GB2413694A - Particle-beam exposure apparatus - Google Patents

Particle-beam exposure apparatus Download PDF

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Publication number
GB2413694A
GB2413694A GB0508660A GB0508660A GB2413694A GB 2413694 A GB2413694 A GB 2413694A GB 0508660 A GB0508660 A GB 0508660A GB 0508660 A GB0508660 A GB 0508660A GB 2413694 A GB2413694 A GB 2413694A
Authority
GB
United Kingdom
Prior art keywords
blanking
apertures
lines
group
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0508660A
Other languages
English (en)
Other versions
GB0508660D0 (en
Inventor
Elmar Platzgummer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IMS Nanofabrication GmbH
Original Assignee
IMS Nanofabrication GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IMS Nanofabrication GmbH filed Critical IMS Nanofabrication GmbH
Publication of GB0508660D0 publication Critical patent/GB0508660D0/en
Publication of GB2413694A publication Critical patent/GB2413694A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/08—Deviation, concentration or focusing of the beam by electric or magnetic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
GB0508660A 2004-04-30 2005-04-28 Particle-beam exposure apparatus Withdrawn GB2413694A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT7552004 2004-04-30

Publications (2)

Publication Number Publication Date
GB0508660D0 GB0508660D0 (en) 2005-06-08
GB2413694A true GB2413694A (en) 2005-11-02

Family

ID=34658437

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0508660A Withdrawn GB2413694A (en) 2004-04-30 2005-04-28 Particle-beam exposure apparatus

Country Status (3)

Country Link
US (1) US7368738B2 (https=)
JP (1) JP4843248B2 (https=)
GB (1) GB2413694A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8026495B2 (en) 2005-10-28 2011-09-27 Carl Zeiss Sms Gmbh Charged particle beam exposure system

