removing strippable paint by laser to form a local protection area, and selecting a five-axis laser processing mode, wherein the laser wavelength is 1030nm, the power is 15w, the overlapping rate of light spots is 60%, the frequency is 30kHz, and the scanning speed is 320mm/s;
s5, performing pretreatment, including oil removal and stain removal steps, wherein the deoiling liquid is a NaOH solution with the mass concentration of 8%; the organic solvent for removing the stains is ethanol; ultrasonic waves are added for 10min during oil removal and stain removal, and then deionized water is adopted for washing for 10min;
s6, putting the medium into a composite ion plating machine, wherein the vacuum degree is 5 multiplied by 10 < -3 >, the sputtering power is 160W, the sputtering pressure is 0.5Pa, the target base distance is 25cm, and the sputtering time is 180min, so that a thin film resistor with the thickness of 0.5 mu m is obtained;
and S7, removing the strippable paint to obtain the composite material.
TABLE 1 Effect table of key parameters
The above embodiments are exemplified by the present embodiment, but the present embodiment is not limited to the above optional embodiments, and persons skilled in the art can obtain other various embodiments by arbitrarily combining the above embodiments, and any person can obtain other various embodiments based on the teaching of the present embodiment. The above detailed description should not be construed as limiting the scope of the present embodiments, which should be defined in the claims, and the description should be used for interpreting the claims.
Claims (10)
1. A preparation method of a curved surface film resistor is characterized by comprising the following steps: the method comprises the following steps:
s1, designing a three-dimensional structure of a medium and a conformal circuit on the surface of the medium according to an application object;
s2, preparing a curved surface circuit by laser activation;
s3, spraying strippable paint on the curved surface circuit;
s4, removing strippable paint by laser to form a local protection area;
s5, performing pretreatment;
s6, sputtering to form a thin film resistor;
and S7, removing the strippable paint to obtain the final product.
2. The method for preparing the curved surface film resistor according to claim 1, wherein the method comprises the following steps: in step S1, the medium is engineering plastic.
3. The method for preparing the curved surface film resistor according to claim 1, wherein the method comprises the following steps: in the step S3, the strippable paint is chloroprene rubber, the viscosity is 40-50 cps, the thickness of each spraying is 30-40 microns, the number of the spraying is 4-6, and the total thickness is 120-200 microns.
4. The method for preparing the curved surface film resistor according to claim 1, wherein in the step S3, the strippable paint is dried at 80 ℃ for 1.5-2 hours after being sprayed.
5. The method for preparing the curved surface film resistor according to claim 1, wherein the method comprises the following steps: in the step 4, a five-axis laser processing mode is adopted for removing the strippable paint by the laser, the laser wavelength is 1030nm, the power is 10-20 w, the overlapping rate of light spots is 0-100%, the frequency is 20-100 kHz, and the scanning speed is 0-800 mm/s.
6. The method for preparing the curved surface film resistor according to claim 1, wherein the method comprises the following steps: in step S5, the pretreatment comprises the steps of oil removal and stain removal.
7. The method for preparing the curved surface film resistor according to claim 6, wherein the method comprises the following steps: the deoiling liquid used in the deoiling step is a NaOH solution with the mass concentration of 2-10%.
8. The method for manufacturing the curved surface film resistor according to claim 6, wherein the method comprises the following steps: in the step S5, the organic solvent used in the stain removing step is one or a combination of ethanol, acetone and butanone.
9. The method for manufacturing the curved surface film resistor according to claim 6, wherein the method comprises the following steps: after the steps of oil removal and stain removal are finished, deionized water is adopted for washing for 5-10 min.
10. The method for preparing the curved surface film resistor according to claim 1, wherein the method comprises the following steps: in step S6, the sputtering step is to put the medium into a composite ion plating machine, the vacuum degree is 2 x 10 < -3 > to 9 x 10 < -3 > Pa, the sputtering power is 150W to 300W, the sputtering air pressure is 0.1 to 0.8Pa, the target base distance is 10 to 50cm, and the sputtering time is 160 to 500min, so that the film resistor with the thickness of 0.5 to 0.8 mu m is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210990566.8A CN115512919A (en) | 2022-08-18 | 2022-08-18 | Preparation method of curved surface thin film resistor |
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| CN202210990566.8A CN115512919A (en) | 2022-08-18 | 2022-08-18 | Preparation method of curved surface thin film resistor |
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| CN202210990566.8A Pending CN115512919A (en) | 2022-08-18 | 2022-08-18 | Preparation method of curved surface thin film resistor |
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| CN (1) | CN115512919A (en) |
Citations (13)
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| CN109774132A (en) * | 2019-03-04 | 2019-05-21 | 东南大学 | A kind of manufacturing method of the circuit board based on photocuring 3D printing technique |
| CN109788642A (en) * | 2019-03-04 | 2019-05-21 | 深圳市柔纬联科技有限公司 | RC flexible circuit device and wearable device |
| EP3709778A1 (en) * | 2019-03-11 | 2020-09-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a three-dimensional switch holder |
| CN114737176A (en) * | 2022-03-11 | 2022-07-12 | 中国电子科技集团公司第二十九研究所 | Protection method for precise local plating |
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2022
- 2022-08-18 CN CN202210990566.8A patent/CN115512919A/en active Pending
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|---|---|---|---|---|
| GB690691A (en) * | 1949-10-29 | 1953-04-29 | Harold Vezey Strong | Improvements relating to electrical resistors and printed circuits |
| JPH0629015A (en) * | 1991-06-13 | 1994-02-04 | Hokuriku Electric Ind Co Ltd | Flexible circuit board and its manufacture |
| JPH06334308A (en) * | 1993-05-19 | 1994-12-02 | Japan Aviation Electron Ind Ltd | Method for forming three-dimensional circuit |
| JP2004056097A (en) * | 2002-05-27 | 2004-02-19 | Nec Corp | Thin film capacitor, combined passive component including the thin film capacitor, method of manufacturing same, and wiring board including same |
| JP2004096018A (en) * | 2002-09-03 | 2004-03-25 | Seiko Epson Corp | Manufacturing method for circuit substrate, electrooptical apparatus, and electronic appliance |
| CN103358800A (en) * | 2013-08-05 | 2013-10-23 | 格林精密部件（惠州）有限公司 | High-efficiency energy-saving laser graphic processing process for electronic products |
| CN103596374A (en) * | 2013-11-07 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Method for forming conducting line on flexible circuit board |
| CN104244588A (en) * | 2014-04-30 | 2014-12-24 | 深圳光韵达光电科技股份有限公司 | Three-dimensional circuit manufacturing method and modified laser sintering powder materials |
| RU2583952C1 (en) * | 2015-01-26 | 2016-05-10 | Открытое акционерное общество "Научно-производственное объединение "ЭРКОН" (ОАО "НПО "ЭРКОН") | Method for producing thin film resistor |
| CN109774132A (en) * | 2019-03-04 | 2019-05-21 | 东南大学 | A kind of manufacturing method of the circuit board based on photocuring 3D printing technique |
| CN109788642A (en) * | 2019-03-04 | 2019-05-21 | 深圳市柔纬联科技有限公司 | RC flexible circuit device and wearable device |
| EP3709778A1 (en) * | 2019-03-11 | 2020-09-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a three-dimensional switch holder |
| CN114737176A (en) * | 2022-03-11 | 2022-07-12 | 中国电子科技集团公司第二十九研究所 | Protection method for precise local plating |
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