GB2377085A - Electronic apparatus housing with heating/cooling system - Google Patents

Electronic apparatus housing with heating/cooling system Download PDF

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Publication number
GB2377085A
GB2377085A GB0115623A GB0115623A GB2377085A GB 2377085 A GB2377085 A GB 2377085A GB 0115623 A GB0115623 A GB 0115623A GB 0115623 A GB0115623 A GB 0115623A GB 2377085 A GB2377085 A GB 2377085A
Authority
GB
United Kingdom
Prior art keywords
electronic apparatus
apparatus housing
teflon
dissipation plate
peltier cooler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0115623A
Other versions
GB0115623D0 (en
Inventor
Dah Wei Chu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB0115623A priority Critical patent/GB2377085A/en
Publication of GB0115623D0 publication Critical patent/GB0115623D0/en
Publication of GB2377085A publication Critical patent/GB2377085A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The housing such as a computer casing comprises an enclosed body with side surfaces (11) and mounted thereon on either the inside or outside in order, a first heat conducting and electrically insulating layer (21), a peltier cooler (31), a second heat conducting and electrically insulating layer (41) and a heat dissipation plate (51). Control of current to the peltier cooler allows heat to be supplied to or drawn from the internal space of the housing to provide temperature control of the internal space. The enclosed body defines an enclosed space without air vents and protects the inside of the housing against damage from outside moisture and dust.

