GB2306509A - concentration control apparatus - Google Patents

concentration control apparatus Download PDF

Info

Publication number
GB2306509A
GB2306509A GB9622144A GB9622144A GB2306509A GB 2306509 A GB2306509 A GB 2306509A GB 9622144 A GB9622144 A GB 9622144A GB 9622144 A GB9622144 A GB 9622144A GB 2306509 A GB2306509 A GB 2306509A
Authority
GB
United Kingdom
Prior art keywords
solution
feeding pump
concentration
subsidiary
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9622144A
Other languages
English (en)
Other versions
GB9622144D0 (en
Inventor
Kil Nam Hwang
Keun Chang Cho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anam S & T Co Ltd
Original Assignee
Anam S & T Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anam S & T Co Ltd filed Critical Anam S & T Co Ltd
Publication of GB9622144D0 publication Critical patent/GB9622144D0/en
Publication of GB2306509A publication Critical patent/GB2306509A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
GB9622144A 1995-10-27 1996-10-24 concentration control apparatus Withdrawn GB2306509A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950037514A KR100201377B1 (ko) 1995-10-27 1995-10-27 다성분 도금용액의 농도조절장치

Publications (2)

Publication Number Publication Date
GB9622144D0 GB9622144D0 (en) 1996-12-18
GB2306509A true GB2306509A (en) 1997-05-07

Family

ID=19431538

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9622144A Withdrawn GB2306509A (en) 1995-10-27 1996-10-24 concentration control apparatus

Country Status (4)

Country Link
JP (1) JPH09249996A (ko)
KR (1) KR100201377B1 (ko)
DE (1) DE19645148A1 (ko)
GB (1) GB2306509A (ko)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649509A (en) * 1969-07-08 1972-03-14 Buckbee Mears Co Electrodeposition systems
US4055751A (en) * 1975-05-13 1977-10-25 Siemens Aktiengesellschaft Process control system for the automatic analysis and regeneration of galvanic baths
US4286965A (en) * 1979-03-21 1981-09-01 Siemens Aktiengesellschaft Control apparatus for automatically maintaining bath component concentration in an electroless copper plating bath
US4326940A (en) * 1979-05-21 1982-04-27 Rohco Incorporated Automatic analyzer and control system for electroplating baths
US4624857A (en) * 1984-02-03 1986-11-25 Schering Aktiengesellschaft Method for automatic control of galvanic deposition of copper coatings in galvanic acid copper baths
US4648043A (en) * 1984-05-07 1987-03-03 Betz Laboratories, Inc. Computerized system for feeding chemicals into water treatment system
US4674440A (en) * 1984-11-02 1987-06-23 Shipley Company Inc. Apparatus for automatically replenishing an electroless plating bath
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US5182131A (en) * 1985-02-28 1993-01-26 C. Uyemura & Co., Ltd. Plating solution automatic control
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649509A (en) * 1969-07-08 1972-03-14 Buckbee Mears Co Electrodeposition systems
US4055751A (en) * 1975-05-13 1977-10-25 Siemens Aktiengesellschaft Process control system for the automatic analysis and regeneration of galvanic baths
US4286965A (en) * 1979-03-21 1981-09-01 Siemens Aktiengesellschaft Control apparatus for automatically maintaining bath component concentration in an electroless copper plating bath
US4326940A (en) * 1979-05-21 1982-04-27 Rohco Incorporated Automatic analyzer and control system for electroplating baths
US4624857A (en) * 1984-02-03 1986-11-25 Schering Aktiengesellschaft Method for automatic control of galvanic deposition of copper coatings in galvanic acid copper baths
US4648043A (en) * 1984-05-07 1987-03-03 Betz Laboratories, Inc. Computerized system for feeding chemicals into water treatment system
US4674440A (en) * 1984-11-02 1987-06-23 Shipley Company Inc. Apparatus for automatically replenishing an electroless plating bath
US5182131A (en) * 1985-02-28 1993-01-26 C. Uyemura & Co., Ltd. Plating solution automatic control
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters

Also Published As

Publication number Publication date
JPH09249996A (ja) 1997-09-22
KR100201377B1 (ko) 1999-06-15
GB9622144D0 (en) 1996-12-18
DE19645148A1 (de) 1997-04-30
KR970023663A (ko) 1997-05-30

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)