CN102036534A - Device with heat dissipation element and manufacturing method thereof - Google Patents
Device with heat dissipation element and manufacturing method thereof Download PDFInfo
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- CN102036534A CN102036534A CN2009102044130A CN200910204413A CN102036534A CN 102036534 A CN102036534 A CN 102036534A CN 2009102044130 A CN2009102044130 A CN 2009102044130A CN 200910204413 A CN200910204413 A CN 200910204413A CN 102036534 A CN102036534 A CN 102036534A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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Abstract
The invention relates to a device with a heat dissipation element and a manufacturing method thereof. The device with the heat dissipation element comprises an operation device. The manufacturing method comprises the following steps: providing a heat dissipation element with magnesium-lithium alloy; and combining the heat dissipation element with the operation device, wherein the heat dissipation element contains 1-33% by weight of lithium element. Through the invention, the work performance of the heat dissipation element is improved.
Description
Technical field
The present invention relates to the device and the manufacture method thereof of tool heat dissipation element, particularly a kind of device of tool heat dissipation element and manufacture method thereof.
Background technology
Some device when operation easily because of heat production own or receive heat, and make its temperature be higher than ambient temperature.Yet too high temperature regular meeting reduces the task performance of device, even causes the consume of device itself.Therefore, how providing good cooling mechanism, often is the important topic in many technical fields.Especially, the electronic product art is advanced by leaps and bounds in recent years, in addition market to product light, thin, short, little and high standard, dynamical demand, all make radiating efficiency become the bottleneck of many product developments.Therefore, how,, become the developing focus in many fields to pursue better radiating effect at the seeking breakthroughs such as material selection exploitation of heat dissipation element.
On the other hand, magnesium alloy is because of its light weight, advantages such as high strength and reclaiming, and always the utmost point is gazed at.Yet,, cause processing to be difficult for, thereby its application can't be enlarged always because its formability in room temperature is poor.Though because of developing magnesium lithium alloy, the plastic deformation ability of its room temperature is splendid, and its application is progressively enlarged in recent years, yet, the idea appearance that magnesium lithium alloy is applied to heat dissipation technology is not arranged so far yet.
Summary of the invention
The technical problem to be solved in the present invention is, at the prior art above shortcomings, provides a kind of device and manufacture method thereof that can promote the tool heat dissipation element of radiating effect.
The technical solution adopted for the present invention to solve the technical problems provides a kind of manufacture method of device of tool heat dissipation element, in order to make the device of a tool heat dissipation element, wherein the device of this tool heat dissipation element comprises an operating means, this operating means has the temperature higher than this ambient temperature when operating in an environment, this manufacture method comprises: the heat dissipation element that the tool magnesium lithium alloy is provided; This heat dissipation element is combined with this operating means,, utilize this heat dissipation element, heat energy is sent in this environment from this operating means with when this operating means is operated; Wherein, the elemental lithium that contains 1% to 33% percentage by weight in this magnesium lithium alloy material.
Contain the elemental lithium of 3% to 20% percentage by weight in this magnesium lithium alloy material, and comprise aluminium, zinc at least at other interior oligo-element.This manufacture method provides the step of the heat dissipation element of making this tool magnesium lithium alloy, comprises: preparation magnesium lithium alloy material; And, this magnesium lithium alloy material is made this heat dissipation element through procedure.
This procedure can comprise a moulding program, so that this magnesium reason alloy material has the shape of this heat dissipation element.
This heat dissipation element can be a heat-radiating substrate, and this procedure comprises that also one throws flat program, to throw this heat-radiating substrate after the flat moulding.
This operating means device higher when can be an electronic circuit or other operation than ambient temperature.
This procedure more can comprise this heat dissipation element after the moulding is carried out an insulation processing program, so that this heat dissipation element heat conduction and non-conductive.
This insulation processing program can comprise an anode treatment program and/or a vacuum splashing and plating program.
This operating means is an electronic circuit, and is formed on the printed circuit board (PCB).And can comprise that in conjunction with the step of this heat dissipation element and this executive component one glues together the gummed program of this heat dissipation element and this printed circuit board (PCB).
Behind this heat dissipation element of gummed and this printed circuit board (PCB), more visual demand is with this heat dissipation element of pressing program pressing and this printed circuit board (PCB).
