CN102454878A - Light-emitting diode module - Google Patents
Light-emitting diode module Download PDFInfo
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- CN102454878A CN102454878A CN201010513336XA CN201010513336A CN102454878A CN 102454878 A CN102454878 A CN 102454878A CN 201010513336X A CN201010513336X A CN 201010513336XA CN 201010513336 A CN201010513336 A CN 201010513336A CN 102454878 A CN102454878 A CN 102454878A
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- emitting diode
- diode module
- light emitting
- circuit layer
- circuit board
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Abstract
The invention relates to a light-emitting diode module, which comprises a circuit board, a first circuit layer, a plurality of electrode pins, a substrate and a plurality of luminous units, wherein the first circuit layer is formed on the circuit board and is electrically connected with an external power supply; the plurality of electrode pins are formed on the circuit board; the substrate is connected with the circuit board; the plurality of luminous units are arranged on the substrate and are electrically connected with the first circuit layer through the plurality of electrode pins respectively to adjust a connecting mode of the plurality of electrode pins and the first circuit layer; therefore, a connecting mode among the plurality of luminous units is adjusted.
Description
Technical field
The present invention relates to a kind of lighting device, relate in particular to a kind of light emitting diode module.
Background technology
At present, light emitting diode (Light Emitting Diode, L ED) is low in energy consumption because of having, the life-span is long, volume is little and characteristic such as brightness height has been widely applied to a lot of fields.
Usually, light emitting diode module comprises circuit board and is arranged on a plurality of luminescence units on this circuit board.Be formed with circuit layer on this circuit board, these a plurality of luminescence units are arranged on the precalculated position of this circuit board, and are electrically connected each other through circuit layer, and draw two electrodes and be electrically connected with external power source.Because circuit layer is arranged on the precalculated position of circuit board, it is change of location and annexation each other arbitrarily, and therefore, the electrical connection between these a plurality of luminescence units is relative fixed also, as, series, parallel or series-parallel connection.When needs change the annexation between these a plurality of luminescence units, then need change circuit board, and these a plurality of luminescence units of layout again.So a plurality of luminescence unit annexations that this kind light emitting diode module comprises are fixed, can't carry out independent assortment as required.
Summary of the invention
But a kind of light emitting diode module of connected mode independent assortment of luminescence unit will be described below with embodiment.
A kind of light emitting diode module, it comprises circuit board, first circuit layer, a plurality of electrode pin, substrate and a plurality of luminescence unit.This first circuit layer is formed on this circuit board, and this first circuit layer is electrically connected with external power source.These a plurality of electrode pins are formed on this circuit board.This substrate links to each other with this circuit board.These a plurality of luminescence units are arranged on this substrate; These a plurality of luminescence units are electrically connected with first circuit layer through these a plurality of electrode pins respectively; Adjust the connected mode of these a plurality of electrode pins and this first circuit layer, thereby adjust the connected mode between these a plurality of luminescence units.
With respect to prior art; Said light emitting diode module can be through changing the connected mode between these a plurality of electrode pins and first circuit layer; Thereby freely adjust the connected mode between these a plurality of luminescence units, and need not to change again circuit board, and reinstall luminescence unit.This light emitting diode module can freely be adjusted the connected mode of these a plurality of luminescence units, and is simple in structure, and circuit board can reuse.
Description of drawings
Fig. 1 is the diagrammatic sketch of bowing of the light emitting diode module of the embodiment of the invention.
Fig. 2 is that first kind of circuit of the light emitting diode module of Fig. 1 connects sketch map.
Fig. 3 is the equivalent circuit diagram that circuit connects among Fig. 2.
Fig. 4 is that second kind of circuit of the light emitting diode module of Fig. 1 connects sketch map.
Fig. 5 is the equivalent circuit diagram that circuit connects among Fig. 4.
The main element symbol description
Light emitting diode module 100
Circuit board 12
First interface 131
Second interface 132
Electrode pin 14
First pair of electrode pin 141
Second pair of electrode pin 142
The 3rd pair of electrode pin 143
Substrate 15
Second circuit layer 16
Luminescence unit 17
The 3rd luminescence unit 173
The specific embodiment
To combine accompanying drawing that the embodiment of the invention is done further to specify below.
See also Fig. 1, the embodiment of the invention provides a kind of light emitting diode module 100, and it comprises circuit board 12, is formed on first circuit layer 13, a plurality of electrode pin 14, substrate 15 and a plurality of luminescence unit 17 on this circuit board 12.
In the present embodiment, an end of this circuit board 12 is formed with first circuit layer 13, and draws first interface 131 and second interface 132, and wherein, first interface 131 is an anode, and second interface 132 is a negative electrode.This first circuit layer 13 is used for being electrically connected with external power source.
The other end of this circuit board 12 is provided with a plurality of electrode pins 14.In the present embodiment, these a plurality of electrode pins 14 comprise 141, one second pairs of electrode pins 142 of one first pair of electrode pin, and one the 3rd pair of electrode pin 143.Every pair of electrode pin includes an anode pin and a negative electrode pin.These a plurality of electrode pins 14 are electrically connected with first interface 131 and second interface 132 of this first circuit layer 13 through lead, thereby realize being electrically connected with external power source.
