GB2260925A - Component mounting socket - Google Patents

Component mounting socket Download PDF

Info

Publication number
GB2260925A
GB2260925A GB9221648A GB9221648A GB2260925A GB 2260925 A GB2260925 A GB 2260925A GB 9221648 A GB9221648 A GB 9221648A GB 9221648 A GB9221648 A GB 9221648A GB 2260925 A GB2260925 A GB 2260925A
Authority
GB
United Kingdom
Prior art keywords
socket
socket body
electronic component
suction plate
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9221648A
Other versions
GB9221648D0 (en
GB2260925B (en
Inventor
Shinichi Matsui
Naoshi Tsunehiro
Naotomo Adachi
Mitsuko Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of GB9221648D0 publication Critical patent/GB9221648D0/en
Publication of GB2260925A publication Critical patent/GB2260925A/en
Application granted granted Critical
Publication of GB2260925B publication Critical patent/GB2260925B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046J-shaped leads

Abstract

A socket (10) can be mounted on a printed circuit board by the use of a suction nozzle. A suction plate (4) is provided for engagement by such suction nozzle and after solder mounting is severed from the socket to clear the centre space for a thin compact component. The socket body (1) has electrical contacts (3) and is in the form of a square frame, a suction plate (4) being formed integrally on an upper end portion of the socket body (1) in a diagonal direction through thinned portions (8) which are readily cut. <IMAGE>

Description

SOCKET BACKGROUND OF THE INVENTION This invention retakes to a socket for containing an electronic component, such as an IC package and a ROM, to connect the same to a circuit.
One conventional socket of the type described is shown in Figs. 3A to 3C. Fig. 3A is a plan view, Fig. 3B is a cross-sectional view, and Fig. 3C is a perspective view.
As shown in Figs. 3A to 3C, a socket body 31 comprises a square frame 32, and a bottom plate 33 integrally formed on the inside of the frame 32 to form a containing space 34. Provided on the square frame 32 are electrical contacts 35 which are adapted to be in contact with terminals of an electronic component, such as an IC package, contained in the containing space 34, so as to connect this electronic component to a circuit.
For mounting an electronic component on a printed circuit board 37 by the use of the above socket 36 of a square shape, the bottom plate 33 of the socket 36 is held by a suction nozzle of a mounting device under the influence of suction, and then the socket 36 is mounted on the printed circuit board 37. Then, the electronic component is contained in the containing space 34, so that its terminals are held in contact with the contacts 35, thereby connecting this electronic component to a circuit.
Recently, it has been desired to provide a thin, compact, lightweight design of an electronic component. There is known a socket as shown in Figs. 4A to 4C which is suited for such an electronic component.
Fig. 4A is a plan view, Fig. 4B is a cross-sectional view, and Fig. 4C is a perspective view.
As shown in Figs. 4A to 4C, a socket body 31' of this conventional socket 36' is composed solely of a square frame 32'. Thus, this socket 36' differs from the above conventional socket 36 only in that the bottom plate 33 is not provided.
The socket 36' cannot be held by a suction nozzle, and therefore is mounted on a printed circuit board 37 either manually or by a chuck. However, in the former method, since the thin-type socket 36' is manually held, and is placed on the printed circuit board 37, mounting variations are relatively large, so that the mounting precision is inferior. On the other hand, in the latter method, the chuck corresponding in size to the socket body must be prepared, which is not economical.
SUMMARY OF THE INVENTION With the above problems in view, it is an object of this invention to provide a socket which can be mounted on a printed circuit board by the use of a suction nozzle although a socket body is so formed as to be suited for an electronic component of a thin, compact, lightweight design, thereby enhancing the mounting precision as well as the economy.
According to the present invention, there is provided a socket for containing an electronic component, comprising: a frame-like socket body having electrical contacts; and a suction plate formed integrally on the socket body in such a manner that the suction plate can be cut off from the socket body; whereby by cutting the suction plate off from the socket body, an open containing space for containing the electronic component is formed through the socket body.
Preferably, the suction plate should be disposed diagonally with respect to the socket body, and connected to an upper end portion of the socket body.
Therefore, in the present invention, the socket can be mounted on a printed circuit board by holding the suction plate by the suction nozzle, and thereafter the soldering is carried out, and then the suction plate is cut off from the socket body to provide the containing space, and the electronic component is contained in this containing space so that terminals of this electronic component are held in contact with the electrical contacts of the socket body, thereby connecting the electronic component to the circuit.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a plan view of a socket according to the present invention; Fig. 1B is a partly-broken, front-elevational view of the socket; Fig. 1C is a fragmentary cross-sectional view of the socket, showing a portion of connection between a socket body and a suction plate; Fig. 2A is a perspective view showing the manner of mounting the socket on a printed circuit board by the use of a suction nozzle; Fig. 2B is a perspective view showing the manner of cutting off the suction plate of the socket; Fig. 2C is a perspective view of the socket with the suction plate removed; Fig. 3A is a plan view of one conventional socket; Fig. 3B is a cross-sectional view of the conventional socket; Fig. 3C is a perspective view of the conventional socket; Fig. 4A is a plan view of another conventional socket;; Fig. 4B is a cross-sectional view of the conventional socket of Fig. 4A; and Fig. 4C is a perspective view of the conventional socket of Fig. 4A.
DESCRIPTION OF THE PREFERRED EMBODIMENT One preferred embodiment of the present invention will now be described with reference to the drawings.
As shown in Figs. 1A to 1C, a socket body 1 of a socket 10 is in the form of a square frame, and a containing space 2 is formed through the socket body 1 from its upper side to its lower side. Electrical contacts 3 are provided on the socket body 1, and the contacts 3 are adapted to be in contact with terminals of an electronic component, such as an IC package, received in the containing space 2 so as to connect this electronic component to a circuit. A suction plate 4 for mounting the socket 10 on a printed circuit board 12 is formed integrally on the upper end portion of the socket body 1 in such a manner that the suction plate 4 can be cut off from the suction body 1.As one example, the suction plate 4 has a generally circular suction portion 5 at its central portion, and a pair of elongate connecting portions 6 extending respectively from the opposite sides of the suction portion 5. The suction plate 4 is disposed diagonally with respect to the socket body 1, and outer ends of the two connecting portions 6 are integrally connected respectively to the inner sides of diagonally-disposed corners of the socket body 1 at the upper end of the socket body 1. A central portion of the outer end of each of the two connecting portions 6 is cut off to form a hole 7 which allows a distal end of a cutter 13 to pass therethrough. The outer end of each of the two connecting portions 6 is reduced in thickness to provide thinned portions 8 for facilitating the cutting of the connecting portion 6 from the socket body 1.Recesses 9 for taking out the electronic component are provided respectively in the diagonally-disposed corners of the socket body 1.
The manner of mounting the electronic component on the printed circuit board 12 by the use of the square socket 10 of the above construction will now be described with reference to Figs. 2A to 2C.
First, as shown in Fig. 2A, the suction portion 5 of the suction plate 4 of the socket 10 is held by a suction nozzle 11 of a mounting device under the influence of suction, and in this condition, the socket 10 is mounted on the printed circuit board 12 as shown in Figs. 2B and 1B. Thereafter, the contacts 3 are soldered to the printed circuit board. Then, the thinned portions 8 (see Figs. 1A and 1C) of the connecting portions 6 are cut off from the socket body 1 (see Fig. 2B), and as shown in Fig. 2C, the suction plate 4 is removed from the socket body 1, thereby providing the open containing space 2 through the socket body 1. Then, the electronic component is contained in the containing space 2 of the socket body 1 so that terminals of this electronic component are held in contact with the contacts 3 (see Figs. 1A and 1B), thereby connecting the electronic component to the circuit.
Thus, the electronic component is contained in the open containing space 2 formed through the socket body 1, and therefore the socket body 1 can be made thinner, and by doing so, the socket body can be suited for the thin, compact and lightweight electronic component.
As described above, in the present invention, the suction plate for mounting the socket on the printed circuit board is formed integrally on the socket body, having the electrical contacts, in such a manner that the suction plate can be cut off from the socket body, and by cutting the suction plate off from the socket body, the open containing space for containing the electronic component is formed through the socket body.
With this construction, the socket can be mounted on the printed circuit board by holding the suction plate by the suction nozzle, and thereafter the soldering is carried out, and then the suction plate is cut off from the socket body to provide the containing space, and the electronic component is contained in this containing space, so that terminals of this electronic component are held in contact with the electrical contacts of the socket body, thereby connecting the electronic component to the circuit. Thus, the socket can be mounted on the printed circuit board by the use of the suction nozzle although a socket body is so formed as to be suited for the electronic component of a thin, compact, lightweight design, thereby enhancing the mounting precision as well as the economy.
Further, since the suction plate is provided diagonally with respect to the socket body, the suction plate can be easily cut off from the socket body.

