JP3158947U - LED board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED substrate in which a plurality of LEDs are arranged. A circuit 4 is formed on the surface of a base material having high thermal conductivity via an insulator containing a filler made of an inorganic material, and a plurality of LED elements 5 arranged in series along the circuit are formed. The circuit is composed of a plurality of conductors formed in a U shape on the surface of a substrate, and the LED element is composed of a plurality of LED chips. It is a semiconductor component, and the constant current element supplies a constant current to a plurality of conductors formed in the U shape. [Selection diagram] Fig. 1

Description

  The present invention relates to an LED illumination board, and more particularly to an LED board that can change illumination output without changing the circuit voltage of the board.

  In recent years, various lighting devices using LEDs have been proposed and commercialized. Unlike conventional light source configurations, LEDs have a long life and low power consumption.

  Many planar lamp modules using LEDs that utilize this feature as light sources have been proposed. For example, there is a constant current LED substrate that equalizes the current of all LEDs by dividing a large number of LEDs into a plurality of groups, providing a constant current circuit for each group, and aligning the output current of each constant current circuit (See Patent Document 1). In addition, a plurality of LEDs are connected in series on the surface of the printed wiring board, and a pair of connection terminals, a rectifier circuit, and a constant current circuit, which are electrically connected between corresponding electrodes, are supplied via the connection terminals. There is also an LED lamp module that converts alternating current into direct current using a rectifier circuit, supplies the direct current to the LED via a constant current circuit, and drives the LED to light (see Patent Document 2).

Utility Model Registration No. 3105302 Utility Model Registration No. 3142792

  However, each of the techniques proposed in Patent Documents 1 and 2 has a configuration in which LEDs are connected in series and a constant current is supplied, but an appropriate circuit is considered in consideration of the size of the substrate on which the LEDs are mounted. No consideration has been given to the point of forming the light and the technology for ensuring the required light quantity.

  In view of the above problems, the present inventor uses a LED element, which is a semiconductor component composed of a plurality of LED chips, to secure a necessary amount of light, and a plurality of U-shapes formed on the surface of the substrate. It came to provide the LED board which can change an illumination output, without changing the circuit voltage of a board | substrate by connecting in series with a conductor.

  Therefore, the LED substrate of the present invention is an LED substrate on which a large number of LED elements are mounted, and a circuit is formed on the surface of a base material having high thermal conductivity via an insulator containing a filler made of an inorganic material. And a plurality of LED elements arranged in series along the circuit, and a constant current element for supplying a constant current to the LED element, the circuit having a plurality of conductors formed in a U shape on the surface of the substrate The LED element is a semiconductor component composed of a plurality of LED chips, and the constant current element supplies a constant current to the plurality of U-shaped conductors.

  The base material used in the present invention is preferably a metal material having high thermal conductivity such as aluminum.

  According to the LED substrate according to the present invention, since a plurality of circuits in which a plurality of LED elements are connected in series are formed in a U shape on the substrate, the light output can be changed without changing the circuit voltage. Has an effect.

  The plurality of LED elements are semiconductor components composed of a plurality of LED chips, and a sufficient amount of light can be secured even if the number of LED elements mounted on the substrate is small, and the manufacturing cost is low.

It is a top view which shows one Example of the LED board which concerns on this invention. It is a side view of FIG. It is expansion explanatory drawing of a LED element.

  Hereinafter, although this invention is demonstrated, referring drawings which show an Example, it cannot be overemphasized that this invention is not limited to a present Example. FIG. 1 is a plan view showing an embodiment of the LED board of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. 3 is an enlarged explanatory view of the LED board.

  As shown in FIGS. 1 and 2, the LED substrate 1 of the present invention is coated with a thermosetting resin containing an inorganic filler such as alumina or silica on the surface of a substrate body 2 made of Al having high thermal conductivity. An electrical insulating layer 3 is formed, and a conductor circuit 4 made of Cu foil is formed on the surface of the electrical insulating layer 3.

  The conductor circuit 4 connects a plurality of LED elements 5 to be described later in series and is formed into a U-shaped circuit in plan view. A chip resistor 6 and a constant current element 7 are disposed at one end of the circuit. Then, the current supplied from the external power source is set to a constant current value by the constant current element 7 via the connector 8 and is supplied to each LED element 5.

  In the present embodiment, the above-described conductor circuits 4 are arranged so as to overlap in three rows, the same number of LED elements 5 are equally arranged and surface-mounted, and each circuit has the same circuit voltage.

  FIG. 3 is an enlarged explanatory view of the LED element 5, (a) is a side view, (b) is a plan view, and (c) is a side view. As shown in the figure, a plurality of LED chips 9 are respectively mounted on the base material of the LED element 5.

  In the LED substrate 1 having the above configuration, a plurality of U-shaped circuits on which a plurality of LED elements are connected in series are formed on the substrate. For example, the LED elements are arranged in one row of three rows of conductor circuits. Even without mounting, it is not necessary to change the circuit voltage, and the optical output can be changed. In the LED board of the present embodiment, it can be changed from 36 W to 25 W.

  As described above, according to the LED substrate of the present invention, it is an LED illumination substrate, and in particular, the illumination output can be changed without changing the circuit voltage of the substrate, and the LED element composed of a plurality of LED chips, Even if the number mounted on the substrate is small, a sufficient amount of light can be secured and the manufacturing cost can be reduced.

DESCRIPTION OF SYMBOLS 1 LED board 2 Board | substrate body 3 Electrical insulation layer 4 Conductor circuit 5 LED element 6 Chip resistance 7 Constant current element 8 Connector 9 LED chip

Claims (1)

  An LED board on which a large number of LED elements are mounted, and a circuit is formed on the surface of a base material having high thermal conductivity via an insulator containing a filler made of an inorganic material, and arranged in series along the circuit. A plurality of LED elements and a constant current element for supplying a constant current to the LED elements, the circuit being a plurality of conductors formed in a U-shape on the surface of the substrate, and the LED elements comprising a plurality of LED elements An LED substrate, comprising: a semiconductor component comprising an LED chip, wherein the constant current element supplies a constant current to each of the plurality of conductors formed in the U-shape.

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