Description

<Desc/Clms Page number 1>
ELECTRONIC APPARATUS HOUSING BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus housing and, more particularly, to a housing for an electronic apparatus such as computer mainframe, industrial computer mainframe, floppy diskdrive, hard diskdrive, CD player, modem, switching hub, video tape recorder and player, video system main unit, PDA, cellular telephone, etc.
2. Description of Related Art An electronic apparatus, more particularly, a precision industrial computer must be pre-warmed before use during a cold day, so that the internal circuit can function normally under the set working temperature.
During operation of the electronic apparatus, the internal electronic elements continuously produce heat. The housing of a conventional electronic apparatus has air vents 91 through which heat energy is forced out of the housing by a mini fan 92 (see FIG. 1). Because the housing has air vents 91 for dissipation of heat energy, the design of the mold for the housing is complicated. Further, air vents 91 allow heat energy to be quickly carried out of the housing, they are not in favor of pre-warming operation of the electronic apparatus. Further, outside moisture and dust may pass to the inside of the electronic apparatus through the air vents 91 of the housing, and the operation of the mini fan 92 produces much noise.
Therefore, it is desirable to provide a simple structure of electronic apparatus housing that eliminates the aforesaid drawbacks.
<Desc/Clms Page number 2>
SUMMARY OF THE INVENTION The main object of the present invention is to provide an electronic apparatus housing, which is an enclosed structure that is easy to manufacture and in favor of the internal temperature control of the electronic apparatus. Another object of the present invention is to provide an electronic apparatus housing, which isolates the internal electronic elements from external moisture and dust To achieve these and other objects of the present invention, the electronic apparatus housing comprises an enclosed body having a surface mounted in proper order in direction from the side proximity to,
(ATf) the surface to the side remote from the surface with a first Teflon resin C-r) layer, a peltier cooler, a second Tef1oresin layer, and a heat dissipation
plate, wherein the enclosed body is comprised of two shells fastened
(rye) together, defining an enclosed space ; the first Teflon resin layer is
disposed between the peltier cooler and the enclosed space to insulate
(-R-rm) electricity and to transmit heat energy ; the second Teflon/resin layer is
disposed between the peltier cooler and the heat dissipation plate to insulate electricity and to transmit heat energy. When applying an electric voltage to the peltier cooler, heat energy is transmitted to the inside of the enclosed space of the enclosed body of the electronic
( , iVI) apparatus housing through the Teflon, resin layers. Therefore, the internal
temperature of the electronic apparatus housing can easily be controlled.
Because the electronic apparatus housing is an enclosed body without air vent, it isolates the internal electronic elements from external moisture
(X/K)) and dust. The first Teflon/resin layer, the peltier cooler, the second Teflon/
<Desc/Clms Page number 3>
resin layer, and the heat dissipation plate can be installed in the inner surface or outer surface of the enclosed body of the electronic apparatus
("M) housing. The Teflonfesm layers are adhered to two opposite sides of the
peltier cooler to insulate electricity. Multiple peltier coolers may be
arranged in a stack when respectively insulated with respective Teflon (pom)
resin layers. The heat dissipation plate can be made having multiple
n) radiation fins. The first and second Teflon/, resin layers can be of thin-film
structure or plate-like structure, or have any of a variety of shapes.
CT) T) Preferably, the Teflon/resin layers are thin-film Teflon/resin layers
respectively adhered to two opposite sides of the peltier cooler.
f) Alternatively, the Teflon/resin layers can be fastened with the peltier
cooler or the heat dissipation plate to the surface of the enclosed body of the electronic apparatus housing by screw means, clamping means, or any of a variety of joints.
Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 illustrates the arrangement of an electronic apparatus housing according to the prior art.
FIG. 2 illustrates the arrangement of an electronic apparatus housing according to a first embodiment of the present invention.
FIG. 3 is a sectional view of a part of the first embodiment of the present invention.
FIG. 4 is a sectional view of a part of an electronic apparatus
<Desc/Clms Page number 4>
housing according to a second embodiment of the present invention.
FIG. 5 illustrates the arrangement of an electronic apparatus housing according to a third embodiment of the present invention.
FIG. 6 is a sectional view of a part of the third embodiment of the present invention.
FIG. 7 illustrates the arrangement of an electronic apparatus housing according to a fourth embodiment of the present invention.
FIG. 8 is a sectional view of a part of the fourth embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 2 illustrates a first embodiment of the present invention designed for a precision industrial computer. The electronic apparatus housing 1 is an enclosed body comprised of a top shell 12 and a bottom shell 11. The top shell 12 and the bottom shell 11 are fixedly fastened together, forming an enclosed structure defining an enclosed space 10 adapted to receive electronic members such as floppy diskdrive 91, hard diskdrive 92, network interface card 93, memory card 94, power adapter 95, and etc.
In FIG. 2, there are arranged in proper order from the left inner
surface 111 of the bottom shell 11 toward the enclosed space 10 a first
(g7-e-) Teflonresin layer 21, a peltier cooler 31, a second Teflon-resin layer 41,
and a heat dissipation plate 51.
T < ) Referring to FIG. 3, the first Teflorresin layer 21 and the second (P,-rm) Teflon/rcsin layer 41 are thin-film members respectively adhered to two
opposite sides of the peltier cooler 31, and then the heat dissipation plate
<Desc/Clms Page number 5>
T < ) 51 is attached to the second Tefloniresin layer 41 against the peltier T) cooler 31 and the first Teflonjesin layer 21 and the left inner surface 111 (p,-rm) of the bottom shell 11 and fixedly fastened with the first Teflontresin " layer 21 and the peltier cooler 31 and the second Teflonjresm layer 41 to
