GB2368722B - A process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor - Google Patents

A process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor

Info

Publication number
GB2368722B
GB2368722B GB0114308A GB0114308A GB2368722B GB 2368722 B GB2368722 B GB 2368722B GB 0114308 A GB0114308 A GB 0114308A GB 0114308 A GB0114308 A GB 0114308A GB 2368722 B GB2368722 B GB 2368722B
Authority
GB
United Kingdom
Prior art keywords
dual
capacitor
manufacturing
integrated circuit
circuit including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0114308A
Other languages
English (en)
Other versions
GB2368722A (en
GB0114308D0 (en
Inventor
Sailesh Chittipeddi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Original Assignee
Agere Systems Guardian Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems Guardian Corp filed Critical Agere Systems Guardian Corp
Publication of GB0114308D0 publication Critical patent/GB0114308D0/en
Publication of GB2368722A publication Critical patent/GB2368722A/en
Application granted granted Critical
Publication of GB2368722B publication Critical patent/GB2368722B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB0114308A 2000-06-16 2001-06-12 A process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor Expired - Fee Related GB2368722B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/596,382 US6762087B1 (en) 2000-06-16 2000-06-16 Process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor

Publications (3)

Publication Number Publication Date
GB0114308D0 GB0114308D0 (en) 2001-08-01
GB2368722A GB2368722A (en) 2002-05-08
GB2368722B true GB2368722B (en) 2004-12-01

Family

ID=24387077

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0114308A Expired - Fee Related GB2368722B (en) 2000-06-16 2001-06-12 A process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor

Country Status (5)

Country Link
US (1) US6762087B1 (enExample)
JP (1) JP2002043433A (enExample)
KR (1) KR100727794B1 (enExample)
GB (1) GB2368722B (enExample)
TW (1) TWI256683B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120223413A1 (en) 2011-03-04 2012-09-06 Nick Lindert Semiconductor structure having a capacitor and metal wiring integrated in a same dielectric layer
JP2013026599A (ja) * 2011-07-26 2013-02-04 Elpida Memory Inc 半導体装置の製造方法
WO2016182782A1 (en) 2015-05-08 2016-11-17 Cirrus Logic International Semiconductor Ltd. High denstiy capacitors formed from thin vertical semiconductor structures such as finfets

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025226A (en) * 1998-01-15 2000-02-15 International Business Machines Corporation Method of forming a capacitor and a capacitor formed using the method
EP1020905A1 (en) * 1999-01-12 2000-07-19 Lucent Technologies Inc. Integrated circuit device having dual damascene interconnect structure and metal electrode capacitor and associated method for making
EP1022783A2 (en) * 1999-01-12 2000-07-26 Lucent Technologies Inc. Integrated circuit device having dual damascene capacitor and associated method for making
GB2356974A (en) * 1999-08-30 2001-06-06 Lucent Technologies Inc Process for manufacturing a dual damascene structure for an integrated circuit using an etch stop layer
GB2356973A (en) * 1999-08-30 2001-06-06 Lucent Technologies Inc Process for manufacturing a dual damascene structure for an integrated circuit using an etch stop layer
GB2365217A (en) * 2000-02-16 2002-02-13 Agere Syst Guardian Corp Interdigitated capacitor structure for use in an integrated circuit

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633781A (en) 1995-12-22 1997-05-27 International Business Machines Corporation Isolated sidewall capacitor having a compound plate electrode
US6251740B1 (en) * 1998-12-23 2001-06-26 Lsi Logic Corporation Method of forming and electrically connecting a vertical interdigitated metal-insulator-metal capacitor extending between interconnect layers in an integrated circuit
US6156640A (en) 1998-07-14 2000-12-05 United Microelectronics Corp. Damascene process with anti-reflection coating
TW374948B (en) 1998-07-28 1999-11-21 United Microelectronics Corp Method of prevention of poisoning trenches in dual damascene process structures and dielectric layer windows
US6174803B1 (en) 1998-09-16 2001-01-16 Vsli Technology Integrated circuit device interconnection techniques
US6037216A (en) 1998-11-02 2000-03-14 Vanguard International Semiconductor Corporation Method for simultaneously fabricating capacitor structures, for giga-bit DRAM cells, and peripheral interconnect structures, using a dual damascene process
TW389993B (en) 1998-11-18 2000-05-11 United Microelectronics Corp Method for producing thin film resistance of dual damascene interconnect
JP2000159698A (ja) * 1998-11-30 2000-06-13 Matsushita Electric Ind Co Ltd 芳香族メチリデン化合物、それを製造するための芳香族アルデヒド化合物、及びそれらの製造方法
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US6281134B1 (en) 1999-10-22 2001-08-28 United Microelectronics Corp. Method for combining logic circuit and capacitor
US6228711B1 (en) * 1999-11-30 2001-05-08 United Microelectronics Corp. Method of fabricating dynamic random access memory
US6664185B1 (en) * 2002-04-25 2003-12-16 Advanced Micro Devices, Inc. Self-aligned barrier formed with an alloy having at least two dopant elements for minimized resistance of interconnect