The electronic circuit of this operating means is formed on the integrated circuit (IC) chip.This integrated circuit (IC) chip can be glued together mode and be combined with this heat dissipation element, can also cover crystal type and combine with this heat dissipation element.In other were used, heat dissipation element was in conjunction with this integrated circuit (IC) chip with manner.
In one used, the device of this tool heat dissipation element can be a light emitting diode illuminating apparatus.Wherein, this operating means comprises at least one LED encapsulation unit.
This at least one LED encapsulation unit can comprise: a light-emitting diode chip for backlight unit and a pair of pin that is connected to positive and negative power supply respectively.This at least one LED encapsulation unit can also comprise a heat dissipation base that is connected with this light-emitting diode chip for backlight unit.
This heat dissipation element can be this heat dissipation base.Perhaps, this heat dissipation element engages with this heat dissipation base.
This heat dissipation element can be a heat-radiating substrate, and this at least one LED encapsulation unit is a plurality of LED encapsulation units, is arranged in a two-dimensional array.
These a plurality of LED encapsulation units can be installed on the printed circuit board (PCB).Can have a plurality of circular holes on the printed circuit board (PCB), with ccontaining these a plurality of LED encapsulation units of difference.
This operating means can comprise that also one is covered in the insulating trip of these a plurality of LED encapsulation unit peripheries.
This manufacture method also can be included in the step of this a plurality of circular holes top coating layer of transparent glue.
Except aforementioned light emitting diode illuminating apparatus, this operating means also can be central processing unit, memory chip module, display or electronic installations such as display floater, power transistor.
This heat dissipation element can be two fin to be formed, and wherein this two fin articulates each other, so that sheet shape devices such as memory chip module are held between this two fin.
Heat dissipation element also can be radiating fin, water-cooled external member except that aforementioned heat-radiating substrate ... or the like various multi-form.
The present invention provides the device according to the tool heat dissipation element of aforementioned manufacture method manufacturing simultaneously.
The present invention uses magnesium lithium alloy to make heat dissipation element, compares with the heat dissipation element that uses other traditional material, and the task performance of heat dissipation element is promoted greatly, and the range of application field of magnesium lithium alloy and the value that can provide thereof also fully have been provided.
Description of drawings
Fig. 1 is the solid combination schematic diagram of the made light emitting diode illuminating apparatus of the manufacture method of the device of tool heat dissipation element according to the present invention.
Fig. 2 is the perspective exploded view of light emitting diode illuminating apparatus shown in Figure 1.
Fig. 3 is the structural representation of the device of the made tool heat dissipation element of the manufacture method of the device of tool heat dissipation element according to the present invention.
Fig. 4 is the perspective exploded view of the made LED encapsulation unit of the manufacture method of the device of tool heat dissipation element according to the present invention.
Fig. 5 is the profile of LED encapsulation unit shown in Figure 4.
Fig. 6 is the solid combination schematic diagram of the made central processing unit of the manufacture method of the device of tool heat dissipation element according to the present invention.
Fig. 7 is another made central processing unit perspective exploded view of the manufacture method of the device of tool heat dissipation element according to the present invention.
Fig. 8 is the made memory modules fin decomposing schematic representation of the manufacture method of the device of tool heat dissipation element according to the present invention.
Fig. 9 is the combination of memory modules fin shown in Figure 8 and uses schematic diagram.
Figure 10 is the perspective exploded view of the made display floater of the manufacture method of the device of tool heat dissipation element according to the present invention.
Figure 11 is the generalized section of another made display floater of the manufacture method of the device of tool heat dissipation element according to the present invention.
Figure 12 is the manufacture method preferred embodiment flow chart of the device of tool heat dissipation element of the present invention.
Embodiment
Before making heat dissipation element of the present invention, at first need prepare the magnesium lithium alloy material of high ductibility.At first the element of higher melt such as magnesium material and zinc, aluminium is inserted in the smelting furnace crucible, then pumping high vacuum and inject an atmospheric pressure or negative pressure is (for example :-600Torr) argon gas a little.Then, smelting furnace is carried out induction heating, make in the above-mentioned crucible material fusion and mix, afterwards the lithium material is added within the molten soup, and control molten soup temperature between 700 ℃ to 800 ℃, stir.Molten soup watered cast from the mold that presets, wait to solidify the cooling back and take out, promptly obtain required magnesium lithium alloy material.
