TWI420959B - Led module - Google Patents

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Publication number
TWI420959B
TWI420959B TW99135851A TW99135851A TWI420959B TW I420959 B TWI420959 B TW I420959B TW 99135851 A TW99135851 A TW 99135851A TW 99135851 A TW99135851 A TW 99135851A TW I420959 B TWI420959 B TW I420959B
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light emitting
electrode pins
circuit layer
substrate
circuit
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TW99135851A
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Chinese (zh)
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TW201218849A (en
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Chia Chen Chang
Yue Zhi Chen
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Advanced Optoelectronic Tech
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Description

發光二極體模組 Light-emitting diode module

本發明涉及一種照明裝置,尤其涉及一種發光二極體模組。 The invention relates to a lighting device, in particular to a light emitting diode module.

目前,發光二極體(Light Emitting Diode,LED)因具有功耗低、壽命長、體積小及亮度高等特性已經被廣泛應用到很多領域。 At present, Light Emitting Diode (LED) has been widely used in many fields due to its low power consumption, long life, small size and high brightness.

一般地,發光二極體模組包括電路板以及設置在該電路板上的多個發光單元。該電路板上形成有電路層,該多個發光單元設置在該電路板的預定位置,並通過電路層相互電連接,並引出兩個電極與外部電源電連接。由於電路層是設置在電路板的預定位置,其不能隨意變更位置與相互之間的連接關係,因此,該多個發光單元之間的電連接關係也相對固定,如,串聯、並聯或混聯。當需要改變該多個發光單元之間的連接關係時,則需要更換電路板,並且重新佈局該多個發光單元。所以,該種發光二極體模組包括的多個發光單元連接關係固定,無法根據需要進行自由組合。 Generally, a light emitting diode module includes a circuit board and a plurality of light emitting units disposed on the circuit board. A circuit layer is formed on the circuit board, and the plurality of light emitting units are disposed at predetermined positions of the circuit board, and are electrically connected to each other through the circuit layer, and the two electrodes are electrically connected to the external power source. Since the circuit layer is disposed at a predetermined position of the circuit board, the position and the connection relationship between the plurality of light-emitting units are relatively fixed, for example, series, parallel or hybrid. . When it is necessary to change the connection relationship between the plurality of light emitting units, it is necessary to replace the circuit board and rearrange the plurality of light emitting units. Therefore, the plurality of light-emitting units included in the light-emitting diode module have a fixed connection relationship and cannot be freely combined as needed.

下面將以實施例說明一種發光單元的連接方式可自由組合的發光二極體模組。 Hereinafter, a light-emitting diode module in which the connection manner of the light-emitting units can be freely combined will be described by way of an embodiment.

一種發光二極體模組,其包括電路板、第一電路層、多個電極引腳、基板以及多個發光單元。該第一電路層形成在該電路板上,該第一電路層與外部電源電連接。該多個電極引腳形成在該電路 板上。該基板與該電路板相連。該多個發光單元設置在該基板上,該多個發光單元分別通過該多個電極引腳與第一電路層電連接,調整該多個電極引腳與該第一電路層的連接方式,從而調整該多個發光單元之間的連接方式。 A light emitting diode module includes a circuit board, a first circuit layer, a plurality of electrode leads, a substrate, and a plurality of light emitting units. The first circuit layer is formed on the circuit board, and the first circuit layer is electrically connected to an external power source. The plurality of electrode pins are formed in the circuit On the board. The substrate is connected to the circuit board. The plurality of light emitting units are disposed on the substrate, and the plurality of light emitting units are electrically connected to the first circuit layer through the plurality of electrode pins, thereby adjusting a connection manner between the plurality of electrode pins and the first circuit layer, thereby Adjusting the connection mode between the plurality of light emitting units.

相對於先前技術,所述發光二極體模組可以通過改變該多個電極引腳與第一電路層之間的連接方式,從而自由調整該多個發光單元之間的連接方式,而無需重新更換電路板,並重新安裝發光單元。該發光二極體模組可自由調整該多個發光單元的連接方式,結構簡單,且電路板可重複利用。 Compared with the prior art, the LED module can freely adjust the connection manner between the plurality of LED units by changing the connection manner between the plurality of electrode pins and the first circuit layer without Replace the board and reinstall the lighting unit. The LED module can freely adjust the connection manner of the plurality of light emitting units, has a simple structure, and the circuit board can be reused.