the left inner surface 111 of the bottom shell 11 by screw nails (not shown).
The peltier cooler 31 is comprised of multiple N type and P type refrigerating semiconductors alternatively welded together with multiple metal conductor strips. The invention eliminates the adhesion of ceramic strips to both sides of the peltier cooler as used in the prior art designs.
As illustrated in FIG. 3, the first Teflons, resin layer 21 is
sandwiched in between the peltier cooler 31 and the left inner surface 111
tkl-m) of the bottom shell 11, the second Teilomresin layer 41 is sandwiched in
between the peltier cooler 31 and the heat dissipation plate 51. Because
IRTM) Teflonis composed of PTFE (poly tetra fluoro ethylene), it is electrically (P, Tvn) insulative. Therefore, the first Teflonlresin layer 21 and the second Teflon (ria)
resin layer 41 isolate the electric current at the two sides of the peltier (P"-,) cooler 31. Further, because the Teflontresin layers 21 and 41 are heat
resisting (against 385 C), cold resisting (against-270 C), and heat conductive, they dissipate heat from the peltier cooler 31 efficiently.
When DC current is connected in the direction shown in FIG. 3, a hot side is formed at the top side of the peltier cooler 31 for enabling heat
T) energy to be rapidly transmitted through the second Teflonjresin layer 41
and then the radiation fins 511 of the heat dissipation plate 51 to the inside of the enclosed space 10 to pre-warm the enclosed space 10,
<Desc/Clms Page number 6>
enabling the electronic members of the electronic device to reach the set working temperature for normal functioning immediately after the
electronic apparatus was turned on. The bottom side of the peltier cooler
T-') 31, i. e., the first Teflonjresin layer 21 and the left inner surface 111 of the
metal bottom shell 11 form a cold side that absorbs heat energy.
When the internal temperature of the enclosed space 10 surpasses a predetermined level after the electronic apparatus has been running for a certain length of time, the controller (not shown) is controlled to reverse the direction of direct current, causing the top side of the peltier cooler 31 shown in FIG. 3 to be changed from the hot side to the cold side to cool down the temperature of the enclosed space 10.
Although the electronic apparatus housing 1 has neither air vent nor mini fan, the internal temperature of the electronic apparatus housing 1 can still be easily controlled by means of controlling the forward and reverse direction of the electric current. Further, thermo-sensor may be installed in the enclosed space 10 to detect the internal temperature of the enclosed space 10, so that the internal temperature of the enclosed space 10 can be automatically controlled subject to the detection data obtained from the thermo-sensor.
Further, because the electronic apparatus housing 1 is an enclosed structure without air vent, it well protects the internal electronic members against external moisture and dust.
(PITM) In the same manner, a first Teflon/resin layer 20, a peltier cooler - 30, a second Teflon/resin layer 40 and a heat dissipation plate 50 are A
arranged in proper order on the housing of the power adapter 95 for
<Desc/Clms Page number 7>
dissipation of heat from the internal space of the power adapter 95. In general, the invention can be used in a computer housing as well as the housing of any of a variety of electronic apparatus to dissipate heat.
FIG. 4 is a sectional view of a part of a second embodiment of the present invention. This embodiment is similar to the aforesaid first
embodiment of the present invention, with the exception of the added
(rye) second peltier cooler 31'and another second Teflonlresin layer 41' lyre) arranged between the second Teflon resin layer 41 and the heat
dissipation plate 51, i. e., the second embodiment is a dual-peltier cooler cooling structure. Alternatively, a cooling structure with three, four or more peltier coolers may be used.
FIGS. 5 and 6 show a third embodiment of the present invention.
T) According to this embodiment, the first Teflon/resin layer 22, the peltier (A-rm) cooler 32, the second Teflon/resin layer 42, and the heat dissipation plate ,, xesin 52 are arranged on the outer surface 112 of the bottom shell 11 of the electronic apparatus housing 1. The heat dissipation plate 52 is a flat metallic plate (of course, the heat dissipation plate 52 can be made having radiation fins). When direct current is connected in the direction shown
in FIG. 6, the top side of the peltier cooler 32 forms a hot side, and heat
< 7) energy is rapidly transmitted through the second Teflon/resin layer 42 to
the outside of the metal bottom shell 11 of the electronic apparatus housing 1. As illustrated, a second heat dissipation plate 61 is fixedly mounted on the inner surface of the metal bottom shell 11 of the electronic apparatus housing 1, enabling heat energy to be transmitted through the radiation fins 611 of the heat dissipation plate 61 to the inside
<Desc/Clms Page number 8>
of the enclosed space 10 to pre-warn the enclosed space. When reversing the direction of the direct current, heat energy is quickly carried away from the enclosed space 10 to the outside of the electronic apparatus housing 1.
FIGS. 7 and 8 show a fourth embodiment of the present invention.
I
( < LT) Similar to the aforesaid first embodiment, the first Tefloniresin layer 23, (R-r.. t) the peltier cooler 33, the second Teflon, resin layer 43, and the heat
dissipation plate 53 are fixedly fastened to the inner surface 111 of the metal bottom shell 11 in proper order. However, the heat dissipation plate 53 is a flat metal plate (if desired, the heat dissipation plate 53 can be made having radiation fins), and a second heat dissipation plate 62 is fastened to the outer surface 112 of the metal bottom shell 11 of the electronic apparatus housing 1 opposite to the heat dissipation plate 53.
The second heat dissipation plate 62 is made having radiation fins 621. When connecting the direct current in the direction shown in FIG. 8, the
bottom side of the peltier cooler 33 forms a hot side, and heat energy is
rJ transmitted through the first Teflon/resin layer 23, the metal bottom shell
11 of the electronic apparatus housing 1 and the second heat dissipation plate 62, and then dissipated into the air outside the electronic apparatus housing 1 through the radiation fins 621 of the second heat dissipation plate 62.
Although the present invention has been explained in relation to its preferred embodiments, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.

