GB2350720A - Coupling terminals of a lead frame - Google Patents

Coupling terminals of a lead frame Download PDF

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Publication number
GB2350720A
GB2350720A GB9913063A GB9913063A GB2350720A GB 2350720 A GB2350720 A GB 2350720A GB 9913063 A GB9913063 A GB 9913063A GB 9913063 A GB9913063 A GB 9913063A GB 2350720 A GB2350720 A GB 2350720A
Authority
GB
United Kingdom
Prior art keywords
lead frame
terminals
lead
coupling
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9913063A
Other versions
GB9913063D0 (en
Inventor
Ming-Tung Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS COMP TECHNOLOGY SYSTEM COR
CTS Computer Tech System Corp
Original Assignee
CTS COMP TECHNOLOGY SYSTEM COR
CTS Computer Tech System Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS COMP TECHNOLOGY SYSTEM COR, CTS Computer Tech System Corp filed Critical CTS COMP TECHNOLOGY SYSTEM COR
Priority to DE29909792U priority Critical patent/DE29909792U1/en
Priority to GB9913063A priority patent/GB2350720A/en
Publication of GB9913063D0 publication Critical patent/GB9913063D0/en
Priority to FR9911054A priority patent/FR2798248B3/en
Publication of GB2350720A publication Critical patent/GB2350720A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

A lead board 4 is provided with two rows of regularly aligned recesses or apertures 41 in edges of copper strips 43. The recesses/apertures are formed with a narrow neck portion 42. The front ends 32 of lead frame terminals are correspondingly shaped. Whe the terminals are inserted into the lead board recesses/apertures they interlock to prevent possible displacemnt during soldering or mould pressing. The increased are also may nelp heat dissipation. The front ends of the terminals may be of any shape.

