GB2519253A - Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation - Google Patents

Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation Download PDF

Info

Publication number
GB2519253A
GB2519253A GB201500847A GB201500847A GB2519253A GB 2519253 A GB2519253 A GB 2519253A GB 201500847 A GB201500847 A GB 201500847A GB 201500847 A GB201500847 A GB 201500847A GB 2519253 A GB2519253 A GB 2519253A
Authority
GB
United Kingdom
Prior art keywords
heat
increased surface
nano
surface area
power dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB201500847A
Other versions
GB201500847D0 (en
Inventor
Victor A Rivas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB201500847D0 publication Critical patent/GB201500847D0/en
Publication of GB2519253A publication Critical patent/GB2519253A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Microprocessor, miniprocessor and heat sink surfaces having increased surface areas and increased heat dissipation are femtosecond pulsed laser machined. Nano structures formed and created on surfaces by the femtosecond pulsed laser machining provide increased surface areas which radiate heat by intensified IR radiation.
GB201500847A 2012-08-06 2012-08-06 Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation Withdrawn GB2519253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/049694 WO2014025332A1 (en) 2012-08-06 2012-08-06 Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation

Publications (2)

Publication Number Publication Date
GB201500847D0 GB201500847D0 (en) 2015-03-04
GB2519253A true GB2519253A (en) 2015-04-15

Family

ID=50068435

Family Applications (1)

Application Number Title Priority Date Filing Date
GB201500847A Withdrawn GB2519253A (en) 2012-08-06 2012-08-06 Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation

Country Status (8)

Country Link
JP (1) JP2015530925A (en)
KR (1) KR20150046015A (en)
CN (1) CN104603714A (en)
BR (1) BR112015002627A2 (en)
CA (1) CA2880490A1 (en)
DE (1) DE112012006782T5 (en)
GB (1) GB2519253A (en)
WO (1) WO2014025332A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10106880B2 (en) 2013-12-31 2018-10-23 The United States Of America, As Represented By The Secretary Of The Navy Modifying the surface chemistry of a material
US10189117B2 (en) 2013-12-31 2019-01-29 The United States Of America, As Represented By The Secretary Of The Navy Adhesion improvement via material nanostructuring or texturizing
KR102194694B1 (en) * 2019-12-31 2020-12-24 한국과학기술원 Integrated inspection system using thermography and laser ultrasonic in 3D printing process and 3D printing system having the same
WO2023129629A1 (en) 2021-12-29 2023-07-06 PlasmaTex, LLC Pulsed laser processing of medical devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157234A1 (en) * 2005-01-14 2006-07-20 Honeywell International Inc. Microchannel heat exchanger fabricated by wire electro-discharge machining
US20080299408A1 (en) * 2006-09-29 2008-12-04 University Of Rochester Femtosecond Laser Pulse Surface Structuring Methods and Materials Resulting Therefrom
US20100099268A1 (en) * 2005-04-08 2010-04-22 Timans Paul J Rapid Thermal Processing using Energy Transfer Layers
US20120085526A1 (en) * 2010-08-19 2012-04-12 Fu-Lin Yeh Heat sink

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4263865B2 (en) * 2002-01-22 2009-05-13 独立行政法人科学技術振興機構 Fine processing method using ultra-short pulse laser and processed product
CH705707B1 (en) * 2004-06-08 2013-05-15 Lvmh Swiss Mft Sa A method of manufacturing components of synchronous and asynchronous transmission and components of synchronous and asynchronous transmission obtained according to this method.
CN2713533Y (en) * 2004-06-11 2005-07-27 庆扬资讯股份有限公司 Radiating device for micro-computer
JP2009255141A (en) * 2008-04-18 2009-11-05 Osaka Univ High-efficiency hydrogen-storing metallic material and method for manufacturing the same
CN101380693A (en) * 2008-10-14 2009-03-11 南开大学 Micro-nano structure preparation method on metallic material surface using femtosecond laser
CN101531335A (en) * 2009-04-08 2009-09-16 西安交通大学 Method for preparing metal surface superhydrophobic microstructure by femto-second laser
JP5385054B2 (en) * 2009-08-26 2014-01-08 スタンレー電気株式会社 Heat dissipation material and manufacturing method thereof
CN102036534A (en) * 2009-09-30 2011-04-27 吴献桐 Device with heat dissipation element and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157234A1 (en) * 2005-01-14 2006-07-20 Honeywell International Inc. Microchannel heat exchanger fabricated by wire electro-discharge machining
US20100099268A1 (en) * 2005-04-08 2010-04-22 Timans Paul J Rapid Thermal Processing using Energy Transfer Layers
US20080299408A1 (en) * 2006-09-29 2008-12-04 University Of Rochester Femtosecond Laser Pulse Surface Structuring Methods and Materials Resulting Therefrom
US20120085526A1 (en) * 2010-08-19 2012-04-12 Fu-Lin Yeh Heat sink

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
SHAKOURI ALI *

Also Published As

Publication number Publication date
GB201500847D0 (en) 2015-03-04
CN104603714A (en) 2015-05-06
BR112015002627A2 (en) 2017-07-04
DE112012006782T5 (en) 2015-09-10
WO2014025332A1 (en) 2014-02-13
KR20150046015A (en) 2015-04-29
CA2880490A1 (en) 2014-02-13
JP2015530925A (en) 2015-10-29

Similar Documents

Publication Publication Date Title
CO2017002170A2 (en) Combination therapy to treat a paramyxovirus
EP2974859A4 (en) Bonded body, substrate for power modules, and substrate with heat sink for power modules
EP3361501A4 (en) Substrate for power module with heat sink, and power module
LT2945770T (en) Method of and device for the laser-based machining of sheet-like substrates using a laser beam focal line
EP3196929A4 (en) Joined body, substrate for power module provided with heat sink, heat sink, method for manufacturing joined body, method for manufacturing substrate for power module provided with heat sink, and method for manufacturing heat sink
DE102012102666B8 (en) Heat sink and equipped with the heat sink electronic component
SG11201807606TA (en) Sic inverted plasma cutting power supply
BR112015008442A2 (en) cutting tool coated with standard surface area.
EP3288706A4 (en) Hot cracking reduction in aluminum laser welding
EP3251637A4 (en) Heat generation tool
EP3409423A4 (en) Oscillating power tool
GB2519253A (en) Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation
EP3426467A4 (en) 3d printing heat sinks
EP3269491A4 (en) Manufacturing method for junction, manufacturing method for substrate for power module with heat sink, and manufacturing method for heat sink
EP3595003A4 (en) Power module substrate with heat sink
EP3025568A4 (en) Heat sink
EP3447393A4 (en) Heat source unit
EP3431914A4 (en) Plate laminate type heat exchanger
GB2541291B (en) Laser power controller
EP3432427A4 (en) Distributed-feedback semiconductor laser
AU2016423976A2 (en) Improved heat sink and heat dissipation structure
EP3279936A4 (en) Method for manufacturing substrate for power module with heat sink
EP3422401A4 (en) Heat dissipating substrate
EP3357081A4 (en) Laser sustained plasma light source with graded absorption features
EP3268185A4 (en) Power tool with protected coupling plate

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)