GB2205053A - Method and arrangement for interconnection of semiconductor devices - Google Patents

Method and arrangement for interconnection of semiconductor devices Download PDF

Info

Publication number
GB2205053A
GB2205053A GB08712311A GB8712311A GB2205053A GB 2205053 A GB2205053 A GB 2205053A GB 08712311 A GB08712311 A GB 08712311A GB 8712311 A GB8712311 A GB 8712311A GB 2205053 A GB2205053 A GB 2205053A
Authority
GB
United Kingdom
Prior art keywords
wire
semiconductor devices
bonding
interconnection
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08712311A
Other languages
English (en)
Other versions
GB8712311D0 (en
Inventor
Vyacheslav Gennadievich Sizov
Valery Alexandrovich Kalachev
Alexandr Anatolievich Gulyaev
Vitaly Georgievich Melnik
Zinovy Mikhailovich Slavinsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CH1990/87A priority Critical patent/CH673908A5/de
Application filed by Individual filed Critical Individual
Priority to GB08712311A priority patent/GB2205053A/en
Priority to DE19873717856 priority patent/DE3717856A1/de
Priority to FR878707595A priority patent/FR2618020B1/fr
Publication of GB8712311D0 publication Critical patent/GB8712311D0/en
Publication of GB2205053A publication Critical patent/GB2205053A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
GB08712311A 1987-05-26 1987-05-26 Method and arrangement for interconnection of semiconductor devices Withdrawn GB2205053A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1990/87A CH673908A5 (https=) 1987-05-26 1987-05-22
GB08712311A GB2205053A (en) 1987-05-26 1987-05-26 Method and arrangement for interconnection of semiconductor devices
DE19873717856 DE3717856A1 (de) 1987-05-26 1987-05-27 Verfahren zur montage von halbleitergeraeten und einrichtung zu dessen durchfuehrung
FR878707595A FR2618020B1 (fr) 1987-05-26 1987-05-29 Procede de montage de dispositifs semi-conducteurs et dispositif pour la realisation de ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08712311A GB2205053A (en) 1987-05-26 1987-05-26 Method and arrangement for interconnection of semiconductor devices

Publications (2)

Publication Number Publication Date
GB8712311D0 GB8712311D0 (en) 1987-07-01
GB2205053A true GB2205053A (en) 1988-11-30

Family

ID=10617902

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08712311A Withdrawn GB2205053A (en) 1987-05-26 1987-05-26 Method and arrangement for interconnection of semiconductor devices

Country Status (4)

Country Link
CH (1) CH673908A5 (https=)
DE (1) DE3717856A1 (https=)
FR (1) FR2618020B1 (https=)
GB (1) GB2205053A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311991A (ja) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh ワイヤボンディング接合部を検査するための方法および装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005118203A1 (de) * 2004-06-01 2005-12-15 Hesse & Knipps Gmbh Verfahren und vorrichtung zur prüfung einer drahtbondverbindung
CN114473280B (zh) * 2022-02-23 2023-11-24 广西桂芯半导体科技有限公司 一种芯片封装焊线装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1502965A (en) * 1974-05-21 1978-03-08 Philips Ltd Provision of wire connections for semiconductor devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU740448A1 (ru) * 1978-04-03 1980-06-15 Предприятие П/Я Р-6495 Автоматическа установка дл присоединени проволочных выводов внахлестку
SU821100A1 (ru) * 1979-02-23 1981-04-15 Предприятие П/Я Р-6495 Установка дл присоединени про-ВОлОчНыХ ВыВОдОВ
JPS58192688A (ja) * 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1502965A (en) * 1974-05-21 1978-03-08 Philips Ltd Provision of wire connections for semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311991A (ja) * 2003-04-04 2004-11-04 Hesse & Knipps Gmbh ワイヤボンディング接合部を検査するための方法および装置

Also Published As

Publication number Publication date
FR2618020B1 (fr) 1991-04-19
DE3717856A1 (de) 1988-12-08
CH673908A5 (https=) 1990-04-12
FR2618020A1 (fr) 1989-01-13
GB8712311D0 (en) 1987-07-01

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)