Description

2350720 COUPLING TERMINALS OF LEAD FRAME
BACKGROUND OF THE INVENTION
1. Field of the invention
This invention relates to a structure of coupling terminals of lead frame, particularly to a structure of coupling terminals of lead frame that can be accurately and reliably coupled with the circuit on chip after soldered, so that a better yield in IC (integrated circuit) fabrication is obtainable.
2. Description of the prior art
A usual package procedure of chopped IC chips include the following steps:
1. Preparing lead frame tape, which is usually formed with two lateral rows of terminals aligned regularly serving for IC's external conductive pins, with a central empty space in each frame for accommodating a patterned chip and a lead board.
2. Wire bonding with silver strings by a wire bonder to connect the patterned chip with the lead board 3. Soldering the terminals of the lead frame to conductive strips of the lead board correspondingly.
4. Packaging with colloidal materials, epoxy resin for example, to form casing, wherein the exposing portion of terminals in the lead frame will be mold- pressed to discard unnecessary portion to form an integral unit IC.
As shown in Fig. I - a structural perspective view and a partially enlarged view of coupling terminals of a conventional lead frame tape, the terminals I I (as shown in Fig. 1 (13)) are aligned regularly in two lateral rows, wherein an angular end 12 is formed at each terminal. Dips 21 are disposed in two lateral edges of a lead board 2 corresponding to the terminals 11 for the latter to be inserted in the former (as shown in Fig. I(A)), and soldered together with copper strips 23 on the lead board 2. Such a construction is considered a relatively simpler combination that the terminals I I may displace from the dips 21 during assembling, packaging, or mold pressing of the terminals to incur open connection or poor contact after soldered, so that the yield may be retarded.
In view of the above-described imperfection, after years of constant effort in research, the inventor of this invention has consequently developed and proposed this improved structure pertaining to the subject matter.
SUMMARY OF THE INVENTION
This invention is proposed to provide an improved structure of coupling terminals of lead frame that can be positioned accurately and held persistently to facilitate assembling and soldering.
Another object of this invention is to provide an improved structure of coupling terminals of lead frame to keep tight contact between the terminals and a lead board so as to improve yield of IC fabrication.
A further object of this invention is to provide an improved structure of coupling terminals of lead frame that can provide a larger contact area for a better heat dissipation and conductivity.
With abovesaid merits, this invention is to be used in chip mounting process before packaging. Plural circular dips regularly aligned at two lateral edges on a lead board are shrunk to form a neck channel at each neck portion, and coupling ends of a lead frame are made commensurably with foregoing circular dips geometrically, wherein each front end of the coupling terminals is shrunk to form a neck portion corresponding to the circular dip. Therefore, the coupling terminals can be exactly inserted in the circular dips and positioned accurately and persistently to facilitate soldering without undesirable displacement of the terminals, and also to assure an excellent contact of the terminals and the lead board in mold-pressing operation for raising fabrication yield.
Moreover, the front end of each coupling terminal and each corresponding dip can be made in diversified shapes, for example, triangle, rectangle, etc.
BRI1EF DESCRIPTION OF THE DRAWINGS
For a better understanding to the present invention, together with further advantages or features thereof, at least one preferred embodiment will be elucidated below with reference to the annexed drawings in which:
Fig. 1 is a schematic perspective and partially enlarged view showing plural coupling terminals of a lead frame in a conventional structure; Fig. I(A) is a schematic partially enlarged view of a lead board in the conventional structure; Fig. I(B) is a schematic partially enlarged view of the lead frame in the conventional structure; Fig. 2 is a schematic perspective and partially enlarged view showing a structure of coupling terminals of a lead frame of this invention; Fig. 2(A) is a structural schematic partially enlarged view of a lead board of this invention; Fig. 2(B) is a structural schematic partially enlarged view of the lead frame of this invention; Fig 3(A) is a top view showing the structure of coupling terminals of the lead frame of this invention; Fig. 3(B) is a cutaway sectional view of a scarf joint of a terminal in the lead 2 frame and a dip in the lead board of this invention, Fig. 4 shows a 2nd embodiment of this invention, Fig. 5 shows a 3rd embodiment of this invention; Fig, 6 shows a 4th embodiment of this invention; Fig. 7 shows a 5th embodiment of this invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Fig. 2 indicates a schematic perspective view and partially enlarged view (A) and (B) showing a structure of coupling terminals of lead frame of this invention for chip mounting before packaging. This invention mainly comprises a lead frame 3 and a lead board 4, wherein an empty space is reserved in the lead frame 3 for accommodating the lead board 4; plural coupling terminals 31 are aligned regularly in two rows at lateral edges of the lead frame 3; a coupling front end 32 of the coupling terminal 31 is made in arc or circular shape, and a shrunk neck portion 33 (Fig. 2(B)) is formed between the front end 32 and the body of coupling - plural circular dips 41 are aligned regularly in two rows at lateral terminal 311 edges of the lead board 4, an open gap of the circular dip 41 is shrunk to form a neck channel 42 (Fig. 2(A)).
When the terminals 31 of the lead frame 3 are combined with the circular dips 41 of the lead board 4, the front end 32 and the shrunk neck portion 33 of the terminal 31 are inserted exactly in the circular dip 41.and the neck channel 42 of the lead board 4 to form a soldering point with lead strip 43, so that relative displacement between the lead frame 3 and the lead board 4 can be avoided when soldering or moving.
As shown in Fig. 3(A) and 3(B) - a top view and a cutaway sectional view of a stove combination of this invention, those two lateral rows of regularly aligned circular dips in the lead board 4 can be designed in a through-hole type or stove (sunk) type, especially in the latter form, th e front end 32 of the terminal 31 will be sunk in the circular dip 41 to obtain a better positioning and persistent holding effect advantageous in assembling.
In virtue of abovesaid combination mechanism of the lead frame 3 and the lead board 4, any possible relative displacement is avoidable when soldering or moving as mentioned, further, it can assure intact contact of internal terminals of an IC to the lead board 4 in pin-molding after packaging for yield improvement.
Besides, contact area between the front end 32 of the terminal 31 and a lead strip 43 around the circular dip 41 has been expanded to improve heat dissipation and conductivity.
Fig. 4 shows a 2nd embodiment of this invention. When a triangular front 3 end 32a of a terminal 31a in a lead frame 3a is inserted in a triangular dip 41a formed in two lateral rows in a lead board 4a, the front end 32a and a shrunk neck portion 33a are inserted in the triangular dip 41a and a neck channel 42a respectively to facilitate an accurate and stable combination of the lead frame 3a to the lead board 4a that may not be detached easily.
As shown in Fig. 5 - a 3rd embodiment of this invention, when a doublearc front end 32h of a terminal 31h in a lead frame 3b is inserted in a double-arc dip 41b formed in two lateral rows in a lead board 4b, the front end 32b and a shrunk neck portion 33b are inserted in the double-arc dip 41b and a neck channel 42b respectively to facilitate an accurate and stable combination of the lead frame 3b to the lead board 4b that may not be detached easily.
As shown in Fig. 6 - a 4th embodiment of this invention, when an oval front end 32c of a terminal 31c in a lead frame 3c is inserted in a oval dip 41c formed in two lateral rows in a lead board 4c, the front end 32c and a shrunk neck portion 33c are inserted in the oval dip 41c and a neck channel 42c respectively to facilitate an accurate and stable combination of the lead frame 3c to the lead board 4c that may not be detached easily.
As shown in Fig. 7 - a 5th embodiment of this invention, when an rectangular front end 32d of a terminal 31d in a lead frame 3d is inserted in a oval dip 41d formed in two lateral rows in a lead board 4d, the front end 32d and a shrunk neck portion 33d are inserted in the oval dip 41d and a neck channel 42d respectively to facilitate an accurate and stable combination of the lead frame 3d to the lead board 4d that may not be detached easily.
In Fig. 4 through Fig. 7, the mentioned shape of the terminal and dip to be combined may be changed into different geometrical shapes, a rhombus for example, with the same efficacy obtainable.
The advantages of this invention in comparison with conventional skills may be summarized as the following:
1. BY using the structure of coupling terminals of the lead frame of this invention, a precise and persistent combination with the lead board is obtainable to facilitate an assembling process.
2. By using the structure of coupling terminals of the lead frame of this invention, a compact contact between the terminals and the lead board is obtainable for raising fabrication yield of IC.
3. By using the structure of coupling terminals of the lead frame of this invention, the insertion portion may be diversified geometrically according to requirements.
4. By using the structure of coupling terminals of the lead frame of this 4 invention, the contact area of compact combination of the dips in the lead board and terminals in the lead frame can be expanded o obtain a better efficiency of heat dissipation.
Although, this invention has been described in terms of preferred embodiments, it is apparent that numerous variations and modifications may be made without departing from the true spirit and scope thereof, as set forth in the following claims.