This substrate 15 is tabular, and it is used for carrying these a plurality of luminescence units 17.In the present embodiment, this substrate 15 is processed by metal material, the copper good like thermal conductivity, and its heat that can quickly these luminescence unit 17 work be produced is distributed in the air.Certainly, this substrate 15 also can be processed by the material of heat conduction and insulation, and one-body molded with this circuit board 12.
These a plurality of luminescence units 17 are arranged on this substrate 15.In the present embodiment, these a plurality of luminescence units 17 comprise one first luminescence unit, 171, one second luminescence units 172, and one the 3rd luminescence unit 173.Each luminescence unit 17 is a light emitting diode.Certainly, each luminescence unit 17 also can be the lighting unit that is interconnected to form by a plurality of light emitting diodes.And the quantity of luminescence unit 17, arrangement mode also can be adjusted as required.In the present embodiment, this substrate 15 is made of metal, and each luminescence unit 17 is electrically connected with these a plurality of electrode pins 14 respectively through the routing mode.
In the present embodiment, this light emitting diode module 100 further comprises second circuit layer 16, and this second circuit layer 16 is formed on this substrate 15.The electrode of these a plurality of luminescence units 17 is drawn through this second circuit layer 16 respectively, and is electrically connected with these a plurality of electrode pins 14 respectively.These a plurality of electrode pins 14 are electrically connected with first interface 131 and second interface 132 of this first circuit layer 13 through lead, thereby realize being electrically connected with external power source.This light emitting diode module 100 can be passed through to change between these a plurality of electrode pins 14, and the connected mode between these a plurality of electrode pins 14 and first interface 131 and second interface 132, thereby adjusts the connected mode of these a plurality of luminescence units 17.
Please in the lump referring to Fig. 2, a kind of circuit connecting mode of this light emitting diode module 100 that the embodiment of the invention provides.Particularly, the anode of 141, the second pairs of electrode pins 142 of this first pair of electrode pin and the 3rd pair of electrode pin 143 is electrically connected each other and is electrically connected with first interface 131 of this first circuit layer 13.This first pair of electrode pin 141; The negative electrode of second pair of electrode pin 142 and the 3rd pair of electrode pin 143 is electrically connected each other and is electrically connected with second interface 132 of this first circuit layer 13; Thereby realize this first luminescence unit 171; Second luminescence unit 172 and the 3rd luminescence unit 173 are parallel with one another, please in the lump referring to Fig. 3, and an equivalent circuit diagram of this light emitting diode module 100.
See also Fig. 4, the another kind of circuit connecting mode of this light emitting diode module 100 that the embodiment of the invention provides.The anode of this first pair of electrode pin 141 is connected with the cathodic electricity of second pair of electrode pin 142, and is electrically connected with second interface 132 of this first circuit layer 13.The negative electrode of this first pair of electrode pin 141 is connected with the cathodic electricity of the 3rd pair of electrode pin 143.The anode of this second pair of electrode pin 142 is electrically connected with the anode of the 3rd pair of electrode pin 143, and is electrically connected with first interface 131 of this first circuit layer 13.Therefore, realized that this first luminescence unit 171 and second luminescence unit 172 form series circuits after, parallelly connected with the 3rd luminescence unit 173 again, thus form a series and parallel circuit.Please in the lump referring to Fig. 5, another equivalent circuit diagram of this light emitting diode module 100.
It is understandable that; In the present embodiment; The annexation of these first luminescence unit, 171, the second luminescence units 172 and the 3rd luminescence unit 173 is not limited to shown in the foregoing description, can be through changing this first pair of electrode pin 141; Annexation between second pair of electrode pin 142 and the 3rd pair of electrode pin 143 and this first interface 131 and second interface 132, thereby the annexation between can these a plurality of luminescence units 17.
This light emitting diode module 100 can be through changing between these a plurality of electrode pins 14; And the connected mode between these a plurality of electrode pins 14 and first interface 131 and second interface 132; Thereby freely adjust the connected mode between these a plurality of luminescence units 17; And need not to change again circuit board, and reinstall luminescence unit 17.This light emitting diode module 100 can freely be adjusted the connected mode of these a plurality of luminescence units 17, and is simple in structure, and circuit board 12 can reuse.
It is understandable that those skilled in the art also can do other variation in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.These all should be included within the present invention's scope required for protection according to the variation that the present invention's spirit is done.
Claims (7)
1. light emitting diode module, it comprises:
Circuit board;
First circuit layer, it is formed on this circuit board, and this first circuit layer is electrically connected with external power source;
A plurality of electrode pins, it is formed on this circuit board;
Substrate, it links to each other with this circuit board; And
A plurality of luminescence units; It is arranged on this substrate; These a plurality of luminescence units are electrically connected with first circuit layer through these a plurality of electrode pins respectively, adjust the connected mode of these a plurality of electrode pins and this first circuit layer, thereby adjust the connected mode between these a plurality of luminescence units.
