GB2290414B - Wafer basket in wafer-holder box - Google Patents

Wafer basket in wafer-holder box

Info

Publication number
GB2290414B
GB2290414B GB9512022A GB9512022A GB2290414B GB 2290414 B GB2290414 B GB 2290414B GB 9512022 A GB9512022 A GB 9512022A GB 9512022 A GB9512022 A GB 9512022A GB 2290414 B GB2290414 B GB 2290414B
Authority
GB
United Kingdom
Prior art keywords
wafer
basket
holder box
holder
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9512022A
Other languages
English (en)
Other versions
GB9512022D0 (en
GB2290414A (en
Inventor
Masato Hosoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd, Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of GB9512022D0 publication Critical patent/GB9512022D0/en
Publication of GB2290414A publication Critical patent/GB2290414A/en
Application granted granted Critical
Publication of GB2290414B publication Critical patent/GB2290414B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
GB9512022A 1994-06-17 1995-06-14 Wafer basket in wafer-holder box Expired - Fee Related GB2290414B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6158228A JP2791971B2 (ja) 1994-06-17 1994-06-17 ウェーハ収納容器におけるウェーハバスケット

Publications (3)

Publication Number Publication Date
GB9512022D0 GB9512022D0 (en) 1995-08-09
GB2290414A GB2290414A (en) 1995-12-20
GB2290414B true GB2290414B (en) 1998-07-29

Family

ID=15667084

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9512022A Expired - Fee Related GB2290414B (en) 1994-06-17 1995-06-14 Wafer basket in wafer-holder box

Country Status (6)

Country Link
JP (1) JP2791971B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100332719B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE19521575C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2725185B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB2290414B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW299485B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW296361B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
GB2350604A (en) * 1999-06-03 2000-12-06 Horizon Biscuit Company Ltd Th Container
DE10046942A1 (de) * 2000-09-21 2002-04-25 Infineon Technologies Ag Verfahren zum Transport von Wafern
DE10104313C1 (de) * 2001-01-22 2002-08-08 Hunke & Jochheim Aufbewahrungsbehälter für Kassetten
TW511649U (en) * 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
TWI239931B (en) 2003-05-19 2005-09-21 Miraial Co Ltd Lid unit for thin plate supporting container and thin plate supporting container
DE10337570A1 (de) * 2003-08-14 2005-03-17 Infineon Technologies Ag Transportvorrichtung
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
CN102339777B (zh) * 2010-07-15 2013-09-11 家登精密工业股份有限公司 晶圆盒的晶圆限制件
DE102010040918B4 (de) * 2010-09-16 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Behälter zum Stapeln und Transportieren von Scheiben aus brüchigem Material
EP2682211A1 (en) 2011-02-28 2014-01-08 Tungaloy Corporation Guide pad, cutting tool body, and cutting tool
CN103402677B (zh) 2011-02-28 2015-11-25 株式会社钨钛合金 导向块、切削工具主体以及切削工具
KR101658631B1 (ko) 2014-04-03 2016-09-22 형제기계공업 주식회사 격벽을 이용한 제설장치
CN106784145B (zh) * 2016-12-23 2018-03-06 中赣新能源股份有限公司 一种硅片插片方法
CN116936432B (zh) * 2023-09-14 2024-01-02 常州银河世纪微电子股份有限公司 一种晶圆收纳盒、使用该收纳盒的取放装置及取放方法
CN119364745B (zh) * 2024-12-26 2025-04-01 深圳市奔强电路有限公司 一种电路板加工用堆叠电路板输送装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259607A (en) * 1991-09-12 1993-03-17 Fluoroware Inc Semiconductor wafer carrier

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648126A (en) * 1979-09-26 1981-05-01 Nec Kyushu Ltd Auxiliary carrier for replacing wafers
JPS60160539U (ja) * 1984-04-02 1985-10-25 ソニー株式会社 半導体ウエハ等収納容器
US4687097A (en) * 1984-12-11 1987-08-18 Empak, Inc. Wafer processing cassette
US4724963A (en) * 1985-02-20 1988-02-16 Empak, Inc. Wafer processing cassette
US4684021A (en) * 1986-06-23 1987-08-04 Fluoroware, Inc. Bottom loading wafer carrier box
JPH0284319U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1988-12-20 1990-06-29
EP0579099B1 (en) * 1992-07-08 1997-01-02 Daifuku Co., Ltd. Container for plate-like objects

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259607A (en) * 1991-09-12 1993-03-17 Fluoroware Inc Semiconductor wafer carrier

Also Published As

Publication number Publication date
JP2791971B2 (ja) 1998-08-27
FR2725185A1 (fr) 1996-04-05
JPH088332A (ja) 1996-01-12
DE19521575C2 (de) 2002-04-18
GB9512022D0 (en) 1995-08-09
FR2725185B1 (fr) 1997-10-17
GB2290414A (en) 1995-12-20
TW299485B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1997-03-01
KR960002468A (ko) 1996-01-26
DE19521575A1 (de) 1995-12-21
KR100332719B1 (ko) 2002-10-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090614