GB2387272B - Method of forming one or more nanapores for aligning molecules for molecular electronics - Google Patents
Method of forming one or more nanapores for aligning molecules for molecular electronicsInfo
- Publication number
- GB2387272B GB2387272B GB0229598A GB0229598A GB2387272B GB 2387272 B GB2387272 B GB 2387272B GB 0229598 A GB0229598 A GB 0229598A GB 0229598 A GB0229598 A GB 0229598A GB 2387272 B GB2387272 B GB 2387272B
- Authority
- GB
- United Kingdom
- Prior art keywords
- nanapores
- forming
- molecular electronics
- aligning molecules
- aligning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00031—Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Geochemistry & Mineralogy (AREA)
- Analytical Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/029,583 US20030116531A1 (en) | 2001-12-20 | 2001-12-20 | Method of forming one or more nanopores for aligning molecules for molecular electronics |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0229598D0 GB0229598D0 (en) | 2003-01-22 |
| GB2387272A GB2387272A (en) | 2003-10-08 |
| GB2387272B true GB2387272B (en) | 2005-06-22 |
Family
ID=21849787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0229598A Expired - Fee Related GB2387272B (en) | 2001-12-20 | 2002-12-19 | Method of forming one or more nanapores for aligning molecules for molecular electronics |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US20030116531A1 (https=) |
| JP (1) | JP2003218346A (https=) |
| GB (1) | GB2387272B (https=) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10161312A1 (de) * | 2001-12-13 | 2003-07-10 | Infineon Technologies Ag | Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung |
| US6919002B2 (en) * | 2002-05-17 | 2005-07-19 | Agilent Technologies, Inc. | Nanopore system using nanotubes and C60 molecules |
| JP4418300B2 (ja) * | 2004-05-25 | 2010-02-17 | 株式会社日立製作所 | 記録媒体作製方法とこれを用いた記録媒体及び情報記録再生装置 |
| US20050287523A1 (en) * | 2004-06-01 | 2005-12-29 | The Regents Of The University Of California | Functionalized platform for individual molecule or cell characterization |
| JP4813775B2 (ja) * | 2004-06-18 | 2011-11-09 | 日本電信電話株式会社 | 多孔構造体及びその製造方法 |
| US7102204B2 (en) * | 2004-06-29 | 2006-09-05 | International Business Machines Corporation | Integrated SOI fingered decoupling capacitor |
| US7553730B2 (en) * | 2006-07-14 | 2009-06-30 | Agilent Technologies, Inc. | Methods of fabrication employing nanoscale mandrels |
| US8192600B2 (en) * | 2007-09-27 | 2012-06-05 | The Board Of Trustees Of The University Of Illinois | Solid state device |
| DE102008039798A1 (de) * | 2008-08-15 | 2010-02-25 | NMI Naturwissenschaftliches und Medizinisches Institut an der Universität Tübingen | Verfahren zur Übertragung von Nanostrukturen in ein Substrat |
| JP2010283381A (ja) * | 2010-08-26 | 2010-12-16 | Nippon Telegr & Teleph Corp <Ntt> | ヘテロ構造の製造方法 |
| US8535512B2 (en) * | 2010-09-30 | 2013-09-17 | California Institute Of Technology | Devices and methods for sequencing nucleic acids |
| US9089819B2 (en) * | 2010-09-30 | 2015-07-28 | California Institute Of Technology | Particulate nanosorting stack |
| US8889562B2 (en) | 2012-07-23 | 2014-11-18 | International Business Machines Corporation | Double patterning method |
| CN104803348A (zh) * | 2015-04-20 | 2015-07-29 | 中国科学院光电技术研究所 | 一种牺牲模板制备高深宽比聚合物纳米柱阵列的方法 |
| WO2017057237A1 (ja) * | 2015-10-02 | 2017-04-06 | セントラル硝子株式会社 | 熱電変換材料及びその製造方法 |