In order to make finished product have better heat radiating effect, contain the elemental lithium of 1% to 33% percentage by weight in this magnesium lithium alloy material.According to studies show that, when the elemental lithium that is added accounts for weight alloy percentage between 3% between 20% the time, its radiating effect is good especially.
Aforementioned magnesium lithium alloy material can be made heat dissipation element through procedure.Aforementioned ingot casting can be done modifier treatment in a hour at 300 ℃, then rolls continuously at 200 ℃ and prolongs into sheet material, or roll in room temperature and to prolong, but roll when the cold rolling amount of prolonging reaches to renew after must making 200 ℃ of of short duration process annealings after 30%.This alloy material also can directly extrude into section bars such as plate, rod at 200 ℃ to 400 ℃, to adapt to the demand of various different heat dissipation element processing and manufacturings.
Comprise a moulding program in the procedure, so that magnesium reason alloy material has the shape of heat dissipation element.The shape of heat dissipation element can be flat board, fin shape, groove shape, column etc., and visual various shape and application demand are selected the various processing method of collocation for use by those of ordinary skills, will not give unnecessary details one by one at this.
Many devices the time can produce or receive heat energy in operation, and the temperature that makes device itself is than ambient temperature height, and have produced the demand of dispelling the heat.The device of radiating requirements is arranged is operating means to give a definition these, and inquires into and how to utilize the present invention to make heat dissipation element and be applied on these operating means.Heat dissipation element needs to combine with this operating means after making moulding, with when operating means is operated, utilizes magnesium lithium alloy heat dissipation element of the present invention, and heat energy is sent in the environment from operating means.
Below the time can to produce high temperature and the light emitting diode illuminating apparatus of height radiating requirements is arranged with operation be example, further specify notion of the present invention.Fig. 1 and Fig. 2 have shown a light emitting diode illuminating apparatus 1, are made up of heat-radiating substrate 11, printed circuit board (PCB) 12, insulating trip 13 and several LED encapsulation units 14.LED encapsulation unit 14 is installed on the printed circuit board (PCB) 12, and is the two-dimensional array arrangement.Each LED encapsulation unit 14 has two pin (not shown) of both positive and negative polarity, be connected with the inner conductor (not shown) of printed circuit board (PCB) 12 respectively, and all both positive and negative polarity pins by aforementioned inner conductor respectively tandem to two L type electrodes 15,16 that are distributed in printed circuit board (PCB) 12 peripheries, utilize the electric wire 17,18 that is connected to respectively on the L type electrode 15,16 again, just be connected to respectively/the negative power supply (not shown), with operating light-emitting diodes (leds) lighting device 1.Insulating trip 13 can trim heat-radiating substrate 11 and printed circuit board (PCB) 12 peripheries and be affixed on the printed circuit board (PCB) 12, and its center is passed through in order to the light that LED encapsulation unit 14 is sent with respect to the position and the hollow out of the two-dimensional array that LED encapsulation unit 14 is arranged.
When making light-emitting diodes lighting device 1, at first utilize preceding method to make magnesium lithium alloy material of the present invention and be processed into heat-radiating substrate 11, and this procedure comprises that also one throws the flat program of throwing of flat heat-radiating substrate 11 after this moulding program.
After throwing flat heat-radiating substrate 11, reach the effect of heat conduction non-conducting in order to make heat-radiating substrate 11, must carry out an insulation program to it.The insulation program can comprise anode treatment program and vacuum splashing and plating program etc., but alternatively or both are parallel.Generally be to carry out the anode treatment program earlier when both are parallel, carry out vacuum splashing and plating afterwards again.
After heat-radiating substrate 11 is finished insulation processing, just it can be combined with operating means.At first glue together heat-radiating substrate 11 and printed circuit board (PCB) 12, and optionally both are carried out suitable pressing, and LED encapsulation unit 14 is installed within each circular hole 121.Afterwards, stick insulating trip 13, and on LED encapsulation unit 14, be coated with layer of transparent glue to be fixed.The electric wire 17,18 of burn-oning is at last promptly finished the making of light emitting diode lighting equipment 1.Locking hole 19 uses when light emitting diode lighting equipment 1 being fixed to institute's desire installation part.
