CN201585224U - Device with radiating element - Google Patents
Device with radiating element Download PDFInfo
- Publication number
- CN201585224U CN201585224U CN2009201749765U CN200920174976U CN201585224U CN 201585224 U CN201585224 U CN 201585224U CN 2009201749765 U CN2009201749765 U CN 2009201749765U CN 200920174976 U CN200920174976 U CN 200920174976U CN 201585224 U CN201585224 U CN 201585224U
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- Prior art keywords
- heat dissipation
- dissipation element
- operating means
- tool
- led encapsulation
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Led Device Packages (AREA)
Abstract
The utility model relates to a device with a radiating element. The device comprises an operating device and the radiating element with magnesium-lithium alloy, wherein the radiating element is combined with the operating device so as to transfer heat from the operating device to environments when the operating device is operated. The device has the advantages of being capable of increasing working efficiency of the radiating element greatly and the like.
Description
Technical field
The utility model relates to the device of tool heat dissipation element, particularly a kind of device of tool heat dissipation element.
Background technology
Some device when operation easily because of heat production own or receive heat, and make its temperature be higher than ambient temperature.Yet too high temperature regular meeting reduces the task performance of device, even causes the consume of device itself.Therefore, how providing good cooling mechanism, often is the important topic in many technical fields.Especially, the electronic product art is advanced by leaps and bounds in recent years, in addition market to product light, thin, short, little and high standard, dynamical demand, make radiating efficiency become the bottleneck of many product developments.Therefore, how,, become the developing focus in many fields to pursue better radiating effect at the seeking breakthroughs such as material selection exploitation of heat dissipation element.
On the other hand, magnesium alloy is because of its light weight, advantages such as high strength and reclaiming, and always the utmost point is gazed at.Yet,, cause processing to be difficult for, thereby its application can't be enlarged always because its formability in room temperature is poor.Though because of developing magnesium lithium alloy, the plastic deformation ability of its room temperature is splendid, and its application is progressively enlarged in recent years, yet, the idea appearance that magnesium lithium alloy is applied to heat dissipation technology is not arranged so far yet.
The utility model content
The technical problems to be solved in the utility model is, at the prior art above shortcomings, provides a kind of device that can promote the tool heat dissipation element of radiating effect.
The technical scheme that its technical problem that solves the utility model adopts provides a kind of device of tool heat dissipation element, it comprises the heat dissipation element of operating means and tool magnesium lithium alloy, wherein, when this operating means places an environment to operate, have the temperature higher than this ambient temperature; The heat dissipation element of this tool magnesium lithium alloy combines with this operating means, and when this operating means operation heat energy is sent in this environment from this operating means, contains the elemental lithium of 1% to 33% percentage by weight in this heat dissipation element.
Contain the elemental lithium of 3% to 20% percentage by weight in the magnesium lithium alloy material of this heat dissipation element, and comprise aluminium, zinc at least at other interior oligo-element, and this heat dissipation element heat conduction and non-conductive.
This heat dissipation element can be a heat-radiating substrate.
This operating means device high when can be an electronic circuit or other operation than ambient temperature.
This operating means is an electronic circuit, and is formed on the printed circuit board (PCB).The mode that can glue together between this heat dissipation element and this executive component combines.
The electronic circuit of this operating means also can be formed on the integrated circuit (IC) chip.This integrated circuit (IC) chip can be glued together mode and be combined with this heat dissipation element, can also cover crystal type and combine with this heat dissipation element.The all right manner of this heat dissipation element is in conjunction with this integrated circuit (IC) chip.
The device of this tool heat dissipation element can be a light emitting diode illuminating apparatus.Wherein, this operating means comprises at least one LED encapsulation unit.
The a pair of pin that this at least one LED encapsulation unit can comprise light-emitting diode chip for backlight unit and be connected to positive and negative power supply respectively.This at least one LED encapsulation unit can also comprise the heat dissipation base that is connected with this light-emitting diode chip for backlight unit.
This heat dissipation element can be this heat dissipation base.Perhaps, this heat dissipation element engages with this heat dissipation base.
This heat dissipation element can be a heat-radiating substrate, and this operating means comprises a plurality of LED encapsulation units, and these a plurality of LED encapsulation units are arranged in a two-dimensional array.
These a plurality of LED encapsulation units can be installed on the printed circuit board (PCB).This printed circuit board (PCB) can have a plurality of circular holes, with ccontaining these a plurality of LED encapsulation units of difference.