| CN109072451B (zh) * | 2016-03-18 | 2021-08-03 | 麻省理工学院 | 纳米多孔半导体材料及其制造 |
| CN106315505B (zh) * | 2016-08-24 | 2018-11-06 | 深圳先进技术研究院 | 一种增强聚酰亚胺基底和导电金属层之间的粘附力的方法 |
| US10370247B2 (en) | 2016-08-29 | 2019-08-06 | International Business Machines Corporation | Contacting molecular components |
| US10739299B2 (en) * | 2017-03-14 | 2020-08-11 | Roche Sequencing Solutions, Inc. | Nanopore well structures and methods |
| CN111937120B (zh) | 2018-04-05 | 2025-09-05 | 麻省理工学院 | 多孔和纳米多孔半导体材料及其制造 |
| CN110364594B (zh) * | 2019-07-19 | 2020-05-29 | 中原工学院 | 一种氮化镓或氮化铝纳米孔的制备方法 |
| US11674947B2 (en) | 2020-06-13 | 2023-06-13 | International Business Machines Corporation | Nanopore structures |
| US11715640B2 (en) | 2020-09-30 | 2023-08-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Patterning material including silicon-containing layer and method for semiconductor device fabrication |
| US20220102200A1 (en) * | 2020-09-30 | 2022-03-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Patterning material including carbon-containing layer and method for semiconductor device fabrication |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0731490A2 (en) * | 1995-03-02 | 1996-09-11 | Ebara Corporation | Ultra-fine microfabrication method using an energy beam |
| US5569355A (en) * | 1995-01-11 | 1996-10-29 | Center For Advanced Fiberoptic Applications | Method for fabrication of microchannel electron multipliers |
| US6515325B1 (en) * | 2002-03-06 | 2003-02-04 | Micron Technology, Inc. | Nanotube semiconductor devices and methods for making the same |
| JP2003053699A (ja) * | 2001-08-10 | 2003-02-26 | Nikon Corp | ピンホール製造方法及び測定装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4407695A (en) * | 1981-12-31 | 1983-10-04 | Exxon Research And Engineering Co. | Natural lithographic fabrication of microstructures over large areas |
| US5393373A (en) * | 1991-07-11 | 1995-02-28 | Goldstar Electron Co., Ltd. | Methods of patterning and manufacturing semiconductor devices |
| US6379572B1 (en) * | 2000-06-02 | 2002-04-30 | Sony Corporation | Flat panel display with spaced apart gate emitter openings |
| US6274396B1 (en) * | 2001-01-29 | 2001-08-14 | Advanced Micro Devices, Inc. | Method of manufacturing calibration wafers for determining in-line defect scan tool sensitivity |
-
2001
- 2001-12-20 US US10/029,583 patent/US20030116531A1/en not_active Abandoned
-
2002
- 2002-12-16 JP JP2002363419A patent/JP2003218346A/ja not_active Withdrawn
- 2002-12-19 GB GB0229598A patent/GB2387272B/en not_active Expired - Fee Related
-
2007
- 2007-10-03 US US11/906,819 patent/US7922927B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5569355A (en) * | 1995-01-11 | 1996-10-29 | Center For Advanced Fiberoptic Applications | Method for fabrication of microchannel electron multipliers |
| EP0731490A2 (en) * | 1995-03-02 | 1996-09-11 | Ebara Corporation | Ultra-fine microfabrication method using an energy beam |
| JP2003053699A (ja) * | 2001-08-10 | 2003-02-26 | Nikon Corp | ピンホール製造方法及び測定装置 |
| US6515325B1 (en) * | 2002-03-06 | 2003-02-04 | Micron Technology, Inc. | Nanotube semiconductor devices and methods for making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0229598D0 (en) | 2003-01-22 |
| JP2003218346A (ja) | 2003-07-31 |
| GB2387272A (en) | 2003-10-08 |
| US20080203055A1 (en) | 2008-08-28 |
| US7922927B2 (en) | 2011-04-12 |
| US20030116531A1 (en) | 2003-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20071219 |