GB2515318B - Inverter for an electric motor or generator - Google Patents

Inverter for an electric motor or generator

Info

Publication number
GB2515318B
GB2515318B GB1310940.0A GB201310940A GB2515318B GB 2515318 B GB2515318 B GB 2515318B GB 201310940 A GB201310940 A GB 201310940A GB 2515318 B GB2515318 B GB 2515318B
Authority
GB
United Kingdom
Prior art keywords
inverter
generator
electric motor
motor
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1310940.0A
Other languages
English (en)
Other versions
GB2515318A (en
GB201310940D0 (en
Inventor
Henfryn Owen Geoffrey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Protean Electric Ltd
Original Assignee
Protean Electric Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Protean Electric Ltd filed Critical Protean Electric Ltd
Priority to GB1310940.0A priority Critical patent/GB2515318B/en
Publication of GB201310940D0 publication Critical patent/GB201310940D0/en
Priority to JP2016520774A priority patent/JP6389877B2/ja
Priority to EP14736026.7A priority patent/EP3011670A1/en
Priority to KR1020167000921A priority patent/KR101949250B1/ko
Priority to PCT/IB2014/062021 priority patent/WO2014203112A1/en
Priority to US14/900,145 priority patent/US9729092B2/en
Priority to CN201410276722.XA priority patent/CN104242682B/zh
Publication of GB2515318A publication Critical patent/GB2515318A/en
Application granted granted Critical
Publication of GB2515318B publication Critical patent/GB2515318B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P6/00—Arrangements for controlling synchronous motors or other dynamo-electric motors using electronic commutation dependent on the rotor position; Electronic commutators therefor
    • H02P6/14—Electronic commutators
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P27/00—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage
    • H02P27/04—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage
    • H02P27/06—Arrangements or methods for the control of AC motors characterised by the kind of supply voltage using variable-frequency supply voltage, e.g. inverter or converter supply voltage using DC to AC converters or inverters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
GB1310940.0A 2013-06-19 2013-06-19 Inverter for an electric motor or generator Active GB2515318B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB1310940.0A GB2515318B (en) 2013-06-19 2013-06-19 Inverter for an electric motor or generator
JP2016520774A JP6389877B2 (ja) 2013-06-19 2014-06-06 電気モータまたは発電機用インバータ
EP14736026.7A EP3011670A1 (en) 2013-06-19 2014-06-06 Inverter for an electric motor or generator
KR1020167000921A KR101949250B1 (ko) 2013-06-19 2014-06-06 전동기 또는 발전기용 인버터
PCT/IB2014/062021 WO2014203112A1 (en) 2013-06-19 2014-06-06 Inverter for an electric motor or generator
US14/900,145 US9729092B2 (en) 2013-06-19 2014-06-06 Inverter for an electric motor or generator
CN201410276722.XA CN104242682B (zh) 2013-06-19 2014-06-19 用于电动机或发电机的逆变器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1310940.0A GB2515318B (en) 2013-06-19 2013-06-19 Inverter for an electric motor or generator

Publications (3)

Publication Number Publication Date
GB201310940D0 GB201310940D0 (en) 2013-07-31
GB2515318A GB2515318A (en) 2014-12-24
GB2515318B true GB2515318B (en) 2016-05-18

Family

ID=48914818

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1310940.0A Active GB2515318B (en) 2013-06-19 2013-06-19 Inverter for an electric motor or generator

Country Status (7)

Country Link
US (1) US9729092B2 (enExample)
EP (1) EP3011670A1 (enExample)
JP (1) JP6389877B2 (enExample)
KR (1) KR101949250B1 (enExample)
CN (1) CN104242682B (enExample)
GB (1) GB2515318B (enExample)
WO (1) WO2014203112A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2515318B (en) 2013-06-19 2016-05-18 Protean Electric Ltd Inverter for an electric motor or generator
DE102014205956A1 (de) * 2014-03-31 2015-10-15 Lemförder Electronic GmbH Treiberbaugruppe
DE102014205957A1 (de) * 2014-03-31 2015-10-01 Lemförder Electronic GmbH Treiberbaugruppe
WO2016135336A1 (de) 2015-02-26 2016-09-01 Schwöller Hans Gleichstrommotor/generator mit integrierter leistungsregelung sowie eine steuerschaltung für einen gleichstrommotor
ES2855683T3 (es) * 2015-07-27 2021-09-24 Hitachi Industry Equipment Systems Co Ltd Máquina eléctrica rotativa
GB201601392D0 (en) 2016-01-26 2016-03-09 Rolls Royce Plc Energy conversion apparatus
JP6690280B2 (ja) * 2016-02-12 2020-04-28 株式会社豊田自動織機 半導体モジュール
MX394967B (es) 2016-09-13 2025-03-24 Nucleus Scient Inc Sistema de accionamiento electrico de enlace de multiples varillas
GB2574019A (en) * 2018-05-22 2019-11-27 Protean Electric Ltd A method of assembling an electric motor or generator
US12180126B2 (en) 2019-06-17 2024-12-31 Total Grow Concentrated aqueous suspension of microfibrillated cellulose comprising salts for plant nutrition
US11325872B2 (en) 2019-06-17 2022-05-10 Total Grow LLO Concentrated aqueous suspension of microfibrillated cellulose comprising salts for plant nutrition
CN110300167B (zh) 2019-06-28 2020-07-31 京东数字科技控股有限公司 基于区块链的业务信息处理方法、设备及可读存储介质
US11654780B2 (en) 2020-12-17 2023-05-23 Consolidated Metco, Inc. Vehicle electronic control unit and method
WO2024148415A1 (en) * 2023-01-12 2024-07-18 Enedym Inc. Switched reluctance motor drive system