Because electronic product can produce the characteristic of high temperature when operation, in many application, operating means has comprised an electronic circuit, and the magnesium lithium alloy heat dissipation element of the present invention of can arranging in pairs or groups uses.Usually, the direct heat dissipation element that contacts with operating means, can be called as once hot heat dissipation element, and once hot heat dissipation element is when work, it is higher than ambient temperature that its surface temperature remains usually, so can be on hot heat dissipation element once, other installs a heat dissipation element and helps its heat radiation, is called the hot heat dissipation element of secondary.
Fig. 3 has shown the structural representation of the device 2 of a tool heat dissipation element.This device comprises an operating means 21, is installed on the once hot heat dissipation element 22 on the operating means 21, and is installed on once the hot heat dissipation element 23 of secondary on the hot heat dissipation element 22.When operating means 21 operations, its temperature so pass through once the help of hot heat dissipation element 22 and the hot heat dissipation element 23 of secondary, is sent to environment 300 with heat than the temperature height of environment 300, to reduce the temperature of operating means 21.Wherein, operating means 21 can be the electronic circuit that is formed on the circuit board 24, or is formed at the integrated circuit among the chip, also can be any circuit element that operation the time can produce high temperature, as power transistor etc.And magnesium lithium alloy material used in the present invention, can be used to make once hot heat dissipation element 22 and the hot heat dissipation element 23 of secondary one of them or the two, for example, if aforementioned LED encapsulation unit 14 itself has heat dissipation elements such as radiating seat, then this heat dissipation element itself also can use the magnesium lithium alloy manufacturing, the heat-radiating substrate 11 that magnesium lithium alloy or other material make of arranging in pairs or groups again all can be reached certain effect.
Fig. 4 and Fig. 5 have shown another kind of LED encapsulation unit 3, and it is by light-emitting diode chip for backlight unit 31, printed circuit board (PCB) 32, and radiating seat 33, pin 34, insulation shell 35 and lens 36 are formed.Radiating seat 33 has comprised newel 331 and chassis 332.Newel 331 is used for accepting printed circuit board (PCB) 32 and light-emitting diode chip for backlight unit 31, and 332 on chassis can enlarge area of dissipation.When making, can be earlier with magnesium lithium alloy material of the present invention, mould model is made radiating seat 33, is fitted to each other with other element again.Light-emitting diode chip for backlight unit 31 combines with 32 of printed circuit board (PCB)s, can to cover crystal type, connect by ball-type pin 311 as shown in Figure 5, and printed circuit board (PCB) 31 in routing (wire bonding) mode, is connected to positive and negative pin 34 with wiring 321 again.In other preferred embodiment, also can be without printed circuit board (PCB), but light-emitting diode chip for backlight unit directly is glued on the radiating seat, connects chip and pin with the routing mode again.
The present invention uses the excellent radiating effect of magnesium lithium alloy as heat dissipation element for checking, special respectively with magnesium lithium alloy and aluminium as once hot heat radiating material, the radiating effect when testing both and being used for light-emitting diode chip for backlight unit.Found that to 150 ℃ crystal grain speech, aluminium base only can be derived temperature to heat radiating material surface temperature and be presented 51 ℃, and the derivation temperature of magnesium lithium alloy base material this shows up to 96 ℃, the heat-conducting effect of magnesium lithium alloy base material is much larger than aluminium base.And, make the working temperature reduction of crystal grain also more, therefore because that the magnesium lithium alloy base material can be derived is hot more, when adopting magnesium lithium alloy as heat radiating material, the operating current of measuring on crystal grain is 1200mA, is height far beyond the 350mA that uses aluminium base to measure, and is also just not unexpected.In other words, use magnesium lithium alloy to be the heat dissipation element material, can use traditional material more effectively to reduce the working temperature of circuit element in the operating means, and then significantly promote the task performance of these circuit elements.
The further illustration of Fig. 6 to Figure 11 applicable various operating means of magnesium lithium alloy heat dissipation element of the present invention and the various execution modes that combine with heat dissipation element thereof.
