GB2543682B - Epitaxial structure for improving efficiency drop of GaN-based LED - Google Patents
Epitaxial structure for improving efficiency drop of GaN-based LEDInfo
- Publication number
- GB2543682B GB2543682B GB1700942.4A GB201700942A GB2543682B GB 2543682 B GB2543682 B GB 2543682B GB 201700942 A GB201700942 A GB 201700942A GB 2543682 B GB2543682 B GB 2543682B
- Authority
- GB
- United Kingdom
- Prior art keywords
- gan
- epitaxial structure
- improving efficiency
- based led
- efficiency drop
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
- H01L33/325—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen characterised by the doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410356966.9A CN104134732B (en) | 2014-07-24 | 2014-07-24 | It is a kind of to improve the epitaxial structure that GaN base LED efficiency declines |
PCT/CN2015/084486 WO2016011924A1 (en) | 2014-07-24 | 2015-07-20 | EPITAXIAL STRUCTURE FOR IMPROVING EFFICIENCY DROP OF GaN-BASED LED |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201700942D0 GB201700942D0 (en) | 2017-03-08 |
GB2543682A GB2543682A (en) | 2017-04-26 |
GB2543682B true GB2543682B (en) | 2019-04-17 |
Family
ID=51807333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1700942.4A Expired - Fee Related GB2543682B (en) | 2014-07-24 | 2015-07-20 | Epitaxial structure for improving efficiency drop of GaN-based LED |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN104134732B (en) |
DE (1) | DE112015003419T5 (en) |
GB (1) | GB2543682B (en) |
WO (1) | WO2016011924A1 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104134732B (en) * | 2014-07-24 | 2017-09-19 | 映瑞光电科技(上海)有限公司 | It is a kind of to improve the epitaxial structure that GaN base LED efficiency declines |
CN104638082B (en) * | 2015-02-04 | 2017-10-13 | 映瑞光电科技(上海)有限公司 | The preparation method of low-voltage GaN base LED epitaxial structures |
CN105405939B (en) * | 2015-12-02 | 2018-01-12 | 华灿光电(苏州)有限公司 | A kind of light emitting diode and its manufacture method |
CN105514235A (en) * | 2015-12-25 | 2016-04-20 | 扬州德豪润达光电有限公司 | Multiple-quantum well structure for optoelectronic device |
CN105789391B (en) * | 2016-04-28 | 2018-06-26 | 聚灿光电科技(宿迁)有限公司 | GaN base LED epitaxial structure and its manufacturing method |
CN105870269B (en) * | 2016-05-26 | 2018-08-28 | 湘能华磊光电股份有限公司 | Improve the LED epitaxial growing method of hole injection |
CN105932118B (en) * | 2016-06-13 | 2018-01-30 | 湘能华磊光电股份有限公司 | Improve the LED epitaxial growth methods of hole injection |
CN106299052B (en) * | 2016-09-22 | 2018-11-27 | 绍兴市上虞宜美照明电器有限公司 | A kind of GaN epitaxial structure and preparation method for LED |
CN107204391B (en) * | 2017-05-24 | 2018-12-28 | 湘能华磊光电股份有限公司 | A kind of LED epitaxial growth method |
CN107146836A (en) * | 2017-05-26 | 2017-09-08 | 华南理工大学 | GaN base green light LED epitaxial structure with gradual change In component p-type InGaN conductive layers and preparation method thereof |
CN110098293B (en) * | 2019-04-26 | 2021-03-19 | 中国电子科技集团公司第三十八研究所 | LED structure with heteroepitaxy NIP junction type multi-quantum well light-emitting layer terminal |
CN110783432B (en) * | 2019-11-04 | 2022-02-22 | 马鞍山杰生半导体有限公司 | Ultraviolet LED epitaxial wafer and preparation method thereof |
CN111710762B (en) * | 2020-06-28 | 2021-10-15 | 中国科学院半导体研究所 | Group III nitride optoelectronic devices with p-type polarization doping |
CN112467004B (en) * | 2020-10-31 | 2022-06-07 | 扬州大学 | GaN-based LED epitaxial structure containing electronic storage layer and growth method thereof |
CN112436079A (en) * | 2020-10-31 | 2021-03-02 | 扬州大学 | GaN-based LED epitaxial structure of inverted triangular potential barrier and growth method thereof |
CN114038956A (en) * | 2021-03-16 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Light emitting chip and epitaxial structure thereof |