2. light emitting diode module as claimed in claim 1 is characterized in that this substrate is processed by metal material.
3. light emitting diode module as claimed in claim 2 is characterized in that, these a plurality of luminescence units are arranged on this substrate, and is electrically connected with these a plurality of electrode pins respectively through the routing mode.
4. light emitting diode module as claimed in claim 1 is characterized in that this substrate is processed by heat-conducting insulation material.
5. light emitting diode module as claimed in claim 4 is characterized in that, this substrate and this circuit board are one-body molded.
6. light emitting diode module as claimed in claim 1; It is characterized in that; This light emitting diode module further comprises the second circuit layer; This second circuit layer is formed on this substrate, and the electrode of these a plurality of luminescence units is drawn through this second circuit layer, and is electrically connected with first circuit layer through these a plurality of electrode pins respectively.
7. light emitting diode module as claimed in claim 6 is characterized in that, this first circuit layer is drawn two interfaces, adjusts the connected mode of these a plurality of electrode pins and these two interfaces, thereby adjusts the connected mode between these a plurality of luminescence units.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010513336.XA CN102454878B (en) | 2010-10-19 | 2010-10-19 | Light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010513336.XA CN102454878B (en) | 2010-10-19 | 2010-10-19 | Light-emitting diode module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102454878A true CN102454878A (en) | 2012-05-16 |
| CN102454878B CN102454878B (en) | 2014-07-02 |
Family
ID=46038358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010513336.XA Expired - Fee Related CN102454878B (en) | 2010-10-19 | 2010-10-19 | Light-emitting diode module |
Country Status (1)
| Country | Link |
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| CN (1) | CN102454878B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219331A (en) * | 2012-09-13 | 2013-07-24 | 天津金玛光电有限公司 | One-way high voltage (HV) light-emitting diode (LED) chip |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005129605A (en) * | 2003-10-22 | 2005-05-19 | Ricoh Co Ltd | Wiring board and semiconductor package using it |
| CN200965882Y (en) * | 2006-10-31 | 2007-10-24 | 吴继德 | Multi-chip package LED |
| JP2008211255A (en) * | 2002-04-12 | 2008-09-11 | Seoul Semiconductor Co Ltd | Light-emitting device |
| CN201117657Y (en) * | 2007-08-10 | 2008-09-17 | 深圳市贝晶光电科技有限公司 | Light emitting diode packaging structure |
| CN201134957Y (en) * | 2007-12-07 | 2008-10-15 | 讯凯国际股份有限公司 | LED illuminating device and illuminating module with the same |
| CN201262369Y (en) * | 2008-07-08 | 2009-06-24 | 东贝光电科技股份有限公司 | Illuminating device |
| CN101603636A (en) * | 2008-06-10 | 2009-12-16 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| US20100051972A1 (en) * | 2008-08-28 | 2010-03-04 | Ding-Yuan Chen | Light-Emitting Diode Integration Scheme |
| CN101684915A (en) * | 2008-09-24 | 2010-03-31 | 奇力光电科技股份有限公司 | Light-emitting diode (LED) illuminating lamp |
| CN201585224U (en) * | 2009-09-30 | 2010-09-15 | 吴献桐 | Device with radiating element |
-
2010
- 2010-10-19 CN CN201010513336.XA patent/CN102454878B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008211255A (en) * | 2002-04-12 | 2008-09-11 | Seoul Semiconductor Co Ltd | Light-emitting device |
| JP2005129605A (en) * | 2003-10-22 | 2005-05-19 | Ricoh Co Ltd | Wiring board and semiconductor package using it |
| CN200965882Y (en) * | 2006-10-31 | 2007-10-24 | 吴继德 | Multi-chip package LED |
| CN201117657Y (en) * | 2007-08-10 | 2008-09-17 | 深圳市贝晶光电科技有限公司 | Light emitting diode packaging structure |
| CN201134957Y (en) * | 2007-12-07 | 2008-10-15 | 讯凯国际股份有限公司 | LED illuminating device and illuminating module with the same |
| CN101603636A (en) * | 2008-06-10 | 2009-12-16 | 展晶科技(深圳)有限公司 | Light supply apparatus |
| CN201262369Y (en) * | 2008-07-08 | 2009-06-24 | 东贝光电科技股份有限公司 | Illuminating device |
| US20100051972A1 (en) * | 2008-08-28 | 2010-03-04 | Ding-Yuan Chen | Light-Emitting Diode Integration Scheme |
| CN101684915A (en) * | 2008-09-24 | 2010-03-31 | 奇力光电科技股份有限公司 | Light-emitting diode (LED) illuminating lamp |
| CN201585224U (en) * | 2009-09-30 | 2010-09-15 | 吴献桐 | Device with radiating element |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219331A (en) * | 2012-09-13 | 2013-07-24 | 天津金玛光电有限公司 | One-way high voltage (HV) light-emitting diode (LED) chip |
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| Publication number | Publication date |
|---|---|
| CN102454878B (en) | 2014-07-02 |
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