GB0115623D0 - Electronic apparatus housing - Google Patents

Electronic apparatus housing

Info

Publication number
GB0115623D0
GB0115623D0 GBGB0115623.1A GB0115623A GB0115623D0 GB 0115623 D0 GB0115623 D0 GB 0115623D0 GB 0115623 A GB0115623 A GB 0115623A GB 0115623 D0 GB0115623 D0 GB 0115623D0
Authority
GB
United Kingdom
Prior art keywords
electronic apparatus
apparatus housing
housing
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0115623.1A
Other versions
GB2377085A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHU DAH W
Original Assignee
CHU DAH W
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHU DAH W filed Critical CHU DAH W
Priority to GB0115623A priority Critical patent/GB2377085A/en
Publication of GB0115623D0 publication Critical patent/GB0115623D0/en
Publication of GB2377085A publication Critical patent/GB2377085A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0115623A 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system Withdrawn GB2377085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0115623A GB2377085A (en) 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0115623A GB2377085A (en) 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system

Publications (2)

Publication Number Publication Date
GB0115623D0 true GB0115623D0 (en) 2001-08-15
GB2377085A GB2377085A (en) 2002-12-31

Family

ID=9917391

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0115623A Withdrawn GB2377085A (en) 2001-06-27 2001-06-27 Electronic apparatus housing with heating/cooling system

Country Status (1)

Country Link
GB (1) GB2377085A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2333855A1 (en) * 2009-12-11 2011-06-15 Alcatel Lucent Energy recuperation for outside plant deployments
FI127872B (en) * 2010-10-14 2019-04-30 Compusteel Oy Peltier-type cooler

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067040A (en) * 1990-09-24 1991-11-19 Joel Fallik Expandable refrigerated enclosure for computer boards
US5655375A (en) * 1996-06-24 1997-08-12 Y.B.S. Enterprises, Inc. Antenna mast-top mountable thermo-electrically cooled amplifier enclosure system
US5934079A (en) * 1997-09-09 1999-08-10 Samsung Electronics Co., Ltd. Base station heat management system
US5987890A (en) * 1998-06-19 1999-11-23 International Business Machines Company Electronic component cooling using a heat transfer buffering capability
US6094919A (en) * 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits

Also Published As

Publication number Publication date
GB2377085A (en) 2002-12-31

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)