This operating means can comprise that also one is covered in the insulating trip of these a plurality of LED encapsulation unit peripheries.
This a plurality of circular holes top also can be provided with layer of transparent glue.
Except aforementioned light emitting diode illuminating apparatus, this operating means also can be electronic installations such as central processing unit, memory chip module, display or display floater, power transistor, light emitting source.
This heat dissipation element can be two fin to be formed, and wherein this two fin articulates each other, so that sheet shape devices such as memory chip module are held between this two fin.
This heat dissipation element is except that aforementioned heat-radiating substrate, and it is various multi-form also to can be radiating seat, radiating fin, water-cooled external member or the like.
The utility model uses magnesium lithium alloy to make heat dissipation element, compares with the heat dissipation element that uses other traditional material, and the operating efficiency of heat dissipation element is promoted greatly, and the range of application field of magnesium lithium alloy and the value that can provide thereof also fully have been provided.
Description of drawings
Fig. 1 is the solid combination schematic diagram of the light emitting diode illuminating apparatus of the utility model first preferred embodiment.
Fig. 2 is the perspective exploded view of light emitting diode illuminating apparatus shown in Figure 1.
Fig. 3 is the structural representation of the utility model second preferred embodiment.
Fig. 4 is the perspective exploded view of the LED encapsulation unit of the utility model the 3rd preferred embodiment;
Fig. 5 is the profile of LED encapsulation unit shown in Figure 4.
Fig. 6 is the solid combination schematic diagram of the central processing unit of the utility model the 4th preferred embodiment.
Fig. 7 is the perspective exploded view of the central processing unit of the utility model the 5th preferred embodiment.
Fig. 8 is the decomposing schematic representation of the memory modules fin of the utility model the 6th preferred embodiment.
Fig. 9 is the combination of memory modules fin shown in Figure 8 and uses schematic diagram.
Figure 10 is the decomposing schematic representation of the display floater of the utility model the 7th preferred embodiment.
Figure 11 is the generalized section of the display floater of the utility model the 8th preferred embodiment.
Embodiment
Before making heat dissipation element of the present utility model, at first need prepare the magnesium lithium alloy material of high ductibility.At first the element of higher melt such as magnesium material and zinc, aluminium is inserted in the smelting furnace crucible, then pumping high vacuum and inject an atmospheric pressure or negative pressure is (for example :-600Torr) argon gas a little.Then, smelting furnace is carried out induction heating, make in the above-mentioned crucible material fusion and mix, afterwards the lithium material is added within the molten soup, and control molten soup temperature between 700 ℃ to 800 ℃, stir.Molten soup watered cast from the mold that presets, wait to solidify the cooling back and take out, promptly obtain required magnesium lithium alloy material.
In order to make finished product have better heat radiating effect, contain the elemental lithium of 1% to 33% percentage by weight in this magnesium lithium alloy material.According to studies show that, when the elemental lithium that is added accounts for weight alloy percentage between 3% between 20% the time, its radiating effect is good especially.
Aforementioned magnesium lithium alloy material can be made heat dissipation element through procedure.Aforementioned ingot casting can be done modifier treatment in a hour at 300 ℃, then rolls continuously at 200 ℃ and prolongs into sheet material, or roll in room temperature and to prolong, but roll when the cold rolling amount of prolonging reaches to renew after must making 200 ℃ of of short duration process annealings after 30%.This alloy material also can directly extrude into section bars such as plate, rod at 200 ℃ to 400 ℃, to adapt to the demand of various different heat dissipation element processing and manufacturings.
Comprise a moulding program in the procedure, so that magnesium reason alloy material has the shape of heat dissipation element.The shape of heat dissipation element can be flat board, fin shape, groove shape, column etc., and visual various shape and application demand are selected the various processing method of collocation for use by those of ordinary skills, will not give unnecessary details one by one at this.
Many devices the time can produce or receive heat energy in operation, and the temperature that makes device itself is than ambient temperature height, and have produced the demand of dispelling the heat.The device of radiating requirements is arranged is operating means to give a definition these, and inquires into and how to utilize the utility model heat dissipation element and be applied on these operating means.Heat dissipation element needs to combine with this operating means after making moulding, with when operating means is operated, utilizes magnesium lithium alloy heat dissipation element of the present utility model, and heat energy is sent in the environment from operating means.
