GB645183A - Method and apparatus for electro-plating - Google Patents

Method and apparatus for electro-plating

Info

Publication number
GB645183A
GB645183A GB30268/48D GB3026848D GB645183A GB 645183 A GB645183 A GB 645183A GB 30268/48 D GB30268/48 D GB 30268/48D GB 3026848 D GB3026848 D GB 3026848D GB 645183 A GB645183 A GB 645183A
Authority
GB
United Kingdom
Prior art keywords
slot
article
per cent
box
shells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30268/48D
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cleveland Graphite Bronze Co
Original Assignee
Cleveland Graphite Bronze Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cleveland Graphite Bronze Co filed Critical Cleveland Graphite Bronze Co
Publication of GB645183A publication Critical patent/GB645183A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

645,183. Work support for electrolytic deposition of metals. CLEVELAND GRAPHITE BRONZE CO. Oct. 10, 1946, No. 30268. Convention date, June 29. [Class 41] A uniform layer of metal is electrodeposited upon a concave surface of a semi-cylindrical article such as a bearing surface; by placing the article in a closed box mounted vertically in an electrolyte and having a relatively narrow slot disposed centrally and vertically of the side facing the concave surface of the article, the slot being provided with inwardly extending flanges at the inner edge thereof. As shown, a box 28 of insulating material for instance of hard rubber has a slot 6 relatively narrow compared to its length, disposed centrally in the side which faces the concave surface of the article 1, e.g. a stack of bearing shells when placed: in position within the box and centrally with respect to the slot. The slot is bounded by flanges 20 (see Fig. 4), extending inwardly towards the article 1. The width A of the slot the internal depth B of the flange and the width C of the flange are critically related to obtain a deposit in which the variation in thickness from side to side is not more than 5 per cent. For normal voltage, viz. 6-12 volts, the dimensions of the flanges in terms of percentages of the bearing shell diameters are A=25-38 per cent, B=3-4 per cent, C=6-10 per cent. The slot 6 terminates at a distance just short of the end of the stack or bottom of the box (see Fig. 5), so as to leave a slight ledge 18 to prevent " end effect '' in the electrodeposition process. With the above values of A, B and C, the height of the ledge is 2-8 per cent of the shell diameter. At the top of the box 28 the slot 6 is flush with the upper edge 9, the article 1 or an insulating plate may rest on the top of the article and extend through the slot. To prevent a heavier deposit on the lower 4¥ inches of the shell 1 a shadow is inserted in that portion of the slot 6, and may be in the form of a right-angled triangle on either side the slot 6, causing the slot to taper so as to restrict the area of the slot in the lower portion thereof by approximately 10 per cent. The shells 1 are maintained in the stacked relationship by means of a contact brought into position against a blank half shell mounted on the top of the stack and pressed down by spring 55 and current is fed to the contact plate by conductor 27. The box may be suspended in the bath by a hook 30. A removable cover 24 is held in place by a ring 29 engaging an extending portion at the bottom and by a spring 40 and releasing cam 31 at the top. A thief electrode or robber element 32 located between the shells 1 and the cover 24 prevents deposition of metal on the convex surface of the shells. The metal may be deposited at a current density of 20 amps./sq. foot, voltage 6-8 volts from a bath consisting of the following, given in grams/litre. Lead 100 to 110, hydrofluoric acid 40 to 50, total tin 8 to 12, resorcinal 1 to 5 copper, in the form of soluble salts, 1 to 3, and gelatine 0.1 minimum. The anode may be composed of 10 per cent tin with remainder lead, the anode bars being placed around the periphery of the plating bath. Specification 627,294 is referred to.
GB30268/48D 1946-06-29 1946-10-10 Method and apparatus for electro-plating Expired GB645183A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US680380A US2500206A (en) 1946-06-29 1946-06-29 Apparatus for plating

Publications (1)

Publication Number Publication Date
GB645183A true GB645183A (en) 1950-10-25

Family

ID=24730858

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30268/48D Expired GB645183A (en) 1946-06-29 1946-10-10 Method and apparatus for electro-plating

Country Status (3)

Country Link
US (1) US2500206A (en)
FR (1) FR1010239A (en)
GB (1) GB645183A (en)