CN113410345B (en) * | 2021-06-15 | 2022-08-26 | 厦门士兰明镓化合物半导体有限公司 | Ultraviolet semiconductor light emitting element |
CN115224171B (en) * | 2022-09-20 | 2022-11-29 | 江西兆驰半导体有限公司 | High-light-efficiency light-emitting diode epitaxial wafer, preparation method thereof and light-emitting diode |
CN115347097B (en) * | 2022-10-18 | 2023-03-14 | 江西兆驰半导体有限公司 | Light emitting diode epitaxial wafer and preparation method thereof |
CN117410413B (en) * | 2023-12-14 | 2024-03-08 | 江西兆驰半导体有限公司 | LED epitaxial wafer and preparation method thereof |
CN117810325B (en) * | 2024-02-29 | 2024-05-28 | 江西兆驰半导体有限公司 | High-light-efficiency light-emitting diode epitaxial wafer and preparation method thereof |
CN118431366B (en) * | 2024-07-04 | 2024-09-20 | 江西兆驰半导体有限公司 | LED epitaxial wafer, preparation method thereof and LED |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002208732A (en) * | 1994-09-19 | 2002-07-26 | Toshiba Corp | Compound semiconductor device |
CN101359710A (en) * | 2008-09-25 | 2009-02-04 | 上海蓝光科技有限公司 | Manufacturing method of green light LED |
CN102185054A (en) * | 2011-04-02 | 2011-09-14 | 映瑞光电科技(上海)有限公司 | Light-emitting diode (LED) and manufacturing method thereof |
CN102782808A (en) * | 2009-12-10 | 2012-11-14 | 同和电子科技有限公司 | P-type AlGaN layer, method for producing same and group III nitride semiconductor light-emitting element |
CN102969416A (en) * | 2012-11-01 | 2013-03-13 | 扬州中科半导体照明有限公司 | Nitride light-emitting diode (LED) epitaxial wafer and growing method thereof |
CN104134732A (en) * | 2014-07-24 | 2014-11-05 | 映瑞光电科技(上海)有限公司 | Epitaxial structure for solving efficiency drop of GaN-based LED (Light Emitting Diode) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7326963B2 (en) * | 2004-12-06 | 2008-02-05 | Sensor Electronic Technology, Inc. | Nitride-based light emitting heterostructure |
KR101018088B1 (en) * | 2008-11-07 | 2011-02-25 | 삼성엘이디 주식회사 | Nitride Semiconductor Device |
CN102157646A (en) * | 2011-05-03 | 2011-08-17 | 映瑞光电科技(上海)有限公司 | Nitride LED structure and preparation method thereof |
US20140077153A1 (en) * | 2012-09-14 | 2014-03-20 | Tsmc Solid State Lighting Ltd. | Photonic Devices with Embedded Hole Injection Layer to Improve Efficiency and Droop Rate |
-
2014
- 2014-07-24 CN CN201410356966.9A patent/CN104134732B/en not_active Expired - Fee Related
-
2015
- 2015-07-20 WO PCT/CN2015/084486 patent/WO2016011924A1/en active Application Filing
- 2015-07-20 GB GB1700942.4A patent/GB2543682B/en not_active Expired - Fee Related
- 2015-07-20 DE DE112015003419.6T patent/DE112015003419T5/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002208732A (en) * | 1994-09-19 | 2002-07-26 | Toshiba Corp | Compound semiconductor device |
CN101359710A (en) * | 2008-09-25 | 2009-02-04 | 上海蓝光科技有限公司 | Manufacturing method of green light LED |
CN102782808A (en) * | 2009-12-10 | 2012-11-14 | 同和电子科技有限公司 | P-type AlGaN layer, method for producing same and group III nitride semiconductor light-emitting element |
CN102185054A (en) * | 2011-04-02 | 2011-09-14 | 映瑞光电科技(上海)有限公司 | Light-emitting diode (LED) and manufacturing method thereof |
CN102969416A (en) * | 2012-11-01 | 2013-03-13 | 扬州中科半导体照明有限公司 | Nitride light-emitting diode (LED) epitaxial wafer and growing method thereof |
CN104134732A (en) * | 2014-07-24 | 2014-11-05 | 映瑞光电科技(上海)有限公司 | Epitaxial structure for solving efficiency drop of GaN-based LED (Light Emitting Diode) |
Also Published As
Publication number | Publication date |
---|---|
GB201700942D0 (en) | 2017-03-08 |
DE112015003419T5 (en) | 2017-05-11 |
WO2016011924A1 (en) | 2016-01-28 |
CN104134732A (en) | 2014-11-05 |
CN104134732B (en) | 2017-09-19 |
GB2543682A (en) | 2017-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20200720 |