Fig. 6 has shown 41, one radiating fins 42 of a central processing unit and a radiator fan 43.Radiating fin 42 can use magnesium lithium alloy material of the present invention moulding, is used in combination with central processing unit 41 and radiator fan 43 again.
Fig. 7 then is the example application of another kind of central processing unit heat dissipation element.Central processing unit chip 5 is installed on the chip carrier 51, and heat dissipation element comprises and water-cooling type radiator 52 and joint 53 etc. can be fixed on the chip carrier 51 by cramp 54.Wherein, external members such as water-cooling type radiator 52, joint 53 and cramp 54 can all or part of use magnesium lithium alloy material of the present invention.
The fin 61,62 that all or part of use magnesium lithium alloy of Fig. 8 and Fig. 9 is made articulates mutually with pin-jointed structure 611,612,621,622, and is able to clamping memory modules 6 in wherein, reaches good radiating effect.
The display of Figure 10 and two kinds of different types of Figure 11 illustration or the heat dissipation element configuration mode of display floater are particularly useful for liquid crystal panel or light-emitting-diode panel.Between the display floater 7 of Figure 10 and the casing 73 heat dissipation element 71 and 72 are installed.Water-cooled element that shows among the figure and fan only are example, and the visual practical application of its kind and quantity needs to adjust, and the orientation of its configuration then is the dead astern at display floater 7.This kind configuration mode uses among large-sized backlight module panel usually.Certainly, all or part of of heat dissipation element 71,72, use that can be suitable magnesium lithium alloy of the present invention is made.
The side-light type display floater 8 of Figure 11 then is applied in undersized backlight module usually.Be fixed on the light source 81 of heat-radiating substrate 82, provide side light to display floater 83.Light source 81 can comprise light-emitting diode chip for backlight unit 811 and base 812.Base 812 is used for installing light-emitting diode chip for backlight unit 811 and contacts with heat-radiating substrate 82, and the heat that is produced during with 811 work of transmission light-emitting diode chip for backlight unit is to external environment.Significantly, part or all of base 812 and heat-radiating substrate 82 can use magnesium lithium alloy of the present invention to make.
Please consult the manufacture method preferred embodiment flow chart of the device of tool heat dissipation element of the present invention shown in Figure 12 again; In Figure 12, comprise the following steps:
Step 91: beginning;
Step 92: prepare a magnesium lithium alloy material; Wherein, the elemental lithium that contains 1% to 33% percentage by weight in this magnesium lithium alloy material;
Another preferable way contains the elemental lithium of 3% to 20% percentage by weight in this magnesium lithium alloy material;
Step 93: this magnesium lithium alloy material is made this heat dissipation element through a procedure; Wherein, this procedure comprises a moulding program, so that this magnesium lithium alloy material has the shape of this heat dissipation element;
Step 94: this heat dissipation element after the moulding is carried out an insulation processing program, so that this heat dissipation element heat conduction and non-conductive;
Preferably, this insulation processing program comprises an anode treatment program and/or a vacuum splashing and plating program; And when this heat dissipation element was a heat-radiating substrate, this procedure comprised that also one throws flat program, to throw this heat-radiating substrate after the flat moulding; And
Step 95: this heat dissipation element is combined with this operating means,, utilize this heat dissipation element, heat energy is sent in this environment from this operating means with when this operating means is operated;
Step 96: finish.
In sum, though the operating means that more than exemplifies mostly is the display that comprises various light emitting source, various different size at least or the electronic installation of display floater, but magnesium lithium alloy heat dissipation element of the present invention, be not limited in and be applied on the electronic installation, and can use when any operation its temperature high and the device of radiating requirements is arranged than ambient temperature, as engine, compressor or the like.In a word, the present invention uses magnesium lithium alloy to make heat dissipation element, compare with the heat dissipation element that uses other traditional material, its task performance is promoted widely, progress to industry brings great contribution, the range of application field of magnesium lithium alloy and the value that can provide thereof also fully have been provided, and in fact are one to have the invention of industrial value.
The above is preferred embodiment of the present invention only, is not in order to limiting claim of the present invention, and therefore all other do not break away from the equivalence of being finished under the disclosed spirit and change or modify, and all should be contained in the claim of the present invention.