100‧‧‧發光二極體模組 100‧‧‧Lighting diode module

12‧‧‧電路板 12‧‧‧ boards

13‧‧‧第一電路層 13‧‧‧First circuit layer

131‧‧‧第一介面 131‧‧‧ first interface

132‧‧‧第二介面 132‧‧‧Second interface

14‧‧‧電極引腳 14‧‧‧Electrode pins

141‧‧‧第一對電極引腳 141‧‧‧first pair of electrode pins

142‧‧‧第二對電極引腳 142‧‧‧Second pair of electrode pins

143‧‧‧第三對電極引腳 143‧‧‧ third pair of electrode pins

15‧‧‧基板 15‧‧‧Substrate

16‧‧‧第二電路層 16‧‧‧Second circuit layer

17‧‧‧發光單元 17‧‧‧Lighting unit

171‧‧‧第一發光單元 171‧‧‧First lighting unit

172‧‧‧第二發光單元 172‧‧‧second lighting unit

173‧‧‧第三發光單元 173‧‧‧3rd lighting unit

圖1是本發明實施例的發光二極體模組的俯示圖。 1 is a top plan view of a light emitting diode module in accordance with an embodiment of the present invention.

圖2是圖1的發光二極體模組的第一種電路連接示意圖。 2 is a first circuit connection diagram of the LED module of FIG. 1.

圖3是圖2中電路連接的等效電路圖。 Figure 3 is an equivalent circuit diagram of the circuit connections of Figure 2.

圖4是圖1的發光二極體模組的第二種電路連接示意圖。 4 is a schematic view showing a second circuit connection of the LED module of FIG. 1.

圖5是圖4中電路連接的等效電路圖。 Figure 5 is an equivalent circuit diagram of the circuit connections of Figure 4.

下面將結合附圖對本發明實施例作進一步的詳細說明。 The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

請參閱圖1,本發明實施例提供一種發光二極體模組100,其包括電路板12,形成在該電路板12上的第一電路層13、多個電極引腳14、基板15、以及多個發光單元17。 Referring to FIG. 1 , an embodiment of the present invention provides a light emitting diode module 100 including a circuit board 12 , a first circuit layer 13 , a plurality of electrode leads 14 , a substrate 15 , and A plurality of light emitting units 17.

在本實施例中,該電路板12的一端形成有第一電路層13,並引出第一介面131與第二介面132,其中,第一介面131為陽極,第二 介面132為陰極。該第一電路層13用於與外部電源電連接。 In this embodiment, the first circuit layer 13 is formed at one end of the circuit board 12, and the first interface 131 and the second interface 132 are extracted. The first interface 131 is an anode, and the second interface Interface 132 is a cathode. The first circuit layer 13 is for electrically connecting to an external power source.

該電路板12的另一端設置有多個電極引腳14。在本實施例中,該多個電極引腳14包括一第一對電極引腳141,一第二對電極引腳142,以及一第三對電極引腳143。每對電極引腳均包括一陽極引腳與一陰極引腳。該多個電極引腳14通過導線與該第一電路層13的第一介面131以及第二介面132電連接,從而實現與外部電源電連接。 The other end of the circuit board 12 is provided with a plurality of electrode pins 14. In this embodiment, the plurality of electrode pins 14 include a first pair of electrode pins 141, a second pair of electrode pins 142, and a third pair of electrode pins 143. Each pair of electrode pins includes an anode pin and a cathode pin. The plurality of electrode pins 14 are electrically connected to the first interface 131 and the second interface 132 of the first circuit layer 13 by wires, thereby achieving electrical connection with an external power source.

該基板15呈平板狀,其用於承載該多個發光單元17。在本實施例中,該基板15由金屬材料製成,如導熱性良好的銅,其可以較快地將該發光單元17工作產生的熱量散發至空氣中。當然,該基板15也可以由導熱且絕緣的材料製成,且與該電路板12一體成型。 The substrate 15 has a flat shape for carrying the plurality of light emitting units 17. In the present embodiment, the substrate 15 is made of a metal material such as copper having good thermal conductivity, which can quickly dissipate the heat generated by the operation of the light-emitting unit 17 into the air. Of course, the substrate 15 can also be made of a thermally and insulating material and integrally formed with the circuit board 12.

該多個發光單元17設置在該基板15上。在本實施例中,該多個發光單元17包括一第一發光單元171,一第二發光單元172,以及一第三發光單元173。每個發光單元17為一個發光二極體。當然,每個發光單元17也可以為由多個發光二極體相互連接形成的照明單元。並且,發光單元17的數量、排布方式也可以根據需要進行調整。在本實施例中,該基板15由金屬製成,每個發光單元17通過打線方式分別與該多個電極引腳14電連接。 The plurality of light emitting units 17 are disposed on the substrate 15. In this embodiment, the plurality of light emitting units 17 include a first light emitting unit 171, a second light emitting unit 172, and a third light emitting unit 173. Each of the light emitting units 17 is a light emitting diode. Of course, each of the light emitting units 17 may also be a lighting unit formed by connecting a plurality of light emitting diodes to each other. Further, the number and arrangement of the light-emitting units 17 can be adjusted as needed. In the embodiment, the substrate 15 is made of metal, and each of the light emitting units 17 is electrically connected to the plurality of electrode pins 14 by wire bonding.