Citations (7)

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Publication number Priority date Publication date Assignee Title
US5576575A (en) * 1992-11-18 1996-11-19 Fuji Electric Co., Ltd. Semiconductor conversion device
JP2002373971A (ja) * 2001-03-30 2002-12-26 Hitachi Ltd 半導体装置
JP2003023777A (ja) * 2001-07-04 2003-01-24 Toshiba Corp インバータ及びインバータ一体形モータ
US20040113268A1 (en) * 2001-03-30 2004-06-17 Shinji Shirakawa Semiconductor device
US20120007535A1 (en) * 2010-06-21 2012-01-12 Kollmorgen Ab Inverter type motor drive
CN102882384A (zh) * 2012-09-18 2013-01-16 芜湖宏宇汽车电子有限责任公司 新能源汽车电机控制器功率贴片mosfet逆变模组技术
JP2013045847A (ja) * 2011-08-23 2013-03-04 Aisin Aw Co Ltd 半導体モジュール

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3975394B2 (ja) * 2001-12-27 2007-09-12 アイシン・エィ・ダブリュ株式会社 電動駆動装置制御ユニット
DE10237561C1 (de) 2002-08-16 2003-10-16 Semikron Elektronik Gmbh Induktivitätsarme Schaltungsanordnung bzw. Schaltungsaufbau für Leistungshalbleitermodule
JP4436843B2 (ja) * 2007-02-07 2010-03-24 株式会社日立製作所 電力変換装置
US8054660B2 (en) * 2008-05-19 2011-11-08 GM Global Technology Operations LLC Inverter module with thermally separated semiconductor devices
CN102067309B (zh) * 2008-07-10 2013-08-28 三菱电机株式会社 电力用半导体模块
JP2010178494A (ja) * 2009-01-29 2010-08-12 Toshiba Corp スイッチング素子モジュールおよびこれを用いたインバータ装置
JP2010239811A (ja) * 2009-03-31 2010-10-21 Aisin Aw Co Ltd インバータ装置
JP5293473B2 (ja) * 2009-07-16 2013-09-18 富士電機株式会社 半導体パワーモジュール
DE112011100373B4 (de) * 2010-01-29 2022-03-31 Mitsubishi Electric Corporation Inverter-integriertes Antriebsmodul und Herstellungsverfahren hierfür
GB2477229B (en) * 2011-03-25 2012-01-25 Protean Electric Ltd An electric motor arrangement and method of controlling thereof
JP5370440B2 (ja) * 2011-08-31 2013-12-18 株式会社デンソー 電子装置の製造方法
GB2515318B (en) 2013-06-19 2016-05-18 Protean Electric Ltd Inverter for an electric motor or generator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5576575A (en) * 1992-11-18 1996-11-19 Fuji Electric Co., Ltd. Semiconductor conversion device
JP2002373971A (ja) * 2001-03-30 2002-12-26 Hitachi Ltd 半導体装置
US20040113268A1 (en) * 2001-03-30 2004-06-17 Shinji Shirakawa Semiconductor device
JP2003023777A (ja) * 2001-07-04 2003-01-24 Toshiba Corp インバータ及びインバータ一体形モータ
US20120007535A1 (en) * 2010-06-21 2012-01-12 Kollmorgen Ab Inverter type motor drive
JP2013045847A (ja) * 2011-08-23 2013-03-04 Aisin Aw Co Ltd 半導体モジュール
CN102882384A (zh) * 2012-09-18 2013-01-16 芜湖宏宇汽车电子有限责任公司 新能源汽车电机控制器功率贴片mosfet逆变模组技术

Also Published As

Publication number Publication date
US20160149525A1 (en) 2016-05-26
EP3011670A1 (en) 2016-04-27
GB2515318A (en) 2014-12-24
CN104242682B (zh) 2017-12-05
CN104242682A (zh) 2014-12-24
JP6389877B2 (ja) 2018-09-12
US9729092B2 (en) 2017-08-08
JP2016523504A (ja) 2016-08-08
KR101949250B1 (ko) 2019-02-18
GB201310940D0 (en) 2013-07-31
KR20160021825A (ko) 2016-02-26
WO2014203112A1 (en) 2014-12-24

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