Claims (10)
1. the manufacture method of the device of a tool heat dissipation element, it is characterized in that in order to make the device of tool heat dissipation element, wherein the device of this tool heat dissipation element comprises operating means, this operating means has the temperature higher than this ambient temperature when operating in an environment, this manufacture method comprises:
The heat dissipation element of tool magnesium lithium alloy is provided; And
This heat dissipation element is combined with this operating means,, utilize this heat dissipation element, heat energy is sent in this environment from this operating means with when this operating means is operated;
Wherein, the elemental lithium that contains 1% to 33% percentage by weight in this heat dissipation element.
2. the manufacture method of the device of tool heat dissipation element as claimed in claim 1, it is characterized in that: the magnesium lithium alloy material of this heat dissipation element contains the elemental lithium of 3% to 20% percentage by weight, and comprise aluminium, zinc at least at interior oligo-element, and this manufacture method provides the step of the heat dissipation element of making this tool magnesium lithium alloy, comprises:
Preparation magnesium lithium alloy material; And
This magnesium lithium alloy material is made this heat dissipation element through procedure, and wherein this procedure comprises the moulding program, so that this magnesium reason alloy material has the shape of this heat dissipation element.
3. the manufacture method of the device of tool heat dissipation element as claimed in claim 2, it is characterized in that: this procedure also comprises this heat dissipation element after the moulding is carried out the insulation processing program, so that this heat dissipation element heat conduction and non-conductive, and this insulation processing program comprises anode treatment program and/or vacuum splashing and plating program.
4. the manufacture method of the device of tool heat dissipation element as claimed in claim 2 is characterized in that: this heat dissipation element is a heat-radiating substrate, and this procedure also comprises the flat program of throwing, to throw this heat-radiating substrate after the flat moulding.
5. the manufacture method of the device of tool heat dissipation element as claimed in claim 1, it is characterized in that: this operating means is the electronic circuit that is formed on the printed circuit board (PCB), and should comprise the gummed program of gluing together this heat dissipation element and this printed circuit board (PCB) in conjunction with the step of this heat dissipation element and this operating means, and where necessary behind gummed this heat dissipation element and this printed circuit board (PCB), the pressing program of execution this heat dissipation element of pressing and this printed circuit board (PCB).
6. the manufacture method of the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this operating means is an integrated circuit (IC) chip, this integrated circuit (IC) chip with gummed, cover crystalline substance or manner combines with this heat dissipation element.
7. the manufacture method of the device of tool heat dissipation element as claimed in claim 1, it is characterized in that: the device of this tool heat dissipation element is a light emitting diode illuminating apparatus, this operating means comprises at least one LED encapsulation unit, and this at least one LED encapsulation unit comprises:
Light-emitting diode chip for backlight unit;
A pair of pin is connected to positive and negative power supply respectively, and
Heat dissipation base is connected with this light-emitting diode chip for backlight unit, and wherein this heat dissipation element is this heat dissipation base, or this heat dissipation element engages with this heat dissipation base.
8. the manufacture method of the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this operating means is central processing unit, memory chip module, display, display floater, power transistor or light emitting source.
9. the manufacture method of the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this heat dissipation element is heat-radiating substrate, radiating seat, radiating fin or water-cooled external member.
10. the device of the tool heat dissipation element that obtains of a manufacture method manufacturing according to claim 1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009102044130A CN102036534A (en) | 2009-09-30 | 2009-09-30 | Device with heat dissipation element and manufacturing method thereof |
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| CN2009102044130A CN102036534A (en) | 2009-09-30 | 2009-09-30 | Device with heat dissipation element and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013004195A1 (en) * | 2011-07-07 | 2013-01-10 | 东莞巨扬电器有限公司 | High-power led lighting device |
| CN104603714A (en) * | 2012-08-06 | 2015-05-06 | 维克多·A·里瓦斯 | Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation |
-
2009
- 2009-09-30 CN CN2009102044130A patent/CN102036534A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013004195A1 (en) * | 2011-07-07 | 2013-01-10 | 东莞巨扬电器有限公司 | High-power led lighting device |
| CN104603714A (en) * | 2012-08-06 | 2015-05-06 | 维克多·A·里瓦斯 | Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation |
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Application publication date: 20110427 |