在本實施例中,該發光二極體模組100進一步包括第二電路層16,該第二電路層16形成在該基板15上。該多個發光單元17的電極分別通過該第二電路層16引出,並分別與該多個電極引腳14電連接。該多個電極引腳14通過導線與該第一電路層13的第一介面131以及第二介面132電連接,從而實現與外部電源電連接。該發光二極體模組100可以通過改變該多個電極引腳14之間,以及該 多個電極引腳14與第一介面131以及第二介面132之間的連接方式,從而調整該多個發光單元17的連接方式。 In the embodiment, the LED module 100 further includes a second circuit layer 16 formed on the substrate 15 . The electrodes of the plurality of light-emitting units 17 are respectively led out through the second circuit layer 16 and electrically connected to the plurality of electrode leads 14 respectively. The plurality of electrode pins 14 are electrically connected to the first interface 131 and the second interface 132 of the first circuit layer 13 by wires, thereby achieving electrical connection with an external power source. The LED module 100 can be changed between the plurality of electrode pins 14 and The connection between the plurality of electrode pins 14 and the first interface 131 and the second interface 132 adjusts the connection manner of the plurality of light emitting units 17.

請一併參見圖2,本發明實施例提供的該發光二極體模組100的一種電路連接方式。具體地,該第一對電極引腳141,第二對電極引腳142以及該第三對電極引腳143的陽極相互電連接並與該第一電路層13的第一介面131電連接。該第一對電極引腳141,第二對電極引腳142以及該第三對電極引腳143的陰極相互電連接並與該第一電路層13的第二介面132電連接,從而實現該第一發光單元171,第二發光單元172以及該第三發光單元173相互並聯,請一併參見圖3,該發光二極體模組100的一等效電路圖。 Referring to FIG. 2, a circuit connection manner of the LED module 100 provided by the embodiment of the present invention is shown. Specifically, the first pair of electrode pins 141, the second pair of electrode pins 142, and the anodes of the third pair of electrode pins 143 are electrically connected to each other and to the first interface 131 of the first circuit layer 13. The first pair of electrode pins 141, the second pair of electrode pins 142, and the cathodes of the third pair of electrode pins 143 are electrically connected to each other and electrically connected to the second interface 132 of the first circuit layer 13, thereby realizing the first An illumination unit 171, a second illumination unit 172, and the third illumination unit 173 are connected in parallel. Referring to FIG. 3, an equivalent circuit diagram of the LED module 100 is shown.

請參見圖4,本發明實施例提供的該發光二極體模組100的另一種電路連接方式。該第一對電極引腳141的陽極與第二對電極引腳142的陰極電連接,且與該第一電路層13的第二介面132電連接。該第一對電極引腳141的陰極與該第三對電極引腳143的陰極電連接。該第二對電極引腳142的陽極與該第三對電極引腳143的陽極電連接,且與該第一電路層13的第一介面131電連接。因此,實現了該第一發光單元171與第二發光單元172形成串聯電路後,再與該第三發光單元173並聯,從而形成一混聯電路。請一併參見圖5,該發光二極體模組100的另一等效電路圖。 Referring to FIG. 4, another circuit connection manner of the LED module 100 provided by the embodiment of the present invention is shown. The anode of the first pair of electrode pins 141 is electrically connected to the cathode of the second pair of electrode pins 142 and is electrically connected to the second interface 132 of the first circuit layer 13. The cathode of the first pair of electrode pins 141 is electrically connected to the cathode of the third pair of electrode pins 143. The anode of the second pair of electrode pins 142 is electrically connected to the anode of the third pair of electrode pins 143 and is electrically connected to the first interface 131 of the first circuit layer 13. Therefore, after the first light emitting unit 171 and the second light emitting unit 172 form a series circuit, the third light emitting unit 173 is further connected in parallel to form a hybrid circuit. Please refer to FIG. 5 again, another equivalent circuit diagram of the LED module 100.

可以理解的是,在本實施例中,該第一發光單元171,第二發光單元172以及該第三發光單元173的連接關係不限於上述實施例所示,可以通過改變該第一對電極引腳141,第二對電極引腳142以及該第三對電極引腳143與該第一介面131以及第二介面132之間的連接關係,從而可以該多個發光單元17之間的連接關係。 It can be understood that, in this embodiment, the connection relationship between the first illuminating unit 171, the second illuminating unit 172, and the third illuminating unit 173 is not limited to that shown in the foregoing embodiment, and the first pair of electrodes may be changed. The connection relationship between the leg 141, the second pair of electrode pins 142, and the third pair of electrode pins 143 and the first interface 131 and the second interface 132 can thereby establish a connection relationship between the plurality of light emitting units 17.