Below the time can to produce high temperature and the light emitting diode illuminating apparatus of height radiating requirements is arranged with operation be example, further specify notion of the present utility model.Fig. 1 and Fig. 2 have shown the light emitting diode illuminating apparatus 1 of the utility model first preferred embodiment, are made up of heat-radiating substrate 11, printed circuit board (PCB) 12, insulating trip 13 and several LED encapsulation units 14.LED encapsulation unit 14 is installed on the printed circuit board (PCB) 12, and is the two-dimensional array arrangement.Each LED encapsulation unit 14 has two pin (not shown) of both positive and negative polarity, be connected with the inner conductor (not shown) of printed circuit board (PCB) 12 respectively, and all both positive and negative polarity pins by aforementioned inner conductor respectively tandem to two L type electrodes 15,16 that are distributed in printed circuit board (PCB) 12 peripheries, utilize the electric wire 17,18 that is connected to respectively on the L type electrode 15,16 again, just be connected to respectively/the negative power supply (not shown), with operating light-emitting diodes (leds) lighting device 1.Insulating trip 13 can trim heat-radiating substrate 11 and printed circuit board (PCB) 12 peripheries and be affixed on the printed circuit board (PCB) 12, and its center is passed through in order to the light that LED encapsulation unit 14 is sent with respect to the position and the hollow out of the two-dimensional array that LED encapsulation unit 14 is arranged.
When making light-emitting diodes lighting device 1, at first utilize preceding method to make magnesium lithium alloy material of the present utility model and be processed into heat-radiating substrate 11, and this procedure comprises that also one throws the flat program of throwing of flat heat-radiating substrate 11 after this moulding program.
After throwing flat heat-radiating substrate 11, reach the effect of heat conduction non-conducting in order to make heat-radiating substrate 11, must carry out an insulation program to it.The insulation program can comprise anode treatment program and vacuum splashing and plating program etc., but alternatively or both are parallel.Generally be to carry out the anode treatment program earlier when both are parallel, carry out vacuum splashing and plating afterwards again.
After heat-radiating substrate 11 is finished insulation processing, just it can be combined with operating means.At first glue together heat-radiating substrate 11 and printed circuit board (PCB) 12, and optionally both are carried out suitable pressing, and LED encapsulation unit 14 is installed within each circular hole 121.Afterwards, stick insulating trip 13, and on LED encapsulation unit 14, be coated with layer of transparent glue to be fixed.The electric wire 17,18 of burn-oning is at last promptly finished the making of light emitting diode lighting equipment 1.Locking hole 19 uses when light emitting diode lighting equipment 1 being fixed to institute's desire installation part.
Because electronic product can produce the characteristic of high temperature when operation, in many application, operating means has comprised an electronic circuit, and the magnesium lithium alloy heat dissipation element of the present utility model of can arranging in pairs or groups uses.Usually, the direct heat dissipation element that contacts with operating means, can be called as once hot heat dissipation element, and once hot heat dissipation element is when work, it is higher than ambient temperature that its surface temperature remains usually, so can be on hot heat dissipation element once, other installs a heat dissipation element and helps its heat radiation, is called the hot heat dissipation element of secondary.
Fig. 3 has shown the structural representation of the utility model second preferred embodiment.The device 2 of this tool heat dissipation element comprises an operating means 21, is installed on the once hot heat dissipation element 22 on the operating means 21, and is installed on once the hot heat dissipation element 23 of secondary on the hot heat dissipation element 22.When operating means 21 operations, its temperature so pass through once the help of hot heat dissipation element 22 and the hot heat dissipation element 23 of secondary, is sent to environment 300 with heat than the temperature height of environment 300, to reduce the temperature of operating means 21.Wherein, operating means 21 can be the electronic circuit that is formed on the circuit board 24, or is formed at the integrated circuit among the chip, can produce any circuit element of high temperature when also operating, as power transistor etc.And the employed magnesium lithium alloy material of the utility model, can be used to make once one of them or both of hot heat dissipation element 22 and the hot heat dissipation element 23 of secondary, for example, if aforementioned LED encapsulation unit 14 itself has heat dissipation elements such as radiating seat, then this heat dissipation element itself also can use the magnesium lithium alloy manufacturing, the heat-radiating substrate 11 that magnesium lithium alloy or other material make of arranging in pairs or groups again all can be reached certain effect.