Claims (3)

WHAT IS CLAIMED IS:
1. A socket for containing an electronic component, comprising: a frame-like socket body having electrical contacts; and a suction plate formed integrally on said socket body in such a manner that said suction plate can be cut off from said socket body; whereby by cutting said suction plate off from said socket body, an open containing space for containing the electronic component is formed through said socket body.
2. A socket according to claim 1, in which said socket body has a generally square shape, said suction plate being disposed diagonally with respect to said socket body, and connected to an upper end portion of said socket body.
3. A socket as hereinbefore described with reference to figures 1 and 2 of the accompanying drawings.
GB9221648A 1991-10-21 1992-10-15 Socket Expired - Fee Related GB2260925B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3272244A JPH05114445A (en) 1991-10-21 1991-10-21 Socket

Publications (3)

Publication Number Publication Date
GB9221648D0 GB9221648D0 (en) 1992-11-25
GB2260925A true GB2260925A (en) 1993-05-05
GB2260925B GB2260925B (en) 1994-07-13

Family

ID=17511145

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9221648A Expired - Fee Related GB2260925B (en) 1991-10-21 1992-10-15 Socket

Country Status (2)

Country Link
JP (1) JPH05114445A (en)
GB (1) GB2260925B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003019736A1 (en) * 2001-08-27 2003-03-06 Moldec Co., Ltd. Method for mounting socket, socket, and tape for mounting socket

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5303772B2 (en) * 2007-12-27 2013-10-02 日本電子材料株式会社 Contact structure and contact mounting method
JP5129372B1 (en) * 2011-08-01 2013-01-30 イリソ電子工業株式会社 Electrical connection terminal and mounting method thereof
JP6553878B2 (en) * 2015-01-30 2019-07-31 日本航空電子工業株式会社 connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003019736A1 (en) * 2001-08-27 2003-03-06 Moldec Co., Ltd. Method for mounting socket, socket, and tape for mounting socket

Also Published As

Publication number Publication date
GB9221648D0 (en) 1992-11-25
GB2260925B (en) 1994-07-13
JPH05114445A (en) 1993-05-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19961015