GB2406098B - Polishing kit for magnetic disk - Google Patents

Polishing kit for magnetic disk

Info

Publication number
GB2406098B
GB2406098B GB0418338A GB0418338A GB2406098B GB 2406098 B GB2406098 B GB 2406098B GB 0418338 A GB0418338 A GB 0418338A GB 0418338 A GB0418338 A GB 0418338A GB 2406098 B GB2406098 B GB 2406098B
Authority
GB
United Kingdom
Prior art keywords
magnetic disk
polishing kit
polishing
kit
disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0418338A
Other languages
English (en)
Other versions
GB0418338D0 (en
GB2406098A (en
Inventor
Kiyoteru Osawa
Hiroaki Kitayama
Toshiya Hagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of GB0418338D0 publication Critical patent/GB0418338D0/en
Publication of GB2406098A publication Critical patent/GB2406098A/en
Application granted granted Critical
Publication of GB2406098B publication Critical patent/GB2406098B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
GB0418338A 2003-09-09 2004-08-17 Polishing kit for magnetic disk Expired - Fee Related GB2406098B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003317191A JP4336550B2 (ja) 2003-09-09 2003-09-09 磁気ディスク用研磨液キット

Publications (3)

Publication Number Publication Date
GB0418338D0 GB0418338D0 (en) 2004-09-22
GB2406098A GB2406098A (en) 2005-03-23
GB2406098B true GB2406098B (en) 2007-09-12

Family

ID=33095507

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0418338A Expired - Fee Related GB2406098B (en) 2003-09-09 2004-08-17 Polishing kit for magnetic disk

Country Status (6)

Country Link
US (1) US20050054273A1 (ja)
JP (1) JP4336550B2 (ja)
CN (1) CN1613607B (ja)
GB (1) GB2406098B (ja)
MY (1) MY137560A (ja)
TW (1) TWI359859B (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007060869A1 (ja) * 2005-11-24 2009-05-07 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
US20070122546A1 (en) * 2005-11-25 2007-05-31 Mort Cohen Texturing pads and slurry for magnetic heads
US20090325323A1 (en) * 2006-07-18 2009-12-31 Jsr Corporation Aqueous dispersion for chemical mechanical polishing, production method thereof, and chemical mechanical polishing method
WO2008117573A1 (ja) * 2007-03-27 2008-10-02 Jsr Corporation 化学機械研磨用水系分散体、該水系分散体を調製するためのキット、化学機械研磨方法、および半導体装置の製造方法
JP5403922B2 (ja) 2008-02-26 2014-01-29 富士フイルム株式会社 研磨液および研磨方法
WO2009133793A1 (ja) * 2008-05-01 2009-11-05 Jsr株式会社 化学機械研磨用水系分散体および該化学機械研磨用水系分散体を調製するためのキット、ならびに化学機械研磨方法
US20100096584A1 (en) * 2008-10-22 2010-04-22 Fujimi Corporation Polishing Composition and Polishing Method Using the Same
CN103127874B (zh) * 2013-03-01 2014-12-17 上海卫康光学眼镜有限公司 抛光液分散助剂、含有该分散助剂的抛光液及制备方法和应用
JP6366308B2 (ja) * 2014-03-12 2018-08-01 株式会社ディスコ 加工方法
WO2019004161A1 (ja) * 2017-06-26 2019-01-03 花王株式会社 研磨液組成物用シリカスラリー
JP7096714B2 (ja) * 2017-06-26 2022-07-06 花王株式会社 研磨液組成物用シリカスラリー