Fig. 4 and Fig. 5 have shown the LED encapsulation unit 3 of the utility model the 3rd preferred embodiment, and it is by light-emitting diode chip for backlight unit 31, printed circuit board (PCB) 32, and radiating seat 33, pin 34, insulation shell 35 and lens 36 are formed.Radiating seat 33 has comprised newel 331 and chassis 332.Newel 331 is used for accepting printed circuit board (PCB) 32 and light-emitting diode chip for backlight unit 31, and 332 on chassis can enlarge area of dissipation.When making, can be earlier with magnesium lithium alloy material of the present utility model, mould model is made radiating seat 33, is fitted to each other with other element again.Light-emitting diode chip for backlight unit 31 combines with 32 of printed circuit board (PCB)s, can to cover crystal type, connect by ball-type pin 311 as shown in Figure 5, and printed circuit board (PCB) 31 in routing (wire bonding) mode, is connected to positive and negative pin 34 with wiring 321 again.In other preferred embodiment, also can be without printed circuit board (PCB), but light-emitting diode chip for backlight unit directly is glued on the radiating seat, connects chip and pin with the routing mode again.
For checking the utility model uses the excellent radiating effect of magnesium lithium alloy as heat dissipation element, special respectively with magnesium lithium alloy and aluminium as once hot heat radiating material, the radiating effect when testing both and being used for light-emitting diode chip for backlight unit.Found that to 150 ℃ crystal grain speech, aluminium base only can be derived temperature to heat radiating material surface temperature and be presented 51 ℃, and the derivation temperature of magnesium lithium alloy base material this shows up to 96 ℃, the heat-conducting effect of magnesium lithium alloy base material is much larger than aluminium base.And, make the working temperature reduction of crystal grain also more, therefore because that the magnesium lithium alloy base material can be derived is hot more, when adopting magnesium lithium alloy as heat radiating material, the operating current of measuring on crystal grain is 1200mA, is height far beyond the 350mA that uses aluminium base to measure, and is also just not unexpected.In other words, use magnesium lithium alloy to be the heat dissipation element material, can use traditional material more effectively to reduce the working temperature of circuit element in the operating means, and then significantly promote the task performance of these circuit elements.
The further illustration of Fig. 6 to Figure 11 applicable various operating means of magnesium lithium alloy heat dissipation element of the present utility model and the various execution modes that combine with heat dissipation element thereof.
Among Fig. 6, the utility model the 4th preferred embodiment comprises 41, one radiating fins 42 of a central processing unit and a radiator fan 43.Radiating fin 42 can use magnesium lithium alloy material of the present utility model moulding, is used in combination with central processing unit 41 and radiator fan 43 again.
Fig. 7 then is the example application of the utility model the 5th preferred embodiment central processing unit heat dissipation element.Central processing unit chip 5 is installed on the chip carrier 51, and heat dissipation element comprises and water-cooling type radiator 52 and joint 53 etc. can be fixed on the chip carrier 51 by cramp 54.Wherein, external members such as water-cooling type radiator 52, joint 53 and cramp 54 can all or part of use magnesium lithium alloy material of the present utility model.
The fin 61,62 that all or part of use magnesium lithium alloy of Fig. 8 and Fig. 9 is made articulates mutually with pin-jointed structure 611,612,621,622, and is able to clamping memory modules 6 in wherein, reaches good radiating effect.
The display of Figure 10 and two kinds of different types of Figure 11 illustration or the heat dissipation element configuration mode of display floater are particularly useful for liquid crystal panel or light-emitting-diode panel.Between the display floater 7 of Figure 10 and the casing 73 heat dissipation element 71 and 72 are installed.Water-cooled element that shows among the figure and fan only are example, and the visual practical application of its kind and quantity needs to adjust, and the orientation of its configuration then is the dead astern at display floater 7.This kind configuration mode uses among large-sized backlight module panel usually.Certainly, all or part of of heat dissipation element 71,72, use that can be suitable magnesium lithium alloy of the present utility model is made.
The side-light type display floater 8 of Figure 11 then is applied in undersized backlight module usually.Be fixed on the light source 81 of heat-radiating substrate 82, provide side light to give display floater 83.Light source 81 can comprise light-emitting diode chip for backlight unit 811 and base 812.Base 812 is used for installing light-emitting diode chip for backlight unit 811 and contacts with heat-radiating substrate 82, and the heat that is produced during with 811 work of transmission light-emitting diode chip for backlight unit is to external environment.Significantly, part or all of base 812 and heat-radiating substrate 82 can use magnesium lithium alloy of the present utility model to make.