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US2727858A (en) * 1952-04-07 1955-12-20 Gen Motors Corp Plating fixture
US2761831A (en) * 1952-05-17 1956-09-04 Gen Motors Corp Electroplating fixture
US2739117A (en) * 1952-06-18 1956-03-20 Gen Motors Corp Electroplating fixture
GB730238A (en) * 1952-10-17 1955-05-18 Clevite Ltd Method of and apparatus for electroplating
US2801963A (en) * 1953-12-08 1957-08-06 Ann F Hull Apparatus for the determination of plating characteristics of plating baths
US2913170A (en) * 1954-07-16 1959-11-17 Phillips Petroleum Co Electrolytic analogue for approximately simulating extensions in space to infinity
US2944945A (en) * 1955-07-29 1960-07-12 Gen Motors Corp Electroplating
US2859166A (en) * 1955-09-15 1958-11-04 Pennsalt Chemicals Corp Shielding means for effecting uniform plating of lead dioxide in the formation of lead dioxide electrodes
US3226308A (en) * 1961-06-15 1965-12-28 Clevite Corp Electrochemical treating method and apparatus
US3133007A (en) * 1961-06-29 1964-05-12 Federal Mogul Bower Bearings Plating apparatus
US3282824A (en) * 1962-12-17 1966-11-01 Federal Mogul Bower Bearings Dual sided plating rack
US3290239A (en) * 1963-07-12 1966-12-06 Federal Mogul Corp Box plating rack
US3331764A (en) * 1964-02-24 1967-07-18 Federal Mogul Corp Box-type plating rack
US3929592A (en) * 1974-07-22 1975-12-30 Gen Motors Corp Plating apparatus and method for rotary engine housings
US4595480A (en) * 1985-09-26 1986-06-17 National Semiconductor Corporation System for electroplating molded semiconductor devices
US4950375A (en) * 1989-05-26 1990-08-21 United Technologies Corporation Die for electroforming a part
US5200048A (en) * 1989-11-30 1993-04-06 Daido Metal Company Ltd. Electroplating apparatus for plating half bearings
JPH0781199B2 (en) * 1989-11-30 1995-08-30 大同メタル工業株式会社 Method and apparatus for surface treatment of intermediate product of half type slide bearing
KR20010020807A (en) * 1999-05-03 2001-03-15 조셉 제이. 스위니 Pre-conditioning fixed abrasive articles
US6991528B2 (en) * 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7670468B2 (en) * 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7678245B2 (en) * 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7029365B2 (en) * 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7125477B2 (en) * 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20050092621A1 (en) * 2000-02-17 2005-05-05 Yongqi Hu Composite pad assembly for electrochemical mechanical processing (ECMP)
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US6321712B1 (en) 2000-04-07 2001-11-27 Dana Corporation Racing engine having trimetal bearings with a thick overlay for high speed and/or high load applications
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US20050194681A1 (en) * 2002-05-07 2005-09-08 Yongqi Hu Conductive pad with high abrasion
US20050178666A1 (en) * 2004-01-13 2005-08-18 Applied Materials, Inc. Methods for fabrication of a polishing article
US20060030156A1 (en) * 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US7084064B2 (en) * 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
WO2006039436A2 (en) * 2004-10-01 2006-04-13 Applied Materials, Inc. Pad design for electrochemical mechanical polishing
US7520968B2 (en) * 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US20060219663A1 (en) * 2005-03-31 2006-10-05 Applied Materials, Inc. Metal CMP process on one or more polishing stations using slurries with oxidizers
US7427340B2 (en) * 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
TW200720494A (en) * 2005-11-01 2007-06-01 Applied Materials Inc Ball contact cover for copper loss reduction and spike reduction
US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
DE102010000853A1 (en) 2010-01-13 2011-07-14 Federal-Mogul Wiesbaden GmbH, 65201 Holder for galvanic coating of plain bearings and tools with a holder
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US1519572A (en) * 1923-07-13 1924-12-16 Wmf Wuerttemberg Metallwaren Electroplating
US1872221A (en) * 1926-10-28 1932-08-16 Frink Corp Method and apparatus for forming molds and articles produced thereby
US2073679A (en) * 1935-02-05 1937-03-16 Western Electric Co Electroplating apparatus
US2316609A (en) * 1940-04-09 1943-04-13 Western Electric Co Article supporting rack
US2362228A (en) * 1941-06-12 1944-11-07 Bell Telephone Labor Inc Method of forming contacts on metal oxide-metal rectifiers
US2434417A (en) * 1943-10-25 1948-01-13 Cherry Rivet Company Small parts holder for electrolytic baths

Also Published As

Publication number Publication date
FR1010239A (en) 1952-06-09
US2500206A (en) 1950-03-14

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