Claims (11)

What is claimed is:
1. A structure of coupling terminals of lead frame, comprising:
a lead frame, wherein an empty space is reserved for accommodating a lead board, a plurality of regularly aligned terminals in two rows is arranged laterally to said lead frame, a coupling front end of each said terminal is made in a circle geometrically; and a shrunk neck portion is formed between said coupling front end and the body of said terminal, a lead board provided with a plurality of circular dips aligned regularly in positions of copper strips and in intervals corresponding to said terminals, wherein an open end of said circular dip is shrunk to form a neck channel; and an accurately positioned and reliable combination being attainable by means of foregoing construction when said terminals are inserted in said dips.
2. The structure of coupling terminals of lead frame of claim 1, wherein said circular dips disposed laterally to said lead board may be made in a stove type.
133. The structure of coupling terminals of lead frame of claim 1, wherein said circular dips disposed laterally to said lead board may be made in a through-hole type.
4. The structure of coupling terminals of lead frame of claim 1, wherein said coupling front end of each said terminal may be made in shape of a triangle.
5. The structure of coupling terminals of lead frame of claim 1, wherein each said circular dip may be made in shape of a triangle.
6. The structure of coupling terminals of lead frame of claim 1, wherein said coupling front end of each said terminal may be made in shape of plural segmental arcs.
7. The structure of coupling terminals of lead fTame of claim 1, wherein each said circular dip in said lead board may be made in shape of plural segmental arcs.
8. The structure of coupling terminals of lead frame of claim 1, wherein said coupling front end of each said terminal may be made in shape of a rectangle.
9. The structure of coupling terminals of lead frame of claim 1, wherein each said circular dip in said lead board may be made in shape of a rectangle.
10. The structure of coupling terminals of lead frame of claim 1, wherein said coupling front end of each said terminal may be made in shape of a spoon.
11. The structure of coupling terminals of lead frame of claim 1, wherein each said circular dip in said lead board may be made in shape of a spoon.
3 )5 6
GB9913063A 1999-06-04 1999-06-04 Coupling terminals of a lead frame Withdrawn GB2350720A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE29909792U DE29909792U1 (en) 1999-06-04 1999-06-04 Connection clamp for cable frame
GB9913063A GB2350720A (en) 1999-06-04 1999-06-04 Coupling terminals of a lead frame
FR9911054A FR2798248B3 (en) 1999-06-04 1999-09-03 COUPLING TERMINALS OF A CONNECTING SPIDER

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE29909792U DE29909792U1 (en) 1999-06-04 1999-06-04 Connection clamp for cable frame
GB9913063A GB2350720A (en) 1999-06-04 1999-06-04 Coupling terminals of a lead frame
FR9911054A FR2798248B3 (en) 1999-06-04 1999-09-03 COUPLING TERMINALS OF A CONNECTING SPIDER

Publications (2)

Publication Number Publication Date
GB9913063D0 GB9913063D0 (en) 1999-08-04
GB2350720A true GB2350720A (en) 2000-12-06

Family

ID=27220255

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9913063A Withdrawn GB2350720A (en) 1999-06-04 1999-06-04 Coupling terminals of a lead frame

Country Status (3)

Country Link
DE (1) DE29909792U1 (en)
FR (1) FR2798248B3 (en)
GB (1) GB2350720A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102422128A (en) * 2009-05-13 2012-04-18 罗伯特·博世有限公司 Positioning system for a traveling transfer system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0610971A1 (en) * 1988-08-06 1994-08-17 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
US5643835A (en) * 1992-12-18 1997-07-01 Lsi Logic Corporation Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0610971A1 (en) * 1988-08-06 1994-08-17 Kabushiki Kaisha Toshiba Semiconductor device having an improved lead arrangement and method for manufacturing the same
US5643835A (en) * 1992-12-18 1997-07-01 Lsi Logic Corporation Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102422128A (en) * 2009-05-13 2012-04-18 罗伯特·博世有限公司 Positioning system for a traveling transfer system

Also Published As

Publication number Publication date
GB9913063D0 (en) 1999-08-04
FR2798248A3 (en) 2001-03-09
FR2798248B3 (en) 2001-08-10
DE29909792U1 (en) 1999-08-12

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)