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5972124A (en) * 1998-08-31 1999-10-26 Advanced Micro Devices, Inc. Method for cleaning a surface of a dielectric material
JP2000063805A (ja) * 1998-08-18 2000-02-29 Showa Denko Kk 磁気ディスク基板研磨用組成物
US20010005009A1 (en) * 1999-12-28 2001-06-28 Yasuaki Tsuchiya Slurry for chemical mechanical polishing
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
JP2003133266A (ja) * 2001-10-22 2003-05-09 Sumitomo Bakelite Co Ltd 研磨用組成物
KR20030057079A (ko) * 2001-12-28 2003-07-04 제일모직주식회사 금속배선 연마용 슬러리 조성물
JP2003197572A (ja) * 2001-12-26 2003-07-11 Sumitomo Bakelite Co Ltd 研磨用組成物
JP2003218071A (ja) * 2002-01-28 2003-07-31 Sumitomo Bakelite Co Ltd 研磨用組成物
GB2405151A (en) * 2003-08-08 2005-02-23 Kao Corp Polishing method and substrate for magnetic disk
GB2410030A (en) * 2003-12-24 2005-07-20 Fujimi Corp Polishing composition and polishing method
GB2410250A (en) * 2003-12-25 2005-07-27 Fujimi Inc Polishing composition and polishing method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system
JPH09190626A (ja) * 1995-11-10 1997-07-22 Kao Corp 研磨材組成物、磁気記録媒体用基板及びその製造方法並びに磁気記録媒体
CA2263241C (en) * 1996-09-30 2004-11-16 Masato Yoshida Cerium oxide abrasive and method of abrading substrates
US6004193A (en) * 1997-07-17 1999-12-21 Lsi Logic Corporation Dual purpose retaining ring and polishing pad conditioner
US6149696A (en) * 1997-11-06 2000-11-21 Komag, Inc. Colloidal silica slurry for NiP plated disk polishing
CN1966548B (zh) * 1999-08-17 2011-03-23 日立化成工业株式会社 化学机械研磨用研磨剂及基板的研磨法
JP4238951B2 (ja) * 1999-09-28 2009-03-18 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いたメモリーハードディスクの製造方法
JP2001187877A (ja) * 1999-12-28 2001-07-10 Nec Corp 化学的機械的研磨用スラリー
AU2001251318A1 (en) * 2000-04-07 2001-10-23 Cabot Microelectronics Corporation Integrated chemical-mechanical polishing
JP3768402B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP4009986B2 (ja) * 2000-11-29 2007-11-21 株式会社フジミインコーポレーテッド 研磨用組成物、およびそれを用いてメモリーハードディスクを研磨する研磨方法
US7029373B2 (en) * 2001-08-14 2006-04-18 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
US20030077983A1 (en) * 2001-10-12 2003-04-24 International Business Machines Corporation Cleaning polish etch composition and process for a superfinished surface of a substrate
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US6582279B1 (en) * 2002-03-07 2003-06-24 Hitachi Global Storage Technologies Netherlands B.V. Apparatus and method for reclaiming a disk substrate for use in a data storage device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000063805A (ja) * 1998-08-18 2000-02-29 Showa Denko Kk 磁気ディスク基板研磨用組成物
US5972124A (en) * 1998-08-31 1999-10-26 Advanced Micro Devices, Inc. Method for cleaning a surface of a dielectric material
US20010005009A1 (en) * 1999-12-28 2001-06-28 Yasuaki Tsuchiya Slurry for chemical mechanical polishing
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
JP2003133266A (ja) * 2001-10-22 2003-05-09 Sumitomo Bakelite Co Ltd 研磨用組成物
JP2003197572A (ja) * 2001-12-26 2003-07-11 Sumitomo Bakelite Co Ltd 研磨用組成物
KR20030057079A (ko) * 2001-12-28 2003-07-04 제일모직주식회사 금속배선 연마용 슬러리 조성물
JP2003218071A (ja) * 2002-01-28 2003-07-31 Sumitomo Bakelite Co Ltd 研磨用組成物
GB2405151A (en) * 2003-08-08 2005-02-23 Kao Corp Polishing method and substrate for magnetic disk
GB2410030A (en) * 2003-12-24 2005-07-20 Fujimi Corp Polishing composition and polishing method
GB2410250A (en) * 2003-12-25 2005-07-27 Fujimi Inc Polishing composition and polishing method

Also Published As

Publication number Publication date
CN1613607A (zh) 2005-05-11
JP4336550B2 (ja) 2009-09-30
US20050054273A1 (en) 2005-03-10
GB0418338D0 (en) 2004-09-22
MY137560A (en) 2009-02-27
TW200516133A (en) 2005-05-16
GB2406098A (en) 2005-03-23
CN1613607B (zh) 2012-02-01
TWI359859B (en) 2012-03-11
JP2005081504A (ja) 2005-03-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120817