該發光二極體模組100可以通過改變該多個電極引腳14之間,以及該多個電極引腳14與第一介面131以及第二介面132之間的連接方式,從而自由調整該多個發光單元17之間的連接方式,而無需重新更換電路板,並重新安裝發光單元17。該發光二極體模組100可自由調整該多個發光單元17的連接方式,結構簡單,且電路板12可重複利用。 The LED module 100 can freely adjust the connection between the plurality of electrode pins 14 and the connection between the plurality of electrode pins 14 and the first interface 131 and the second interface 132. The connection between the light-emitting units 17 without replacing the circuit board and reinstalling the light-emitting unit 17. The LED module 100 can freely adjust the connection manner of the plurality of light emitting units 17, has a simple structure, and the circuit board 12 can be reused.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧發光二極體模組 100‧‧‧Lighting diode module

12‧‧‧電路板 12‧‧‧ boards

13‧‧‧第一電路層 13‧‧‧First circuit layer

131‧‧‧第一介面 131‧‧‧ first interface

132‧‧‧第二介面 132‧‧‧Second interface

14‧‧‧電極引腳 14‧‧‧Electrode pins

141‧‧‧第一對電極引腳 141‧‧‧first pair of electrode pins

142‧‧‧第二對電極引腳 142‧‧‧Second pair of electrode pins

143‧‧‧第三對電極引腳 143‧‧‧ third pair of electrode pins

15‧‧‧基板 15‧‧‧Substrate

16‧‧‧第二電路層 16‧‧‧Second circuit layer

17‧‧‧發光單元 17‧‧‧Lighting unit

171‧‧‧第一發光單元 171‧‧‧First lighting unit

172‧‧‧第二發光單元 172‧‧‧second lighting unit

173‧‧‧第三發光單元 173‧‧‧3rd lighting unit

Claims (6)

一種發光二極體模組,所述發光二極體模組括:電路板;第一電路層,所述第一電路層形成在所述電路板上,所述第一電路層與外部電源電連接;第二電路層,所述第二電路層形成在所述基板上;多個電極引腳,所述多個電極引腳形成在所述電路板上;基板,所述基板與所述電路板相連;及多個發光單元,所述多個發光單元設置在所述基板上,所述多個發光單元的電極通過所述第二電路層引出,並分別通過所述多個電極引腳與第一電路層電連接,調整所述多個電極引腳與所述第一電路層的連接方式,從而調整所述多個發光單元之間的連接方式。 A light emitting diode module, the light emitting diode module includes: a circuit board; a first circuit layer, the first circuit layer is formed on the circuit board, and the first circuit layer is electrically connected to an external power source a second circuit layer, the second circuit layer is formed on the substrate; a plurality of electrode pins, the plurality of electrode pins are formed on the circuit board; a substrate, the substrate and the circuit And a plurality of light emitting units, wherein the plurality of light emitting units are disposed on the substrate, and electrodes of the plurality of light emitting units are led out through the second circuit layer and respectively passed through the plurality of electrode pins The first circuit layer is electrically connected to adjust a connection manner between the plurality of electrode pins and the first circuit layer, thereby adjusting a connection manner between the plurality of light emitting units. 如申請專利範圍第1項所述之發光二極體模組,其中,所述基板由金屬材料製成。 The light emitting diode module of claim 1, wherein the substrate is made of a metal material. 如申請專利範圍第2項所述之發光二極體模組,其中,所述多個發光單元設置在所述基板上,並通過打線方式分別與所述多個電極引腳電連接。 The illuminating diode module of claim 2, wherein the plurality of illuminating units are disposed on the substrate and electrically connected to the plurality of electrode pins by wire bonding. 如申請專利範圍第1項所述之發光二極體模組,其中,所述基板由導熱絕緣材料製成。 The illuminating diode module of claim 1, wherein the substrate is made of a thermally conductive insulating material. 如申請專利範圍第4所述之發光二極體模組,其中,所述基板與所述電路板一體成型。 The light emitting diode module of claim 4, wherein the substrate is integrally formed with the circuit board. 如申請專利範圍第1所述之發光二極體模組,其中,所述第一電路層引出兩個介面,調整所述多個電極引腳與所述兩個介面的連接方式,從而調整所述多個發光單元之間的連接方式。 The illuminating diode module of claim 1, wherein the first circuit layer leads to two interfaces, and the connection manner between the plurality of electrode pins and the two interfaces is adjusted, thereby adjusting the The manner of connection between the plurality of light emitting units is described.
TW99135851A 2010-10-20 2010-10-20 Led module TWI420959B (en)

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* Cited by examiner, † Cited by third party
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TWM387195U (en) * 2010-04-08 2010-08-21 Ge Investment Co Ltd LED illumination apparatus

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