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CN101103417B (zh) 2003-09-05 2012-06-27 卡尔蔡司Smt有限责任公司 粒子光学系统和排布结构,以及用于其的粒子光学组件
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
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US7384852B2 (en) * 2006-10-25 2008-06-10 International Business Machines Corporation Sub-lithographic gate length transistor using self-assembling polymers
US7897522B2 (en) * 2006-11-21 2011-03-01 Cadence Design Systems, Inc. Method and system for improving particle beam lithography
US7772575B2 (en) * 2006-11-21 2010-08-10 D2S, Inc. Stencil design and method for cell projection particle beam lithography
US8426832B2 (en) * 2006-11-21 2013-04-23 D2S, Inc. Cell projection charged particle beam lithography
DE102008010123B4 (de) * 2007-02-28 2024-11-28 Ims Nanofabrication Gmbh Vielstrahl-Ablenkarray-Einrichtung für maskenlose Teilchenstrahl-Bearbeitung
NL2001369C2 (nl) * 2007-03-29 2010-06-14 Ims Nanofabrication Ag Werkwijze voor maskerloze deeltjesbundelbelichting.
JP5491704B2 (ja) 2007-05-14 2014-05-14 イーエムエス ナノファブリカツィオン アーゲー 対向電極アレイ板を有するパターン定義装置
US7958736B2 (en) * 2007-05-24 2011-06-14 Bio-Rad Laboratories, Inc. Thermoelectric device and heat sink assembly with reduced edge heat loss
EP2187427B1 (en) * 2008-11-17 2011-10-05 IMS Nanofabrication AG Method for maskless particle-beam exposure
EP2190003B1 (en) * 2008-11-20 2014-10-01 IMS Nanofabrication AG Constant current multi-beam patterning
US8294125B2 (en) * 2009-11-18 2012-10-23 Kla-Tencor Corporation High-sensitivity and high-throughput electron beam inspection column enabled by adjustable beam-limiting aperture
JP2011199279A (ja) * 2010-03-18 2011-10-06 Ims Nanofabrication Ag ターゲット上へのマルチビーム露光のための方法
WO2012055936A1 (en) * 2010-10-26 2012-05-03 Mapper Lithography Ip B.V. Lithography system, modulation device and method of manufacturing a fiber fixation substrate
NL2006868C2 (en) * 2011-05-30 2012-12-03 Mapper Lithography Ip Bv Charged particle multi-beamlet apparatus.
JP6087570B2 (ja) * 2012-10-15 2017-03-01 キヤノン株式会社 描画装置、および物品の製造方法
JP6215586B2 (ja) * 2012-11-02 2017-10-18 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置
JP2014116518A (ja) * 2012-12-11 2014-06-26 Canon Inc 描画装置及び物品の製造方法
EP2757571B1 (en) * 2013-01-17 2017-09-20 IMS Nanofabrication AG High-voltage insulation device for charged-particle optical apparatus
NL2010760C2 (en) * 2013-05-03 2014-11-04 Mapper Lithography Ip Bv Beam grid layout.
JP6097640B2 (ja) * 2013-06-10 2017-03-15 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置
JP2015023286A (ja) 2013-07-17 2015-02-02 アイエムエス ナノファブリケーション アーゲー 複数のブランキングアレイを有するパターン画定装置
EP2830083B1 (en) 2013-07-25 2016-05-04 IMS Nanofabrication AG Method for charged-particle multi-beam exposure
JP6147642B2 (ja) * 2013-10-11 2017-06-14 株式会社ニューフレアテクノロジー マルチ荷電粒子ビームのブランキング装置
JP6230881B2 (ja) * 2013-11-12 2017-11-15 株式会社ニューフレアテクノロジー マルチ荷電粒子ビームのブランキング装置及びマルチ荷電粒子ビーム描画方法
JP6190254B2 (ja) * 2013-12-04 2017-08-30 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
EP2913838B1 (en) 2014-02-28 2018-09-19 IMS Nanofabrication GmbH Compensation of defective beamlets in a charged-particle multi-beam exposure tool
US20150311031A1 (en) * 2014-04-25 2015-10-29 Ims Nanofabrication Ag Multi-Beam Tool for Cutting Patterns
US9443699B2 (en) 2014-04-25 2016-09-13 Ims Nanofabrication Ag Multi-beam tool for cutting patterns
EP2950325B1 (en) 2014-05-30 2018-11-28 IMS Nanofabrication GmbH Compensation of dose inhomogeneity using overlapping exposure spots
WO2015191106A1 (en) * 2014-06-13 2015-12-17 Intel Corporation Ebeam non-universal cutter
US20170069509A1 (en) * 2014-06-13 2017-03-09 Intel Corporation Data compression for ebeam throughput
JP6522662B2 (ja) * 2014-06-13 2019-05-29 インテル・コーポレーション 電子ビームによる一方向の層上金属
US10290528B2 (en) 2014-06-13 2019-05-14 Intel Corporation Ebeam align on the fly
EP3155647A4 (en) * 2014-06-13 2018-01-24 Intel Corporation Ebeam universal cutter
JP6892214B2 (ja) 2014-07-10 2021-06-23 アイエムエス ナノファブリケーション ゲーエムベーハー 畳み込みカーネルを使用する粒子ビーム描画機のカスタマイズ化
