GB2352874B - An integrated circuit and a process for manufacturing the integrated circuit - Google Patents

An integrated circuit and a process for manufacturing the integrated circuit

Info

Publication number
GB2352874B
GB2352874B GB0014544A GB0014544A GB2352874B GB 2352874 B GB2352874 B GB 2352874B GB 0014544 A GB0014544 A GB 0014544A GB 0014544 A GB0014544 A GB 0014544A GB 2352874 B GB2352874 B GB 2352874B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
manufacturing
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0014544A
Other versions
GB2352874A (en
GB0014544D0 (en
Inventor
Mahjoub Ali Abdelgadir
Jr Gerald W Gibson
Steven Gregory Gunter
Alvaro Maury
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of GB0014544D0 publication Critical patent/GB0014544D0/en
Publication of GB2352874A publication Critical patent/GB2352874A/en
Application granted granted Critical
Publication of GB2352874B publication Critical patent/GB2352874B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
GB0014544A 1999-07-01 2000-06-14 An integrated circuit and a process for manufacturing the integrated circuit Expired - Fee Related GB2352874B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14197499P 1999-07-01 1999-07-01
US47172999A 1999-12-23 1999-12-23

Publications (3)

Publication Number Publication Date
GB0014544D0 GB0014544D0 (en) 2000-08-09
GB2352874A GB2352874A (en) 2001-02-07
GB2352874B true GB2352874B (en) 2002-10-09

Family

ID=26839629

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0014544A Expired - Fee Related GB2352874B (en) 1999-07-01 2000-06-14 An integrated circuit and a process for manufacturing the integrated circuit

Country Status (1)

Country Link
GB (1) GB2352874B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6987068B2 (en) 2003-06-14 2006-01-17 Intel Corporation Methods to planarize semiconductor device and passivation layer
US7560739B2 (en) 2004-06-29 2009-07-14 Intel Corporation Micro or below scale multi-layered heterostructure
CN101106068B (en) * 2006-07-13 2010-12-15 中芯国际集成电路制造(上海)有限公司 Method for making semiconductor material form mutual built-in pattern

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063916A1 (en) * 1981-04-21 1982-11-03 Nippon Telegraph And Telephone Corporation Semiconductor intregrated circuits and manufacturing process thereof
GB2306050A (en) * 1995-10-05 1997-04-23 Nec Corp Planarizing filled trench isolation semiconductor devices
JPH10189712A (en) * 1996-12-20 1998-07-21 Samsung Electron Co Ltd Method for isolating element of semiconductor device
EP0954022A1 (en) * 1998-01-13 1999-11-03 Texas Instruments Incorporated Method for providing shallow trench isolation of transistors
US6001696A (en) * 1997-05-27 1999-12-14 Samsung Electronics Co., Ltd. Trench isolation methods including plasma chemical vapor deposition and lift off

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063916A1 (en) * 1981-04-21 1982-11-03 Nippon Telegraph And Telephone Corporation Semiconductor intregrated circuits and manufacturing process thereof
GB2306050A (en) * 1995-10-05 1997-04-23 Nec Corp Planarizing filled trench isolation semiconductor devices
JPH10189712A (en) * 1996-12-20 1998-07-21 Samsung Electron Co Ltd Method for isolating element of semiconductor device
US6001696A (en) * 1997-05-27 1999-12-14 Samsung Electronics Co., Ltd. Trench isolation methods including plasma chemical vapor deposition and lift off
EP0954022A1 (en) * 1998-01-13 1999-11-03 Texas Instruments Incorporated Method for providing shallow trench isolation of transistors

Also Published As

Publication number Publication date
GB2352874A (en) 2001-02-07
GB0014544D0 (en) 2000-08-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20050614