GB624898A - Improvements in or relating to the electroplating of copper - Google Patents

Improvements in or relating to the electroplating of copper

Info

Publication number
GB624898A
GB624898A GB5804/47A GB580447A GB624898A GB 624898 A GB624898 A GB 624898A GB 5804/47 A GB5804/47 A GB 5804/47A GB 580447 A GB580447 A GB 580447A GB 624898 A GB624898 A GB 624898A
Authority
GB
United Kingdom
Prior art keywords
betaine
trimethyl
copper
alpha
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5804/47A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB624898A publication Critical patent/GB624898A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

624,898. Electrodeposition of copper. DU PONT DE NEMOURS & CO., E. I. Feb. 28, 1947, No. 5804. Convention date, Feb. 28, 1946. [Class 41] A bath for copper electro-plating comprises an aqueous copper-alkali metal cyanide solution containing as addition agent a non-heterocyclic quaternary ammonium compound in which four hydrocarbon radicals are directly attached to a pentavalent nitrogen atom. The bath may also contain a betaine having at least one acyclic hydrocarbon radical containing from 10 to 20, preferably from 10 to 16, carbon atoms. The preferred ammonium compounds are trimethyl benzyl ammonium hydroxide, trimethyl phenyl ammonium hydroxide and the corresponding halides, particularly the chlorides. The preferred betaines are trimethyl-C-cetyl alpha betaine, trimethyl-C-decyl alpha betaine and dimethyl-N-lauryl alpha betaine. Alkali metal sulphocyanides may also be used in addition to the ammonium compounds, with or without the betaines. Specification 528,762 is referred to.
GB5804/47A 1946-02-28 1947-02-28 Improvements in or relating to the electroplating of copper Expired GB624898A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US651042A US2541700A (en) 1946-02-28 1946-02-28 Electroplating copper

Publications (1)

Publication Number Publication Date
GB624898A true GB624898A (en) 1949-06-17

Family

ID=24611358

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5804/47A Expired GB624898A (en) 1946-02-28 1947-02-28 Improvements in or relating to the electroplating of copper

Country Status (2)

Country Link
US (1) US2541700A (en)
GB (1) GB624898A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694677A (en) * 1949-11-10 1954-11-16 Barnet D Ostrow Bright copper plating bath
US2737485A (en) * 1952-09-22 1956-03-06 Gen Motors Corp Electrodeposition of copper
DE934508C (en) * 1954-04-23 1955-10-27 Dehydag Gmbh Process for the production of galvanic metal coatings
US3030282A (en) * 1961-05-02 1962-04-17 Metal & Thermit Corp Electrodeposition of copper
US3160526A (en) * 1961-09-26 1964-12-08 Electric Storage Battery Co Alkaline storage battery and electrolyte
US3309293A (en) * 1964-11-16 1967-03-14 Elechem Corp Copper cyanide electroplating bath

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1536859A (en) * 1924-06-05 1925-05-05 Udylite Process Company Electroplating
DE601036C (en) * 1933-04-20 1934-08-07 Friedrich Jorre Dr Process for the production of metal deposits
US2195454A (en) * 1939-01-07 1940-04-02 Louis Weisberg Inc Electrodeposition of copper
US2255057A (en) * 1939-10-02 1941-09-09 Du Pont Electroplating copper
US2315802A (en) * 1940-04-20 1943-04-06 Harshaw Chem Corp Nickel plating
US2474092A (en) * 1943-10-11 1949-06-21 Battelle Development Corp Composition for and method of electrodeposition of lead

Also Published As

Publication number Publication date
US2541700A (en) 1951-02-13

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