KR102459585B1 (ko) * 2014-08-19 2022-10-27 인텔 코포레이션 Ｅ 빔 범용 커터를 이용한 교차 스캔 근접 보정
US9568907B2 (en) 2014-09-05 2017-02-14 Ims Nanofabrication Ag Correction of short-range dislocations in a multi-beam writer
US9761411B2 (en) * 2015-01-20 2017-09-12 Taiwain Semiconductor Manufacturing Company, Ltd. System and method for maskless direct write lithography
US9653263B2 (en) 2015-03-17 2017-05-16 Ims Nanofabrication Ag Multi-beam writing of pattern areas of relaxed critical dimension
EP3096342B1 (en) * 2015-03-18 2017-09-20 IMS Nanofabrication AG Bi-directional double-pass multi-beam writing
US10410831B2 (en) 2015-05-12 2019-09-10 Ims Nanofabrication Gmbh Multi-beam writing using inclined exposure stripes
KR102358009B1 (ko) * 2015-11-10 2022-02-04 삼성전자주식회사 빔 투사 장치 및 빔 투사 장치를 이용하여 빔을 투사하는 방법
JP2017168574A (ja) * 2016-03-15 2017-09-21 株式会社ニューフレアテクノロジー マルチ荷電粒子ビームのブランキング装置、マルチ荷電粒子ビームのブランキング方法、及びマルチ荷電粒子ビーム描画装置
JP6709109B2 (ja) * 2016-05-31 2020-06-10 株式会社ニューフレアテクノロジー マルチ荷電粒子ビームのブランキング装置及びマルチ荷電粒子ビーム照射装置
US10325756B2 (en) 2016-06-13 2019-06-18 Ims Nanofabrication Gmbh Method for compensating pattern placement errors caused by variation of pattern exposure density in a multi-beam writer
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
US10325757B2 (en) 2017-01-27 2019-06-18 Ims Nanofabrication Gmbh Advanced dose-level quantization of multibeam-writers
US10522329B2 (en) 2017-08-25 2019-12-31 Ims Nanofabrication Gmbh Dose-related feature reshaping in an exposure pattern to be exposed in a multi beam writing apparatus
US11569064B2 (en) 2017-09-18 2023-01-31 Ims Nanofabrication Gmbh Method for irradiating a target using restricted placement grids
US10651010B2 (en) 2018-01-09 2020-05-12 Ims Nanofabrication Gmbh Non-linear dose- and blur-dependent edge placement correction
US10840054B2 (en) 2018-01-30 2020-11-17 Ims Nanofabrication Gmbh Charged-particle source and method for cleaning a charged-particle source using back-sputtering
US10483080B1 (en) * 2018-07-17 2019-11-19 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device, multi-beam blanker for a charged particle beam device, and method for operating a charged particle beam device
US10593509B2 (en) 2018-07-17 2020-03-17 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device, multi-beam blanker for a charged particle beam device, and method for operating a charged particle beam device
US10978270B2 (en) * 2018-12-19 2021-04-13 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device, interchangeable multi-aperture arrangement for a charged particle beam device, and method for operating a charged particle beam device
EP3703100A1 (en) * 2019-02-27 2020-09-02 FEI Company Charged particle beam device for inspection of a specimen with a plurality of charged particle beamlets
KR102835338B1 (ko) 2019-05-03 2025-07-17 아이엠에스 나노패브릭케이션 게엠베하 멀티 빔 라이터에서의 노출 슬롯의 지속 시간 조정
US11099482B2 (en) 2019-05-03 2021-08-24 Ims Nanofabrication Gmbh Adapting the duration of exposure slots in multi-beam writers
KR102919104B1 (ko) 2020-02-03 2026-01-29 아이엠에스 나노패브릭케이션 게엠베하 멀티―빔 라이터의 블러 변화 보정
KR102922552B1 (ko) 2020-04-24 2026-02-04 아이엠에스 나노패브릭케이션 게엠베하 대전 입자 소스
EP4095882A1 (en) * 2021-05-25 2022-11-30 IMS Nanofabrication GmbH Pattern data processing for programmable direct-write apparatus
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Citations (1)

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Publication number Priority date Publication date Assignee Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8026495B2 (en) 2005-10-28 2011-09-27 Carl Zeiss Sms Gmbh Charged particle beam exposure system

Also Published As

Publication number Publication date
US20050242303A1 (en) 2005-11-03
JP2005328047A (ja) 2005-11-24
GB0508660D0 (en) 2005-06-08
JP4843248B2 (ja) 2011-12-21
US7368738B2 (en) 2008-05-06

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Legal Events

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732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)