GB201500847D0 - Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation - Google Patents

Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation

Info

Publication number
GB201500847D0
GB201500847D0 GB201500847A GB201500847A GB201500847D0 GB 201500847 D0 GB201500847 D0 GB 201500847D0 GB 201500847 A GB201500847 A GB 201500847A GB 201500847 A GB201500847 A GB 201500847A GB 201500847 D0 GB201500847 D0 GB 201500847D0
Authority
GB
United Kingdom
Prior art keywords
nano
heat
surface area
power dissipation
increased surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB201500847A
Other versions
GB2519253A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIVAS VICTOR A
Original Assignee
RIVAS VICTOR A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIVAS VICTOR A filed Critical RIVAS VICTOR A
Publication of GB201500847D0 publication Critical patent/GB201500847D0/en
Publication of GB2519253A publication Critical patent/GB2519253A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB201500847A 2012-08-06 2012-08-06 Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation Withdrawn GB2519253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/049694 WO2014025332A1 (en) 2012-08-06 2012-08-06 Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation

Publications (2)

Publication Number Publication Date
GB201500847D0 true GB201500847D0 (en) 2015-03-04
GB2519253A GB2519253A (en) 2015-04-15

Family

ID=50068435

Family Applications (1)

Application Number Title Priority Date Filing Date
GB201500847A Withdrawn GB2519253A (en) 2012-08-06 2012-08-06 Nano-machined materials using femtosecond pulse-laser technologies for increased surface area and heat-power dissipation

Country Status (8)

Country Link
JP (1) JP2015530925A (en)
KR (1) KR20150046015A (en)
CN (1) CN104603714A (en)
BR (1) BR112015002627A2 (en)
CA (1) CA2880490A1 (en)
DE (1) DE112012006782T5 (en)
GB (1) GB2519253A (en)
WO (1) WO2014025332A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10189117B2 (en) 2013-12-31 2019-01-29 The United States Of America, As Represented By The Secretary Of The Navy Adhesion improvement via material nanostructuring or texturizing
US10106880B2 (en) 2013-12-31 2018-10-23 The United States Of America, As Represented By The Secretary Of The Navy Modifying the surface chemistry of a material
KR102194694B1 (en) * 2019-12-31 2020-12-24 한국과학기술원 Integrated inspection system using thermography and laser ultrasonic in 3D printing process and 3D printing system having the same
WO2023129629A1 (en) 2021-12-29 2023-07-06 PlasmaTex, LLC Pulsed laser processing of medical devices

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4263865B2 (en) * 2002-01-22 2009-05-13 独立行政法人科学技術振興機構 Fine processing method using ultra-short pulse laser and processed product
CH705707B1 (en) * 2004-06-08 2013-05-15 Lvmh Swiss Mft Sa A method of manufacturing components of synchronous and asynchronous transmission and components of synchronous and asynchronous transmission obtained according to this method.
CN2713533Y (en) * 2004-06-11 2005-07-27 庆扬资讯股份有限公司 Radiating device for micro-computer
US20060157234A1 (en) * 2005-01-14 2006-07-20 Honeywell International Inc. Microchannel heat exchanger fabricated by wire electro-discharge machining
US7642205B2 (en) * 2005-04-08 2010-01-05 Mattson Technology, Inc. Rapid thermal processing using energy transfer layers
US20080299408A1 (en) * 2006-09-29 2008-12-04 University Of Rochester Femtosecond Laser Pulse Surface Structuring Methods and Materials Resulting Therefrom
JP2009255141A (en) * 2008-04-18 2009-11-05 Osaka Univ High-efficiency hydrogen-storing metallic material and method for manufacturing the same
CN101380693A (en) * 2008-10-14 2009-03-11 南开大学 Micro-nano structure preparation method on metallic material surface using femtosecond laser
CN101531335A (en) * 2009-04-08 2009-09-16 西安交通大学 Method for preparing metal surface superhydrophobic microstructure by femto-second laser
JP5385054B2 (en) * 2009-08-26 2014-01-08 スタンレー電気株式会社 Heat dissipation material and manufacturing method thereof
CN102036534A (en) * 2009-09-30 2011-04-27 吴献桐 Device with heat dissipation element and manufacturing method thereof
TWM395570U (en) * 2010-08-19 2011-01-01 guo-ren Zheng Woodworking planer structure

Also Published As

Publication number Publication date
BR112015002627A2 (en) 2017-07-04
DE112012006782T5 (en) 2015-09-10
GB2519253A (en) 2015-04-15
KR20150046015A (en) 2015-04-29
CA2880490A1 (en) 2014-02-13
WO2014025332A1 (en) 2014-02-13
JP2015530925A (en) 2015-10-29
CN104603714A (en) 2015-05-06

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)