Claims (14)

  1. CLAIMS 1. An electronic apparatus housing comprising an enclosed body having a surface mounted in proper order in direction from the side proximity to said surface to the side remote from said surface with a first
    (f rT-jM) Teflon, (resin layer, a peltier cooler, a second Teflon1resin layer, and a
    heat dissipation plate, wherein said enclosed body is comprised of two
    shells fastened together, defining an enclosed space ; said first Teflon 6)
    resin layer is disposed between said peltier cooler and said enclosed space
    to insulate electricity and to transmit heat energy ; said second Teflon
    resign layer is disposed between said peltier cooler and said heat dissipation plate to insulate electricity and to transmit heat energy.
  2. 2. An electronic. apparatus housing as claimed in claim 1, wherein
    T) -r\) said first Teflon/resin layer, said peltier cooler, said second Teflontresin
    layer and said heat dissipation plate are mounted on an inner surface of said enclosed body.
  3. 3. An electronic apparatus housing as claimed in claim 1, wherein
    (kTm) t a-rw,,) said first Teflon/resin layer, said peltier cooler, said second Teflon, llayer
    and said heat dissipation plate are mounted on an outer surface of said enclosed body.
  4. 4. An electronic apparatus housing as claimed in any of claims 1 to 3,
    t Fe) wherein said first Teflonlresin layer is a thin-film Teflon/resin layer.
  5. 5. An electronic apparatus housing as claimed in any of claims 1 to 4,
    (R. (rye) wherein said second Teflonlresin layer is a thin-film Teflon/resm layer.
  6. 6. An electronic apparatus housing as claimed in any preceding claim, wherein said heat dissipation plate comprises a plurality of radiation fins.
    <Desc/Clms Page number 10>
  7. 7. An electronic apparatus housing as claimed in any preceding claim,
    ( < 'T)) ( < CT wherein said first Teflon/resin layer and said second Teflonlreslgn layer
    are respectively adhered to two opposite sides of said peltier cooler.
  8. 8. An electronic apparatus housing as claimed in any preceding claim further comprising a second heat dissipation plate mounted on a second surface of said enclosed body opposite said peltier cooler.
  9. 9. An electronic apparatus housing as claimed in claim 8, wherein said second hear dissipation plate comprises a plurality of radiation fins.
  10. 10. An electronic apparatus housing as claimed in any preceding claim
    further comprising a second peltier cooler arranged between said second
    (R-r, m) (PT-., t) Teflon/resin layer and said hear dissipation plate, and a third Teflon/resin layer arranged between said second peltier cooler and said heat dissipation plate.
  11. 11. An electronic apparatus housing substantially as described herein with reference to Figures 2 and 3 of the accompanying drawings.
  12. 12. An electronic apparatus housing substantially as described herein with reference to Figure 4 of the accompanying drawings.
  13. 13. An electronic apparatus housing substantially as described herein with reference to Figures 5 and 6 of the accompanying drawings.
  14. 14. An electronic apparatus housing substantially as described herein with reference to Figures 7 and 8 of the accompanying drawings.
GB0115623A 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system Withdrawn GB2377085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0115623A GB2377085A (en) 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0115623A GB2377085A (en) 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system

Publications (2)

Publication Number Publication Date
GB0115623D0 GB0115623D0 (en) 2001-08-15
GB2377085A true GB2377085A (en) 2002-12-31

Family

ID=9917391

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0115623A Withdrawn GB2377085A (en) 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system

Country Status (1)

Country Link
GB (1) GB2377085A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2333855A1 (en) * 2009-12-11 2011-06-15 Alcatel Lucent Energy recuperation for outside plant deployments
WO2012049359A1 (en) * 2010-10-14 2012-04-19 Compusteel Oy Peltier-type cooler

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992005680A1 (en) * 1990-09-24 1992-04-02 Joel Fallik Expandable refrigerated enclosure for computer boards
US5655375A (en) * 1996-06-24 1997-08-12 Y.B.S. Enterprises, Inc. Antenna mast-top mountable thermo-electrically cooled amplifier enclosure system
GB2329012A (en) * 1997-09-09 1999-03-10 Samsung Electronics Co Ltd A heating and cooling system
US5987890A (en) * 1998-06-19 1999-11-23 International Business Machines Company Electronic component cooling using a heat transfer buffering capability
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992005680A1 (en) * 1990-09-24 1992-04-02 Joel Fallik Expandable refrigerated enclosure for computer boards
US5655375A (en) * 1996-06-24 1997-08-12 Y.B.S. Enterprises, Inc. Antenna mast-top mountable thermo-electrically cooled amplifier enclosure system
GB2329012A (en) * 1997-09-09 1999-03-10 Samsung Electronics Co Ltd A heating and cooling system
US5987890A (en) * 1998-06-19 1999-11-23 International Business Machines Company Electronic component cooling using a heat transfer buffering capability
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2333855A1 (en) * 2009-12-11 2011-06-15 Alcatel Lucent Energy recuperation for outside plant deployments
WO2012049359A1 (en) * 2010-10-14 2012-04-19 Compusteel Oy Peltier-type cooler

Also Published As

Publication number Publication date
GB0115623D0 (en) 2001-08-15

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