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025226A (en) * 1998-01-15 2000-02-15 International Business Machines Corporation Method of forming a capacitor and a capacitor formed using the method
EP1020905A1 (en) * 1999-01-12 2000-07-19 Lucent Technologies Inc. Integrated circuit device having dual damascene interconnect structure and metal electrode capacitor and associated method for making
EP1022783A2 (en) * 1999-01-12 2000-07-26 Lucent Technologies Inc. Integrated circuit device having dual damascene capacitor and associated method for making
GB2356974A (en) * 1999-08-30 2001-06-06 Lucent Technologies Inc Process for manufacturing a dual damascene structure for an integrated circuit using an etch stop layer
GB2356973A (en) * 1999-08-30 2001-06-06 Lucent Technologies Inc Process for manufacturing a dual damascene structure for an integrated circuit using an etch stop layer
GB2365217A (en) * 2000-02-16 2002-02-13 Agere Syst Guardian Corp Interdigitated capacitor structure for use in an integrated circuit

Also Published As

Publication number Publication date
KR20010113520A (ko) 2001-12-28
JP2002043433A (ja) 2002-02-08
TWI256683B (en) 2006-06-11
US6762087B1 (en) 2004-07-13
GB2368722A (en) 2002-05-08
KR100727794B1 (ko) 2007-06-14
GB0114308D0 (en) 2001-08-01

Similar Documents

Publication Publication Date Title
SG107602A1 (en) Multilayer circuit board and method for manufacturing multilayer circuit board
SG101995A1 (en) An electronic device and a method of manufacturing the same
GB2382462B (en) A circuit including a semiconductor component and an operating method for the semiconductor component
IL155790A0 (en) A supercapacitor and a method of manufacturing such a supercapacitor
AU2001267853A1 (en) Method of manufacturing integrated circuit
SG77721A1 (en) A semiconductor integrated circuit device an a method of manufacturing the same
SG98398A1 (en) Integrated circuit inductor
GB0029446D0 (en) Photosensitive glass pasge and method for manufacturing multilayered interconnected circuit board using the same
SG109471A1 (en) Wiring boards and processes for manufacturing wiring boards
GB0019489D0 (en) A process for manufacturing an integrated circuit including a dual-damascene structure and an integrated circuit
GB2356973B (en) A process for manufacturing an integrated circuit including a dual-damascene structure and an integrated circuit
SG88765A1 (en) Method for forming an integrated circuit
GB0117316D0 (en) A method of manufacturing an integrated circuit package
GB0117310D0 (en) A method of manufacturing an integrated circuit package and an integrated circuit package
AU2001270467A1 (en) Electronic chip component comprising an integrated circuit and a method for producing the same
GB2345793B (en) A capacitor for an integrated circuit
SG89410A1 (en) Manufacturing method of semiconductor integrated circuit device
GB0115081D0 (en) A method of testing an integrated circuit
GB2365630B (en) Multilayer circuit component and method for manufacturing the same
SG104322A1 (en) Cylindrical semiconductor capacitor and manufacturing method therefor
GB2368722B (en) A process for manufacturing an integrated circuit including a dual-damascene structure and a capacitor
GB0115078D0 (en) An integrated circuit and a method of manufacturing an integrtaed circuit
AU2954700A (en) Integrated circuit comprising an inductor which prevents latch-up and a method for its manufacture
GB2361814B (en) A method of manufacturing a nonreciprocal circuit device
GB2352874B (en) An integrated circuit and a process for manufacturing the integrated circuit

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160612