In sum, though the operating means that more than exemplifies mostly is the display that comprises various light emitting source, various different size at least or the electronic installation of display floater, but magnesium lithium alloy heat dissipation element of the present utility model, be not limited in and be applied on the electronic installation, and can use when any operation its temperature high and the device of radiating requirements is arranged than ambient temperature, as engine, compressor or the like.In a word, the utility model uses magnesium lithium alloy to make heat dissipation element, compare with the heat dissipation element that uses other traditional material, the task performance of this heat dissipation element is promoted widely, progress to industry brings great contribution, the range of application field of magnesium lithium alloy and the value that can provide thereof also fully have been provided, have been had industrial value.
The above only is preferred embodiment of the present utility model, be not in order to limit claim of the present utility model, therefore all other do not break away from the equivalence of being finished under the spirit that the utility model discloses and changes or modify, and all should be contained in the claim of the present utility model.
Claims (10)
1. the device of a tool heat dissipation element is characterized in that, comprising:
Operating means when placing an environment to operate, has the temperature higher than this ambient temperature; And
Combine with this operating means and when this operating means operation, heat energy is sent to the heat dissipation element of the tool magnesium lithium alloy in this environment from this operating means, contain the elemental lithium of 1% to 33% percentage by weight in this heat dissipation element.
2. the device of tool heat dissipation element as claimed in claim 1, it is characterized in that: the magnesium lithium alloy material of this heat dissipation element contains the elemental lithium of 3% to 20% percentage by weight, and comprise aluminium, zinc at least, and this heat dissipation element heat conduction and non-conductive at interior oligo-element.
3. the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this heat dissipation element is the fin that heat-radiating substrate, radiating seat, radiating fin, water-cooled external member or two articulate each other.
4. the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this operating means is the electronic circuit that is formed on printed circuit board (PCB) or the integrated circuit (IC) chip.
5. the device of tool heat dissipation element as claimed in claim 1 is characterized in that: be with gummed between this heat dissipation element and this operating means, fasten or cover brilliant mode and combine.
6. the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this operating means comprises at least one LED encapsulation unit, and this at least one LED encapsulation unit comprises:
Light-emitting diode chip for backlight unit;
A pair of pin is connected to positive and negative power supply respectively; And
Heat dissipation base is connected with this light-emitting diode chip for backlight unit, and wherein this heat dissipation element is this heat dissipation base, or this heat dissipation element engages with this heat dissipation base.
7. the device of tool heat dissipation element as claimed in claim 6 is characterized in that: this heat dissipation element is a heat-radiating substrate, and this operating means comprises a plurality of LED encapsulation units, and these a plurality of LED encapsulation units are arranged in two-dimensional array.
8. the device of tool heat dissipation element as claimed in claim 7 is characterized in that: these a plurality of LED encapsulation units are installed on the printed circuit board (PCB), and this printed circuit board (PCB) has a plurality of circular holes, with ccontaining these a plurality of LED encapsulation units respectively.
9. the device of tool heat dissipation element as claimed in claim 8 is characterized in that: this operating means also comprises the insulating trip that is covered in these a plurality of LED encapsulation unit peripheries, and this a plurality of circular holes top is coated with layer of transparent glue.
10. the device of tool heat dissipation element as claimed in claim 1 is characterized in that: this operating means is central processing unit, memory chip module, display, display floater, power transistor or light emitting source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201749765U CN201585224U (en) | 2009-09-30 | 2009-09-30 | Device with radiating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201749765U CN201585224U (en) | 2009-09-30 | 2009-09-30 | Device with radiating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201585224U true CN201585224U (en) | 2010-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201749765U Expired - Fee Related CN201585224U (en) | 2009-09-30 | 2009-09-30 | Device with radiating element |
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| Country | Link |
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| CN (1) | CN201585224U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102454878A (en) * | 2010-10-19 | 2012-05-16 | 展晶科技(深圳)有限公司 | Light-emitting diode module |
| CN109688250A (en) * | 2019-01-17 | 2019-04-26 | 深圳市晶久瑞电子科技有限公司 | Solar recharging ink screen mobile phone |
-
2009
- 2009-09-30 CN CN2009201749765U patent/CN201585224U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102454878A (en) * | 2010-10-19 | 2012-05-16 | 展晶科技(深圳)有限公司 | Light-emitting diode module |
| CN102454878B (en) * | 2010-10-19 | 2014-07-02 | 展晶科技(深圳)有限公司 | Light-emitting diode module |
| CN109688250A (en) * | 2019-01-17 | 2019-04-26 | 深圳市晶久瑞电子科技有限公司 | Solar recharging ink screen mobile phone |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100915 Termination date: 20150930 |
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| EXPY | Termination of patent right or utility model |